Technical distribution of industrial adhesives, encapsulants, sinter materials and UV curing equipment
aarema Technologies GmbH
Dietzenbach · MumbaiNew on Amplifa
About aarema Technologies
aarema Technologies GmbH, based in Dietzenbach, is a technical distribution partner for industrial adhesives, encapsulants and UV curing equipment. The company supports customers from project start to final qualification and assists with adhesive selection, surface pretreatment, the selection of suitable dispensing systems as well as the curing equipment. Through the development departments and laboratory capacities of its partners, aarema offers tailored adhesive solutions. The product portfolio includes underfill materials, UV-curing adhesives based on epoxy, acrylate and polyurethane, thermally and electrically conductive adhesives, thermal interface pastes and gap fillers, structural adhesives, SMD adhesives, sinter materials, casting resins as well as inks for printed electronics. Industries served include automotive, electronics, aerospace/defence, optics and optoelectronics, consumer electronics and medical technology. Through its branch aarema Technologies LLP in Mumbai, the company is also represented in India.
- Site
- Dietzenbach
- Processes
- Adhesive selection consulting / technical expertise for industrial adhesives, Surface pretreatment (consulting), Selection of dispensing systems (sales/consulting), UV curing equipment (technical distribution), Structural bonding (glass, plastic, metal, ceramics), UV-curing bonding (glass bonding, optical sensors, OLED), SMD bonding (dispensing, jetting, printing), Die-attach / sinter bonding (power semiconductors, LEDs)
- Materials
- Epoxy (underfills, casting resins, structural adhesives, sinter adhesives), Acrylates (UV adhesives), Polyurethanes (UV adhesives), Silicones, Silver filler / silver sinter paste (thermally/electrically conductive, >5 W/m·K), Non-silicone thermal interface pastes, Substrates: glass, plastic, metal, ceramics, Epoxy
- Industries
- Automotive, Electronics, Aerospace / Defence, Optics and Optoelectronics, Consumer Electronics, Medical Technology
- 01
Technical consulting on adhesive selection
- 02
Surface pretreatment
- 03
Selection of the dispensing system
- 04
Provision of the curing equipment (UV curing processes)
- 05
Support from project start to final qualification
Materials & Technologies
Epoxy
Base for underfills, casting resins, structural adhesives, die-attach and sinter adhesives in the electronics sector.
Acrylates
Base chemistry for UV-curing adhesives, among other things for glass bonding and optical sensors.
Polyurethanes
Base chemistry for UV-curing adhesives with high curing speed.
Silicones
Used as adhesives and sealants in the product portfolio.
Silver sinter paste / silver filler
Thermally and electrically conductive materials with thermal conductivity of over 5 W/m·K for die-attach applications.
Non-silicone thermal interface pastes
Avoidance of silicone contamination in semiconductors and automotive assembly.
Locations
Dietzenbach
DEHeadquarters / Sales
Mumbai
DEBranch office (aarema Technologies LLP)
Product Groups
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Adhesive selection consulting / technical expertise for industrial adhesivesEngineering | – | – | – | – | Epoxy, Acrylates, Polyurethanes, Silicones |
| Surface pretreatment (consulting)Surface | – | – | – | – | – |
| Selection of dispensing systems (sales/consulting)Assembly | – | – | – | – | – |
| UV curing equipment (technical distribution)Surface | – | – | – | – | – |
| Structural bonding (glass, plastic, metal, ceramics)Joining | – | – | – | – | Glass, Plastic, Metal, Ceramics |
| UV-curing bonding (glass bonding, optical sensors, OLED)Joining | – | – | – | – | Epoxies, Acrylates, Polyurethanes |
| SMD bonding (dispensing, jetting, printing)Joining | – | – | – | – | – |
| Die-attach / sinter bonding (power semiconductors, LEDs)Joining | – | – | – | – | Silver sinter paste, Epoxy-hybrid sinter adhesives |
| Encapsulation / casting resins (glob-top, dam and fill, underfill)Plastics | – | – | – | – | Epoxy |
| Ink printing for printed electronicsSurface | – | – | – | – | – |
2 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| UV curing equipment | – | – | – | – | – |
| Dispensing systems | – | – | – | – | – |
Additional services