Modular robotics and handling systems for wafers and substrates in high vacuum
Adenso Industrial Services GmbH
01468 Moritzburg (OT Boxdorf / Dresden) · DeutschlandNew on Amplifa
About Adenso
Adenso develops and manufactures modular robotics and handling systems for use in high vacuum, with a focus on the optics, solar and semiconductor industries. The portfolio includes the WHM WaferHandling.Module for wafer handling, the PHM Panel Handling Robot of the ULTRA STROKE type for thin, large-format substrates, and the adON module for heating, cooling and flipping processes (adHEAT). The hardware components are complemented by software solutions: adCONTROL as a cluster control system, adCLUSTER for multi-cluster applications and adVAC for vacuum pressure control. Via the ROBOT.Configurator, custom robotic solutions are created for research and production, including commissioning and service. The company from Moritzburg near Dresden (Silicon Saxony) serves not only semiconductor manufacturing but also the fields of quantum technology, advanced packaging and photonics (PIC), for example in the handling of UltraThin substrates.
- Site
- Moritzburg
- Processes
- WHM Wafer Handling Module (wafer handling in high vacuum), PHM Panel Handling Robot – ULTRA STROKE type (handling of thin, large-format substrates), adON: Heating, Cooling, Flipping Module, adCLUSTER / Advanced MULTI.CLUSTER Solutions (cluster systems), adCONTROL Cluster Control System (Software.Solutions), adVAC Advanced Vacuum Pressure Control, ROBOT.Configurator (custom robotic solutions for the optics, solar and semiconductor industries), Modular robotics in high vacuum
- Materials
- Wafers, Substrates (UltraThin), Wafer Handling Module (WHM), PHM Panel Handling Robot (ULTRA STROKE), Heating, Cooling, Flipping Module (adON/adHEAT)
- Industries
- Semiconductor industry, Optics, Solar, Quantum technology, Advanced Packaging, Photonics (PIC)
- 01
Development and design
- 02
Manufacturing and assembly
- 03
Software integration
- 04
Commissioning
- 05
Service
Products and Handled Materials
Wafer Handling Module (WHM)
Modular handling system for wafers in high vacuum.
PHM Panel Handling Robot (ULTRA STROKE)
Precise handling of thin, large-format substrates.
Heating, Cooling, Flipping Module (adON/adHEAT)
Module for heating, cooling and flipping processes in the process environment.
Site
Moritzburg (OT Boxdorf / Dresden)
DEHeadquarters, development and manufacturing
- Materials
- Wafers, substrates (UltraThin)
- WHM WaferHandling.Module
- PHM Panel Handling Robot ULTRA STROKE
- adHEAT / adON heating/cooling modules
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| WHM Wafer Handling Module (wafer handling in high vacuum)Assembly | – | – | – | – | Wafers, Substrates |
| PHM Panel Handling Robot – ULTRA STROKE type (handling of thin, large-format substrates)Assembly | – | – | – | – | Substrates, Wafers |
| adON: Heating, Cooling, Flipping ModuleAssembly | – | – | – | – | – |
| adCLUSTER / Advanced MULTI.CLUSTER Solutions (cluster systems)Assembly | – | – | – | – | – |
| adCONTROL Cluster Control System (Software.Solutions)Engineering | – | – | – | – | – |
| adVAC Advanced Vacuum Pressure ControlEngineering | – | – | – | – | – |
| ROBOT.Configurator (custom robotic solutions for the optics, solar and semiconductor industries)Assembly | – | – | – | – | – |
3 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Wafer Handling Module (WHM) | Adenso WHM WaferHandling.Module | – | High vacuum | – | Dresden/Moritzburg |
| Panel Handling Robot | Adenso PHM ULTRA STROKE | – | Large-format substrates | – | Dresden/Moritzburg |
| Heating/cooling modules | Adenso adHEAT / adON | – | – | – | Dresden/Moritzburg |
Additional services
History
- 26.06.2026
Announcement: UltraThin substrate handling for quantum, PIC and advanced packaging
- 24.11.2025
Presentation of the PHM Panel Handling Robot – ULTRA STROKE type
- 2025 (News)
adHEAT presentation at SEMICON EU 2025