ADLINK develops and manufactures Edge-AI computing platforms, embedded computer modules, and measurement and automation technology.
ADLINK Technology, Inc.
Taoyuan (Global Headquarters, Manufacturing) · Shanghai (Operations Center, Manufacturing) · Mannheim (EMEA Sales) · Deggendorf (Healthcare Business Center) · San Jose (USA) · Saint-Aubin (France)New on Amplifa
About ADLINK
Founded in 1995, ADLINK Technology is a globally active provider of Edge-AI computing solutions with more than 1,650 employees. The company develops and manufactures embedded computer modules (COM Express, COM-HPC, SMARC, OSM, ETX, Qseven), Edge-AI systems and GPU servers, industrial IoT gateways, measurement and test technology, and rugged computing platforms for railway applications. Through its Design & Manufacturing Services+ (DMS+) offering, ADLINK provides ODM and OEM customers with mechanical, thermal, system, BIOS, firmware and software development, simulation, as well as validation and verification in its own high-speed, environmental, mechanical and RF laboratories. Manufacturing ranges from layout and design through prototyping to volume production and takes place in its own plants at headquarters in Taoyuan (Taiwan, TPMC) and in Shanghai (China, SHOC). Worldwide, ADLINK operates five design centers, four operations and logistics centers, and 18 support offices, including the EMEA subsidiary ADLINK Technology GmbH in Mannheim and a Healthcare Business Center in Deggendorf.
- Site
- Mannheim
- Processes
- Design & Manufacturing Service (ODM/OEM, electronics manufacturing), Mechanical/ID Design, Thermal Design, Software Design, System Design, BIOS Design, Firmware Design, Simulation (High-Speed Simulation)
- Materials
- Design & Manufacturing Services, Validation & Verification, ESD-Protected Electronics Manufacturing, Long-Life-Cycle Management
- Certificates
- ISO 9001:2015, TL 9000, ISO 13485:2016, ISO 14001:2015, ISO 45001:2018, ISO/IEC 17025:2017, ISO/IEC 80079-34:2018, ISO 26262, ISO/IEC 27001:2022, ISO 50001:2018, ANSI/ESD S20.20:2021, ISO 9001, ISO 13485, ISO 14001, ISO 45001, ISO/IEC 17025 (Environmental Testing Lab), ISO/IEC 80079-34, ANSI/ESD S20.20, ISO/IEC 27001, ISO 50001
- Founded
- 1995
- Employees
- 1,650+
- Industries
- MedTech, Automation & Robotics, iRetail/Infotainment, Railway/Rugged & Mobility, Gaming, Semiconductor Manufacturing (AOI/Machine Vision)
- 01
Mechanical/ID and thermal design
- 02
System, BIOS, firmware and software design
- 03
Simulation as well as validation & verification
- 04
Certification support
- 05
Layout & design through prototyping to volume production
- 06
Smart manufacturing and quality inspection
- 07
Global warehousing, RMA/repair and lifecycle management
Development Services & Processes
Design & Manufacturing Services
ODM/OEM service from product development to series production with supply chain consolidation.
Validation & Verification
Own laboratories for high-speed simulation, signal verification, environmental, mechanical and RF testing.
ESD-Protected Electronics Manufacturing
Manufacturing according to ANSI/ESD S20.20:2021 for reliable electronics assembly.
Long-Life-Cycle Management
Availability and EOL management over lifecycles of 5 to 10 years.
Locations
Taoyuan
TWGlobal Headquarters and Taipei Manufacturing Center (TPMC)
- Lot size
- Prototype to volume production
- Materials
- Electronics
- Environmental testing laboratory (ISO/IEC 17025)
- High-speed simulation
- Signal verification
- RF laboratory
Shanghai
CNShanghai Operations Center (SHOC), Manufacturing
- Lot size
- Prototype to volume production
- Materials
- Electronics
Mannheim
DEEMEA Sales (ADLINK Technology GmbH)
Deggendorf
DEHealthcare Business Center
San Jose
USUSA Office (Ampro ADLINK Technology, Inc.)
Saint-Aubin (Paris)
FRFrance Office
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Design & Manufacturing Service (ODM/OEM, electronics manufacturing)Assembly | – | – | – | – | – |
| Mechanical/ID DesignEngineering | – | – | – | – | – |
| Thermal DesignEngineering | – | – | – | – | – |
| Software DesignEngineering | – | – | – | – | – |
| System DesignEngineering | – | – | – | – | – |
| BIOS DesignEngineering | – | – | – | – | – |
| Firmware DesignEngineering | – | – | – | – | – |
| Simulation (High-Speed Simulation)Testing | – | – | – | – | – |
| Validation & Verification (High-Speed Signal Verification, Environmental, Mechanical, RF Labs)Testing | – | – | – | – | – |
| Certification SupportTesting | – | – | – | – | – |
| Prototyping to Volume Production (Electronics, Layout & Design)Assembly | – | – | – | – | – |
| Test and Measurement / Automated Testing SolutionsTesting | – | – | – | – | – |
| Global Assembly and Installation Support, Warehousing, RMA & RepairAssembly | – | – | – | – | – |
Additional services
Reference customers
Quality & Certifications
ADLINK operates its own verification laboratories for high-speed simulation, signal verification, and environmental, mechanical and RF testing; the environmental testing laboratory is accredited to ISO/IEC 17025:2017. All manufacturing sites in Taoyuan and Shanghai are certified to ISO 9001 and additional standards.
| Evidence | Taoyuan | Shanghai |
|---|---|---|
| ISO 9001 | ||
| TL 9000 | ||
| ISO 13485 | ||
| ISO 14001 | ||
| ISO 45001 | ||
| ISO/IEC 17025 (Environmental Testing Lab) | ||
| ISO/IEC 80079-34 | ||
| ANSI/ESD S20.20 | ||
| ISO 26262 | ||
| ISO/IEC 27001 | ||
| ISO 50001 |
Company History
- 1995
Founding of ADLINK
- 1998
Establishment of a CompactPCI R&D center
- 2002
IPO on the Taiwan Stock Exchange (TWSE 6166)
- 2003
Intel Ecosystem Partner for AdvancedTCA and CompactPCI
- 2005
Sponsor member of the PXISA
- 2006
ETX Industrial Group releases ETX 3.0
- 2007
Establishment of the COM Express Subcommittee
- 2008
Acquisition of Ampro, founding member of the PC/104 Consortium
- 2013
Introduction of SMARC; joined VITA
- 2016
Launch of CompactPCI Serial Processor Blades
- 2018
Start of the NVIDIA partnership
- 2019
Joined the ROS 2 Technical Steering Committee
- 2020
Introduction of the first NVIDIA MXM GPU
- 2021
Implementation of Sensor Open Systems Architecture; introduction of COM-HPC
- 2022
Introduction of Open Standard Module (OSM)
- 2025
Adoption of the OpenVPX framework