Development and series production of optoelectronic and optomechanical modules for medical technology and sensor technology
AIM Micro Systems GmbH
07819 TriptisNew on Amplifa
The Partner for Optoelectronics
AIM Micro Systems GmbH, based in Triptis in Thuringia, implements optoelectronic product and process developments up to market maturity in the fields of medical technology and sensor technology. The company covers the entire value chain – from design through prototyping to validation and series production of miniaturized and complex modules, including management of the entire supply chain. Production takes place under cleanroom conditions (ISO5 and ISO7) in the area of Packaging Solutions (wafer dicing of silicon, ceramics and glass up to 300 mm, chip bonding, wire bonding with gold and aluminum, passivation, plasma activation, laser engraving) as well as in the area of Optical Solutions (micro-assembly with µm precision, assembly of conventional optics up to Ø 50 mm, camera modules with wide-angle technology, replication of micro-optics, MEMS/MOEMS, active alignment down to the nm range). Production covers samples, small series and volume productions of over 1 million units per year. With more than 15 years of industry expertise in optoelectronics and micro-assembly, AIM supplies customers from medical technology and sensor technology, cooperates with TU Ilmenau and the Ernst-Abbe University of Applied Sciences Jena, and is certified according to DIN EN ISO 9001:2015.
- Site
- Triptis
- Processes
- Wafer dicing, Chip bonding, Wire bonding, Laser engraving, Passivation (optical and light-tight encapsulation), Plasma activation, Micro-assembly with µm precision, Assembly of conventional optics up to diameter 50mm
- Materials
- Silicon, Ceramics, Glass, Gold, Aluminum, Plastics
- Certificates
- DIN EN ISO 9001:2015, ISO 9001, ISO 13485 (process development according to DIN ISO 13485), Cleanroom ISO5/ISO7, IATF 16949, EN 9100
- Industries
- Medical technology, Sensor technology
- 01
Product and process development (Design for Manufacturing / Design to Cost)
- 02
Optical design (field-tracing method)
- 03
Wafer dicing (silicon, ceramics, glass up to 300 mm)
- 04
Chip bonding up to 300 mm wafers
- 05
Wire bonding (gold, aluminum)
- 06
Plasma activation
- 07
Passivation (optical and light-tight encapsulation)
- 08
Micro-assembly and active alignment
- 09
Laser engraving / product marking
- 10
Final inspection with customer-specific test stations
- 11
Supply chain and supplier management
Materials and Processes
Silicon
Wafer dicing and chip bonding up to 300 mm, including local thinning of image sensors with 3 µm walls between the pixels.
Ceramics
Wafer dicing up to 300 mm wafer size.
Glass
Wafer dicing up to 300 mm wafer size.
Gold
Wire bonding for electrical chip connections.
Aluminum
Wire bonding for electrical chip connections.
Plastics
Plasma activation for bonding of plastics; micro-optics replication.
Locations
Triptis
DEHeadquarters / Production with cleanroom (ISO5, ISO7)
- Lot size
- Samples, small series, volume productions of over 1 million units/year
- Materials
- Silicon, ceramics, glass, gold, aluminum, plastics
- Wafer dicing machines (silicon, ceramics, glass up to 300 mm)
- Chip bonding machines (up to 300 mm wafers)
- Wire bonders (gold, aluminum)
- Plasma activation systems
- Laser system for engraving/product marking
- Customer-specific final inspection stations
- Cleanroom ISO5 / ISO7
Components and Modules
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Wafer dicingMachining | – | 300 mm | – | – | Silicon, Ceramics, Glass |
| Chip bondingJoining | – | – | – | – | Semiconductors (wafers up to 300 mm) |
| Wire bondingJoining | – | – | – | – | Gold, Aluminum |
| Laser engravingSurface | – | – | – | – | – |
| Passivation (optical and light-tight encapsulation)Surface | – | – | – | – | – |
| Plasma activationSurface | – | – | – | – | Plastics |
| Micro-assembly with µm precisionAssembly | µm range | – | – | – | – |
| Assembly of conventional optics up to diameter 50mmAssembly | – | 50 mm | – | – | – |
| Camera modules with high-resolution wide-angle technologyAssembly | – | – | – | – | – |
| Snapcure bonding for chip positions in the µm rangeJoining | µm range | – | – | – | – |
| Replication of micro-optics from the nano to the millimeter rangePlastics | – | – | – | – | – |
| MEMS/MOEMS with integrated quality controlAssembly | – | – | – | – | – |
| Active alignment down to the nm rangeAssembly | nm range | – | – | – | – |
| Final inspection through product-specific equipment adaptationTesting | – | – | – | – | – |
| Optical design (field-tracing method)Engineering | – | – | – | – | – |
| Product development / Design for Manufacturing / Design to CostEngineering | – | – | – | – | – |
| System analysis and contract measurement servicesTesting | – | – | – | – | – |
| Local thinning of image sensors (walls of 3µm between pixels)Engineering | 3 µm wall thickness | – | – | – | Silicon |
| COB technology (Chip on Board)Joining | – | – | – | – | – |
| Development and construction of customer-specific systems including process qualificationEngineering | – | – | – | – | – |
Additional services
Reference customers
Quality
Production takes place under cleanroom conditions (ISO5 and ISO7) with final inspection on customer-specific test stations as well as active alignment down to the nm range. The quality management system is certified according to DIN EN ISO 9001:2015 (TÜV SÜD); process developments in medical technology are carried out in compliance with DIN ISO 13485.
| Evidence | Triptis |
|---|---|
| ISO 9001 | |
| ISO 13485 (process development according to DIN ISO 13485) | |
| Cleanroom ISO5/ISO7 | |
| IATF 16949 | |
| EN 9100 |
History
Establishment of more than 15 years of industry expertise in optoelectronics and micro-assembly