Development and manufacture of InP- and GaAs-based high-speed photodiode chips and detector modules in our own cleanroom
Albis Optoelectronics AG
Rüschlikon (Switzerland)New on Amplifa
About Albis Optoelectronics
Albis Optoelectronics AG, headquartered in Rüschlikon near Zurich, is a designer, developer and manufacturer of high-speed photodiode chips. The product portfolio includes InP- and GaAs-based PIN photodiodes, avalanche photodiodes (APDs) and high-speed detector modules. The products are manufactured entirely in the company's own in-house cleanroom fabrication facilities. The service portfolio includes Fab Services with cleanroom manufacturing, wafer testing, assembly and packaging, as well as a reliability lab for reliability testing. The photodiodes are available as bare die, on carriers or in packages, and cover datacom and telecom wavelengths as well as speeds up to 200G. Applications include optical communications, monitoring and sensing systems, quantum computing, free-space optics (FSO), microwave photonics links, long-wavelength LIDAR as well as test and measurement.
- Site
- Rüschlikon
- Processes
- Semiconductor wafer fabrication (photodiode chips, InP/GaAs), Chip assembly and packaging (photodiode modules), Testing/Reliability Lab (wafer testing, reliability testing), Custom Fab Services, Fab Services (Custom Manufacturing), Wafer Manufacturing, Testing, Assembly and Packaging
- Materials
- Indium phosphide (InP), Gallium arsenide (GaAs), Fab Services (Custom Manufacturing), Assembly and Packaging
- Certificates
- Reliability Lab / Reliability Testing, On-site wafer testing
- Industries
- Optical Communications, Monitoring and Sensing, Artificial Intelligence, Quantum Computing, FSO Communications, Microwave Photonics Links
- 01
Chip design and development
- 02
Cleanroom wafer fabrication (InP/GaAs)
- 03
Wafer testing
- 04
Assembly and packaging
- 05
Reliability testing
Materials and Processes
Indium phosphide (InP)
Substrate material for InGaAs-based PIN photodiodes and APDs for datacom and telecom applications up to 200G.
Gallium arsenide (GaAs)
Substrate material for GaAs photodiodes with high power and quantum efficiency.
Fab Services (Custom Manufacturing)
Custom wafer fabrication and testing on our own cleanroom facilities.
Assembly and Packaging
Chip assembly and packaging of photodiode modules on site.
Site
Rüschlikon
CHHeadquarters with cleanrooms, wafer fabrication, assembly/packaging, reliability lab
- Materials
- InP, GaAs
- Cleanroom fabrication facility (cleanroom)
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Semiconductor wafer fabrication (photodiode chips, InP/GaAs)Other | – | – | – | – | InP, GaAs |
| Chip assembly and packaging (photodiode modules)Assembly | – | – | – | – | – |
| Testing/Reliability Lab (wafer testing, reliability testing)Testing | – | – | – | – | – |
| Custom Fab ServicesEngineering | – | – | – | – | InP, GaAs |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Cleanroom fabrication facility (cleanroom) | – | – | – | – | Rüschlikon, Switzerland |
Additional services
Quality
Our own reliability labs for reliability testing as well as on-site wafer testing complement cleanroom manufacturing.
| Evidence | Rüschlikon |
|---|---|
| Reliability Lab / Reliability Testing | |
| On-site wafer testing |