Packaging and test of semiconductors (IC Packaging & Test, OSAT) for semiconductor manufacturers worldwide.
Amkor Technology, Inc.
Tempe, Arizona (US) · Seoul (KR) · Porto (PT) · Peoria, Arizona (US, under construction) · further plants in CN, JP, PH, SG, TW, MY, VNNew on Amplifa
About Amkor Technology
Amkor Technology is a US-based provider of semiconductor packaging and test services (OSAT – Outsourced Semiconductor Assembly and Test). The company packages chips (dies) into chip packages, among other methods using wire bonding, flip chip packaging with copper pillar bumps, wafer level packaging and thermal compression bonding, and tests integrated circuits on automated test equipment. The portfolio also includes RF antenna designs on or in chips, CMOS image sensors, the Embedded Silicon Bridge solution S-Connect and S-SWIFT for the integration of chiplets and memories. Founded in 1968 and listed on the Nasdaq, the company generated revenue of 6.3 billion USD in 2024 with 28,300 employees and is one of the largest OSAT providers worldwide. Production facilities are located in Korea, China, Japan, Malaysia, the Philippines, Singapore, Taiwan, Portugal and Vietnam; a facility for advanced packaging and test is being built in the US state of Arizona.
- Site
- Tempe, Arizona, USA
- Processes
- Semiconductor Packaging (IC Packaging / OSAT), Test Services (semiconductor test / automated test equipment), Wire Bonding, Flip Chip Packaging with Copper Pillar Bumps, Wafer Level Packaging, Thermal Compression Bonding, Advanced Packaging (US Facility, Arizona), S-SWIFT™ Technology (integration of chiplets and memories)
- Materials
- Silicon (semiconductor wafers/dies), Copper Pillar Bumps, CMOS Imaging Sensors, Wafer Level Packaging, Thermal Compression Bonding, Embedded Silicon Bridge Interposer, Chiplet/Memory Integration, Quad Flat No Leads (Micro Lead Frame)
- Founded
- 1968
- Employees
- 28300
- Industries
- Semiconductor industry, Consumer electronics / mobile devices, AI infrastructure, Automotive/ISIG, Consumer electronics / mobile devices (smartphones), Automotive/ISIG (events ISIG Summit China/SEA)
- 01
Takeover of the wafers/dies from the semiconductor manufacturer
- 02
IC Packaging (Wire Bonding / Flip Chip / Wafer Level Packaging)
- 03
Thermal Compression Bonding / Advanced Packaging (S-Connect, S-SWIFT)
- 04
Semiconductor test on automated test equipment (ATE)
- 05
Delivery to chip manufacturers
Materials & Processes
Silicon (semiconductor wafers/dies)
Base material of the packaged and tested chips.
Copper Pillar Bumps
Copper structure for flip chip packaging with high interconnect density.
Wafer Level Packaging
Packaging at wafer level before dicing the dies.
Thermal Compression Bonding
Thermo-compression joining for advanced packages.
Embedded Silicon Bridge Interposer
Embedded silicon bridge for improved signal integrity.
Chiplet/Memory Integration
Technology for integrating chiplets and memories in a single package.
Quad Flat No Leads (Micro Lead Frame)
Compact package per JEDEC MO-220, among others for mobile phones.
Locations
Tempe, Arizona
USCorporate headquarters (since April 2015)
Seoul
KRProduction facility; originating company ANAM (1968)
Porto
PTProduction facility / Customer Support
Peoria, Arizona
USNew US plant for Advanced Packaging and Test (announced 2023, Peoria Innovation Core site since 2025)
Production facilities in China, Japan, the Philippines, Singapore, Taiwan and
CN/JProduction and test plants (J-Devices Japan fully acquired 2016; Longtan Science Park Taiwan opened 2018)
- Automated test equipment (ATE)
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Semiconductor Packaging (IC Packaging / OSAT)Assembly | – | – | – | – | Silicon (Dies), Copper (Copper Pillar Bumps) |
| Test Services (semiconductor test / automated test equipment)Testing | – | – | – | – | – |
| Wire BondingJoining | – | – | – | – | Silicon, Metal wire (bond wire) |
| Flip Chip Packaging with Copper Pillar BumpsAssembly | – | – | – | – | Silicon, Copper |
| Wafer Level PackagingAssembly | – | – | – | – | Silicon (wafers) |
| Thermal Compression BondingJoining | – | – | – | – | – |
| Advanced Packaging (US Facility, Arizona)Assembly | – | – | – | – | – |
| S-SWIFT™ Technology (integration of chiplets and memories)Assembly | – | – | – | – | Chiplets, Memory dies |
| S-Connect: Bridge Die Interposer (Embedded Silicon Bridge)Assembly | – | – | – | – | Silicon |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Automated test equipment (ATE) | – | – | – | – | – |
Additional services
Reference customers
Company History
- 1935
Founding of ANAM Industries in Seoul by Hyang-Soo Kim (import of Japanese goods) – origin of the company.
- 1968
ANAM becomes ANAM Industrial Co. Ltd., South Korea's first semiconductor company; Joo-Jin (James) Kim founds Amkor Electronics, Inc. with a sales office in Philadelphia.
- 1970
Start of semiconductor production and exports.
- 1998
IPO on the Nasdaq.
- 2000
Acquisition of Integra Technologies (US OSAT); spun off again in 2005.
- 2005
Relocation of company headquarters from West Chester (Pennsylvania) to Chandler (Arizona).
- 2015
Company headquarters moves from Chandler to Tempe (Arizona).
- 2016
Full acquisition of J-Devices Corp., Japan's largest OSAT provider.
- 2017
Named Supplier of the Year 2016 by Qualcomm Technologies (second year in a row).
- 2018
Opening of a production and test plant in Longtan Science Park, Taiwan.
- 2019
No. 2 in the OSAT market by revenue (7.1 billion USD).
- 2023
Announcement of a 2 billion USD plant for Advanced Packaging in Arizona (for TSMC chips).
- 2024
28,300 employees worldwide, revenue 6.3 billion USD.
- 2025
Relocation of the new US plant site to the Peoria Innovation Core.
- 2026
Strategic partnership with NVIDIA for AI infrastructure; improvement of 250 places in the '100 Best Corporate Citizens' ranking.