Engineering Services: Finite Element Simulation, Material and Failure Analysis for Electronic Assembly and Interconnection Technology.
Angewandte Micro-Messtechnik GmbH
Berlin (Volmerstraße 9B, 12489)New on Amplifa
About AMIC
Angewandte Micro-Messtechnik GmbH (AMIC) was founded in 1996 in Berlin and is an engineering service provider for the examination of microsystem components, parts, materials, and material combinations. The portfolio of services includes numerical analysis with Finite Element Simulation, material characterization using standard and non-standard material models (e.g., TMA, DMA, CTE, viscoelastic properties), fracture mechanics characterization of bulk and interface properties (KI, Gc), and failure analysis of failure modes and material interfaces. Proprietary products include the Advanced Mixed-Mode Bending (AMB) test system for determining crack length, mode mixity, and critical energy release rate, as well as the Delamination Chip, a non-destructive method for delamination detection in electronic packages. Typical customers come from the electronics industry, the automotive industry, and the aerospace industry. The company is part of the consortium “Joint Lab Berlin – Technical Safety” and is located at Berlin-Adlershof (Volmerstraße 9B).
- Site
- Berlin
- Processes
- Numerical Analysis / Finite Element Simulation, Material Characterization (Standard and Non-Standard Material Models), Fracture Mechanics Characterization (Bulk and Interface): Stress Intensity Factors KI, Critical, Mechanical Material Characterization (TMA, DMA): CTE, Viscoelastic Properties E, tan δ, Failure Analysis (Failure Modes, Behavior in Material Interfaces), Advanced Mixed Mode Bending – Test System (Crack Length, Mode Mixity, Critical, Delamination Chip – Non-destructive Delamination Detection in Electronic Packages, Product Development (Product Engineering)
- Materials
- Numerical Analysis / Finite Element Simulation, Mechanical Material Characterization (TMA, DMA), Advanced Mixed Mode Bending – Test System, Failure Analysis (Failure Analysis), Delamination Chip
- Certificates
- ISO 9001
- Founded
- 1996
- Industries
- Electronics Industry, Automotive Industry, Aerospace Industry
- 01
Numerical Analysis / Finite Element Simulation
- 02
Material Characterization (TMA, DMA, Fracture Mechanics)
- 03
Fracture Mechanics Interface Analysis (AMB)
- 04
Failure Analysis / Failure Analysis
- 05
Delamination Detection (Delamination Chip)
Methods & Procedures
Numerical Analysis / Finite Element Simulation
Visualization of complex situations and reliability analysis of microsystem components based on numerical simulation.
Mechanical Material Characterization (TMA, DMA)
Determination of thermal expansion coefficients (CTE) and viscoelastic properties (E, tan δ) for electronic assembly and interconnection technology.
Advanced Mixed Mode Bending – Test System
Proprietary testing device for fast and accurate determination of crack length, mode mixity, and critical energy release rate at interfaces of real IC packages.
Failure Analysis (Failure Analysis)
Detection of failure modes and investigation of behavior at material interfaces.
Delamination Chip
Non-destructive, cost-effective technology for delamination detection in electronic packages.
Locations
Berlin
DEHeadquarters
- Advanced-Mixed-Mode Bending (AMB) Test System (Proprietary Development)
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Numerical Analysis / Finite Element SimulationEngineering | – | – | – | – | – |
| Material Characterization (Standard and Non-Standard Material Models)Testing | – | – | – | – | – |
| Fracture Mechanics Characterization (Bulk and Interface): Stress Intensity Factors KI, CriticalTesting | – | – | – | – | – |
| Mechanical Material Characterization (TMA, DMA): CTE, Viscoelastic Properties E, tan δTesting | – | – | – | – | – |
| Failure Analysis (Failure Modes, Behavior in Material Interfaces)Testing | – | – | – | – | – |
| Advanced Mixed Mode Bending – Test System (Crack Length, Mode Mixity, CriticalTesting | – | – | – | – | – |
| Delamination Chip – Non-destructive Delamination Detection in Electronic PackagesTesting | – | – | – | – | – |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Advanced-Mixed-Mode Bending (AMB) Test System | AMIC GmbH (in-house development) | – | – | – | Berlin |
Additional services
Quality
Methods for material and failure analysis that go beyond the state of the art are continuously being developed as part of national and European projects.
| Evidence | Berlin |
|---|---|
| ISO 9001 |
History
- 1996
Founding of AMIC GmbH (Angewandte Micro-Messtechnik GmbH)