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Aptasic – Fertigung

Test house for wafer probing, back-end processes, final test and delivery of tested ASICs with associated supply chain management

Aptasic Logo

Aptasic SA

Boudry, CH · Leonberg, DENew on Amplifa

1979Founded (as CSEE)
2Locations (Boudry CH, Leonberg DE)
1400 m²Test floor space in Boudry, including 400 m² ISO 8 cleanroom
4–12 inchWafer sizes in wafer probing
17.03.2026Joining Eurofins Materials & Engineering Sciences

About Aptasic

Aptasic SA is a test house based in Boudry, Switzerland, that tests electronic components and Application Specific Integrated Circuits (ASICs). The company supports ASIC projects along the entire value chain: from consulting and design-for-testability advice through wafer procurement and wafer probing to semiconductor packaging, final test and delivery of the tested ASICs. Services also include test program development (analog/mixed signal, digital scan, memory BIST, RF), qualification testing (HTOL, HTS, TC, THB, AC, screening) as well as tape & reel and pick & place. The Boudry site offers 1400 m² of space, including 400 m² of ISO 8 cleanroom; an ISO 5 Clean Zone exists for CMOS imager testing. Aptasic was founded in 1979 as CSEE, has borne its current name since 2008 and is part of Eurofins Materials & Engineering Sciences. The company serves the semiconductor industry, the industrial/electronics sector and, since ISO certification in 2015, the medical technology sector, supplying customers worldwide.

Site
Boudry
Processes
Test program development: analog/mixed signal (AMS), digital scan test, memory BIST, radio, Multi-site Wafer Probing at cold/room/hot temperature (-40°C / 125-200°C), Parallel package test at cold / room / hot temperature (-40°C / 150°C), Qualification testing: HTOL, HTS, TC, THB, AC (Pressure Cooker), Screening, Final Test, Wafer Procurement, Semiconductor Packaging, Tape&Reel / Pick&Place
Materials
Silicon wafers / semiconductors, CMOS sensors, Wafer Probing, Analog/Mixed-Signal Testing, Digital Scan / Memory BIST, RF Testing, CMOS Imager Testing, Qualification Testing
Certificates
ISO 9001:2015, ISO 13485:2016 / EN ISO 13485:2016, ISO 13485:2016
Founded
1979
Industries
Semiconductor industry, Medical technology (since 2015), Industrial/Electronics
  1. 01

    Consulting / Design for Testability

  2. 02

    Wafer Procurement

  3. 03

    Test program development (AMS, digital scan, memory BIST, RF)

  4. 04

    Wafer Probing

  5. 05

    Semiconductor Packaging

  6. 06

    Final Test

  7. 07

    Tape & Reel / Pick & Place

  8. 08

    Delivery of the tested ASICs

Areas of Work & Test Services

WPR

Wafer Probing

Multi-site wafer probing at cold, room and hot temperatures (-40°C to 125–200°C) for wafers from 4 to 12 inches.

AMS

Analog/Mixed-Signal Testing

Test program development and parallel package test for analog and mixed-signal circuits.

DSC

Digital Scan / Memory BIST

Digital scan testing and memory BIST test development for digital ASICs.

RF

RF Testing

Test program development for high-frequency applications.

CMOS

CMOS Imager Testing

Testing of CMOS sensors in an ISO 5 Clean Zone.

QUAL

Qualification Testing

HTOL, HTS, TC, THB, AC (Pressure Cooker) and screening for component qualification.

Locations

Standort Boudry

Boudry

CH

Headquarters, test house (wafer probing, final test, packaging)

Materials
Silicon wafers, ASICs, CMOS sensors
  • Electroglas Wafer Prober 2001X, 2080, 4090u
  • Accretech UF3000EX-e Wafer Prober (8–12 inch)
  • LTX/Credence D10 Mixed Signal Tester
  • Credence STS6500 / KTS6060/6500/6120 Digital Tester
  • Mazzali burn-in oven (HTOL, HTS)
  • Weiss Technik / Saunder temperature chambers (TC)
  • Mazzali temperature/humidity chamber (THB)
  • Tabal Pressure Cooker (AC)
  • ATS Thermostream ATS710MII
  • STI TR18AS2 Tape & Reel / Pick & Place
  • ISMECA 4000, V-Tek TM-50, AATEC LISA Tape & Reel

Leonberg

DE

Bluetest Testservice GmbH (integrated in 2022)

Components & Services

CMOS Sensor
CMOS SensorCMOS imager testing in ISO 5 Clean Zone · Semiconductors/Photonics
ASIC Component
ASIC ComponentWafer probing, final test, packaging · Semiconductors

Inside the production

Test equipment at the Boudry test house
Test equipment at the Boudry test house
New test facility (investment 2023)
New test facility (investment 2023)
Solar installations for self-sufficient energy supply
Solar installations for self-sufficient energy supply
Site of Aptasic SA, Boudry
Site of Aptasic SA, Boudry

Industries

Semiconductor industryMedical technology (since 2015)Industrial/Electronics

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Test program development: analog/mixed signal (AMS), digital scan test, memory BIST, radioTesting–––––
Multi-site Wafer Probing at cold/room/hot temperature (-40°C / 125-200°C)Testing––––Wafers (semiconductors)
Parallel package test at cold / room / hot temperature (-40°C / 150°C)Testing––––Electronic components (ASICs)
Qualification testing: HTOL, HTS, TC, THB, AC (Pressure Cooker), ScreeningTesting–––––
Final TestTesting––––ASICs
Wafer ProcurementEngineering––––Wafers
Semiconductor PackagingAssembly––––Electronic components (ASICs)
Tape&Reel / Pick&PlaceAssembly––––Packages: SO-150, SO-300, SSOP, TSSOP, MSOP, QFN 5×5
Design for testability consultingEngineering–––––
CMOS imager test (ISO 5 clean zone)Testing––––CMOS sensors

21 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Burn in ovenMazzali–HTOL, HTS, 150°C–Boudry, CH
Temperature test chamberWeiss Technik–TC, -60°C to +150°C–Boudry, CH
Temperature test chamberSaunder–TC, -50 to 150°C–Boudry, CH
Temperature and humidity test chamberMazzali–THB, 85°C / 85% RH–Boudry, CH
Pressure cooker chamberTabal–AC, 130°C / 100% RH–Boudry, CH
ThermostreamATS ATS710MII–Screening, -70°C to +225°C–Boudry, CH
Wafer proberElectroglas 2001X–Wafer 4-6 inch, room to 120°C–Boudry, CH
Wafer proberElectroglas 2080–Wafer 4-6-8 inch, room to 120°C–Boudry, CH
Wafer proberElectroglas 4090u–Wafer 5-6-8 inch, -40 to 150°C–Boudry, CH
Wafer proberAccretech UF3000EX-e–Wafer 8-12 inch, -40 to 200°C, dark fixture option–Boudry, CH
Mixed signal testerLTX / Credence D10–DPS: DPIN (digital) 96 I/O x2; VIS (analog) 16 channels x2–Boudry, CH
Digital testerCredence STS6500–60 pins–Boudry, CH
Digital testerCredence KTS6060 / KTS6500 / KTS6120–60 pins (sparc station)–Boudry, CH
Tape&Reel / Pick&PlaceSTI TR18AS2–SO-150, SO-300, SSOP, TSSOP, MSOP, QFN 5×5–Boudry, CH
Tape&Reel / Pick&Place (manual handling)ISMECA 4000–––Boudry, CH
Tape&Reel / Pick&Place (manual handling)V-Tek TM-50–––Boudry, CH
Tape&Reel SystemAATEC LISA–Vibrating bowl to reel, tube to reel, tray to reel–Boudry, CH
HandlerMT8704iHF–room to 120°C–Boudry, CH
Handler + Tape&ReelEX5000–ambient–Boudry, CH
HandlerRasco1000–-50 to 150°C–Boudry, CH
HandlerMH250–-40 to 85°C–Boudry, CH

Additional services

ConsultingWafer ProcurementWafer ProbingSemiconductor PackagingFinal TestDeliveryDesign for Testability ConsultingQualification (HTOL, HTS, TC, THB, AC, Screening)Tape & Reel / Pick & PlaceTest program development (AMS, digital scan, memory BIST, RF)Delivery of tested ASICs (turnkey supply chain)

Quality

Aptasic is certified according to ISO 9001:2015 and ISO 13485:2016 (SQS/IQNET) and tests ASICs for the medical device industry in accordance with regulatory requirements. Testing capabilities include multi-site wafer probing as well as parallel package testing at temperatures from -40 °C to 200 °C.

EvidenceBoudry
ISO 9001:2015
ISO 13485:2016

History

  1. 1979

    Founded under the name CSEE

  2. 2006

    Acquired by the PQH Group

  3. 2008

    Renamed Aptasic SA

  4. 2015

    Entry into the medical sector after ISO certification

  5. 2022

    Integration of Bluetest Testservice GmbH (founded 2011, Leonberg, Germany)

  6. 2026

    Aptasic SA and Bluetest Testservice GmbH join Eurofins Materials & Engineering Sciences as of 17.03.2026; transition process until the end of 2026

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