
Test house for wafer probing, back-end processes, final test and delivery of tested ASICs with associated supply chain management

Aptasic SA
Boudry, CH · Leonberg, DENew on Amplifa
About Aptasic
Aptasic SA is a test house based in Boudry, Switzerland, that tests electronic components and Application Specific Integrated Circuits (ASICs). The company supports ASIC projects along the entire value chain: from consulting and design-for-testability advice through wafer procurement and wafer probing to semiconductor packaging, final test and delivery of the tested ASICs. Services also include test program development (analog/mixed signal, digital scan, memory BIST, RF), qualification testing (HTOL, HTS, TC, THB, AC, screening) as well as tape & reel and pick & place. The Boudry site offers 1400 m² of space, including 400 m² of ISO 8 cleanroom; an ISO 5 Clean Zone exists for CMOS imager testing. Aptasic was founded in 1979 as CSEE, has borne its current name since 2008 and is part of Eurofins Materials & Engineering Sciences. The company serves the semiconductor industry, the industrial/electronics sector and, since ISO certification in 2015, the medical technology sector, supplying customers worldwide.
- Site
- Boudry
- Processes
- Test program development: analog/mixed signal (AMS), digital scan test, memory BIST, radio, Multi-site Wafer Probing at cold/room/hot temperature (-40°C / 125-200°C), Parallel package test at cold / room / hot temperature (-40°C / 150°C), Qualification testing: HTOL, HTS, TC, THB, AC (Pressure Cooker), Screening, Final Test, Wafer Procurement, Semiconductor Packaging, Tape&Reel / Pick&Place
- Materials
- Silicon wafers / semiconductors, CMOS sensors, Wafer Probing, Analog/Mixed-Signal Testing, Digital Scan / Memory BIST, RF Testing, CMOS Imager Testing, Qualification Testing
- Certificates
- ISO 9001:2015, ISO 13485:2016 / EN ISO 13485:2016, ISO 13485:2016
- Founded
- 1979
- Industries
- Semiconductor industry, Medical technology (since 2015), Industrial/Electronics
- 01
Consulting / Design for Testability
- 02
Wafer Procurement
- 03
Test program development (AMS, digital scan, memory BIST, RF)
- 04
Wafer Probing
- 05
Semiconductor Packaging
- 06
Final Test
- 07
Tape & Reel / Pick & Place
- 08
Delivery of the tested ASICs
Areas of Work & Test Services
Wafer Probing
Multi-site wafer probing at cold, room and hot temperatures (-40°C to 125–200°C) for wafers from 4 to 12 inches.
Analog/Mixed-Signal Testing
Test program development and parallel package test for analog and mixed-signal circuits.
Digital Scan / Memory BIST
Digital scan testing and memory BIST test development for digital ASICs.
RF Testing
Test program development for high-frequency applications.
CMOS Imager Testing
Testing of CMOS sensors in an ISO 5 Clean Zone.
Qualification Testing
HTOL, HTS, TC, THB, AC (Pressure Cooker) and screening for component qualification.
Locations

Boudry
CHHeadquarters, test house (wafer probing, final test, packaging)
- Materials
- Silicon wafers, ASICs, CMOS sensors
- Electroglas Wafer Prober 2001X, 2080, 4090u
- Accretech UF3000EX-e Wafer Prober (8–12 inch)
- LTX/Credence D10 Mixed Signal Tester
- Credence STS6500 / KTS6060/6500/6120 Digital Tester
- Mazzali burn-in oven (HTOL, HTS)
- Weiss Technik / Saunder temperature chambers (TC)
- Mazzali temperature/humidity chamber (THB)
- Tabal Pressure Cooker (AC)
- ATS Thermostream ATS710MII
- STI TR18AS2 Tape & Reel / Pick & Place
- ISMECA 4000, V-Tek TM-50, AATEC LISA Tape & Reel
Leonberg
DEBluetest Testservice GmbH (integrated in 2022)
Components & Services


Inside the production




Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Test program development: analog/mixed signal (AMS), digital scan test, memory BIST, radioTesting | – | – | – | – | – |
| Multi-site Wafer Probing at cold/room/hot temperature (-40°C / 125-200°C)Testing | – | – | – | – | Wafers (semiconductors) |
| Parallel package test at cold / room / hot temperature (-40°C / 150°C)Testing | – | – | – | – | Electronic components (ASICs) |
| Qualification testing: HTOL, HTS, TC, THB, AC (Pressure Cooker), ScreeningTesting | – | – | – | – | – |
| Final TestTesting | – | – | – | – | ASICs |
| Wafer ProcurementEngineering | – | – | – | – | Wafers |
| Semiconductor PackagingAssembly | – | – | – | – | Electronic components (ASICs) |
| Tape&Reel / Pick&PlaceAssembly | – | – | – | – | Packages: SO-150, SO-300, SSOP, TSSOP, MSOP, QFN 5×5 |
| Design for testability consultingEngineering | – | – | – | – | – |
| CMOS imager test (ISO 5 clean zone)Testing | – | – | – | – | CMOS sensors |
21 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Burn in oven | Mazzali | – | HTOL, HTS, 150°C | – | Boudry, CH |
| Temperature test chamber | Weiss Technik | – | TC, -60°C to +150°C | – | Boudry, CH |
| Temperature test chamber | Saunder | – | TC, -50 to 150°C | – | Boudry, CH |
| Temperature and humidity test chamber | Mazzali | – | THB, 85°C / 85% RH | – | Boudry, CH |
| Pressure cooker chamber | Tabal | – | AC, 130°C / 100% RH | – | Boudry, CH |
| Thermostream | ATS ATS710MII | – | Screening, -70°C to +225°C | – | Boudry, CH |
| Wafer prober | Electroglas 2001X | – | Wafer 4-6 inch, room to 120°C | – | Boudry, CH |
| Wafer prober | Electroglas 2080 | – | Wafer 4-6-8 inch, room to 120°C | – | Boudry, CH |
| Wafer prober | Electroglas 4090u | – | Wafer 5-6-8 inch, -40 to 150°C | – | Boudry, CH |
| Wafer prober | Accretech UF3000EX-e | – | Wafer 8-12 inch, -40 to 200°C, dark fixture option | – | Boudry, CH |
| Mixed signal tester | LTX / Credence D10 | – | DPS: DPIN (digital) 96 I/O x2; VIS (analog) 16 channels x2 | – | Boudry, CH |
| Digital tester | Credence STS6500 | – | 60 pins | – | Boudry, CH |
| Digital tester | Credence KTS6060 / KTS6500 / KTS6120 | – | 60 pins (sparc station) | – | Boudry, CH |
| Tape&Reel / Pick&Place | STI TR18AS2 | – | SO-150, SO-300, SSOP, TSSOP, MSOP, QFN 5×5 | – | Boudry, CH |
| Tape&Reel / Pick&Place (manual handling) | ISMECA 4000 | – | – | – | Boudry, CH |
| Tape&Reel / Pick&Place (manual handling) | V-Tek TM-50 | – | – | – | Boudry, CH |
| Tape&Reel System | AATEC LISA | – | Vibrating bowl to reel, tube to reel, tray to reel | – | Boudry, CH |
| Handler | MT8704iHF | – | room to 120°C | – | Boudry, CH |
| Handler + Tape&Reel | EX5000 | – | ambient | – | Boudry, CH |
| Handler | Rasco1000 | – | -50 to 150°C | – | Boudry, CH |
| Handler | MH250 | – | -40 to 85°C | – | Boudry, CH |
Additional services
Quality
Aptasic is certified according to ISO 9001:2015 and ISO 13485:2016 (SQS/IQNET) and tests ASICs for the medical device industry in accordance with regulatory requirements. Testing capabilities include multi-site wafer probing as well as parallel package testing at temperatures from -40 °C to 200 °C.
| Evidence | Boudry |
|---|---|
| ISO 9001:2015 | |
| ISO 13485:2016 |
History
- 1979
Founded under the name CSEE
- 2006
Acquired by the PQH Group
- 2008
Renamed Aptasic SA
- 2015
Entry into the medical sector after ISO certification
- 2022
Integration of Bluetest Testservice GmbH (founded 2011, Leonberg, Germany)
- 2026
Aptasic SA and Bluetest Testservice GmbH join Eurofins Materials & Engineering Sciences as of 17.03.2026; transition process until the end of 2026