Manufacturer of high-quality printed circuit boards (HDI microvia), IC substrates and mSAP circuit boards for electronics and semiconductor applications
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Leoben (AT) · Fehring (AT) · Nanjangud (IN) · Shanghai (CN) · Chongqing (CN) · Kulim (MY) · Düren (DE) · San Jose (US) · Chicago (US) · Stockholm (SE) · Bengaluru (IN) · Seoul (KR) · Tokyo (JP) ·New on Amplifa
About AT&S
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, headquartered in Leoben (Styria, Austria), manufactures printed circuit boards in HDI microvia technology, IC substrates for semiconductors, mSAP circuit boards (substrate-like structures) as well as flexible and rigid-flex circuit boards. The company supplies the mobile communications industry, automotive electronics, industrial electronics, medical technology, and semiconductor and computing applications; for the expansion of 5G, AT&S develops and produces high-frequency-optimized interconnect solutions with hybrid PCB structures. Its customers include AMD, Apple, Intel, Nokia, Siemens, Sony Ericsson and Fairphone, among others. The group operates six production sites in Austria (Leoben, Fehring), India (Nanjangud), China (Shanghai, Chongqing) and Malaysia (Kulim) as well as nine sales offices in the USA, Germany, Sweden, India, South Korea, Japan, Taiwan and Hong Kong. The Austrian plants focus on small and medium series for the industrial and automotive sectors, while large series for mobile devices are manufactured in China; Shanghai and Leoben, with their research units, are the technology drivers of the group. Since 2025, AT&S has maintained R&D and production capacity for IC substrates in Europe with the Hinterberg 3 competence center in Leoben.
- Site
- Leoben, Austria
- Processes
- HDI microvia printed circuit boards, IC substrates (integrated circuits), mSAP (substrate-like circuit boards), Rigid-flex printed circuit boards, Flexible printed circuit boards, High-frequency (HF) optimized interconnect solutions / hybrid PCB structures for 5G, Research & Development, IC substrate production
- Materials
- HDI microvia printed circuit boards, IC substrates, mSAP circuit boards (substrate-like circuit boards), Flexible printed circuit boards, Rigid-flex printed circuit boards, High-frequency interconnect solutions (hybrid PCB)
- Founded
- 1987
- Industries
- Mobile communications, Automotive electronics, Industrial electronics, Medical technology, Semiconductors/Server & Computing
- 01
Research & Development
- 02
Printed circuit board and IC substrate production
- 03
Logistics
- 04
Sales
Technologies & Manufacturing Processes
HDI microvia printed circuit boards
Printed circuit board technology with microvia connections for dense, highly complex circuits, among other things for mobile devices.
IC substrates
Substrates for integrated circuits that ensure power supply and data transmission of high-performance microchips.
mSAP circuit boards (substrate-like circuit boards)
Technology generation for mobile devices in the core business, produced at the Chongqing plant.
Flexible printed circuit boards
Flexible printed circuit boards for European niche markets, manufactured at the Fehring site.
Rigid-flex printed circuit boards
Rigid-flex printed circuit boards for niche applications, predominantly in the automotive and industrial segments.
High-frequency interconnect solutions (hybrid PCB)
High-frequency-optimized printed circuit board structures to support the 5G expansion.
Locations
Leoben
ATHeadquarters, production of printed circuit boards and IC substrates, Hinterberg competence center (R&D)
- Materials
- Printed circuit boards, IC substrates
Fehring
ATProduction of flexible printed circuit boards
- Materials
- Flexible printed circuit boards
Nanjangud (near Mysuru)
INProduction
Shanghai
CNProduction (Plant I and II) and research, large series for mobile devices
- Lot size
- Large series
- Materials
- HDI microvia printed circuit boards
Chongqing
CNProduction of IC substrates and mSAP
- Materials
- IC substrates, mSAP
Kulim
MYProduction of IC substrates
- Materials
- IC substrates
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| HDI microvia printed circuit boardsPrinted circuit board manufacturing | – | – | – | – | – |
| IC substrates (integrated circuits)Printed circuit board manufacturing | – | – | – | – | – |
| mSAP (substrate-like circuit boards)Printed circuit board manufacturing | – | – | – | – | – |
| Rigid-flex printed circuit boardsPrinted circuit board manufacturing | – | – | – | – | – |
| Flexible printed circuit boardsPrinted circuit board manufacturing | – | – | – | – | – |
| High-frequency (HF) optimized interconnect solutions / hybrid PCB structures for 5GPrinted circuit board manufacturing | – | – | – | – | – |
Additional services
Reference customers
History
- 1987
Emergence from three partial companies: Steirische Elektronik (Fehring), Eumig branch plant Fohnsdorf and Voest-Alpine facility Leoben
- 1994
Privatization, previously owned by the state holding ÖIAG
- 1995
Conversion into a public limited company
- 1998
Acquisition of Indal Electronics in Nanjangud, India
- 1999–2008
Listing on the Frankfurt Stock Exchange, in the TecDAX from 2003
- 2000
Opening of the Nörvenich logistics center (Germany) and commissioning of the Leoben-Hinterberg II plant
- 2002
Production start in Shanghai; Top-3 position in HDI/microvia worldwide; supplier for Nokia and Siemens
- 2006
Opening of the second Shanghai plant, closure of the Fohnsdorf plant, acquisition of Tofic Co. Ltd. (Korea)
- 2008
Listing exclusively on the Vienna Stock Exchange
- 2011
Start of construction of the Chongqing plant (China)
- 2013
Winning Intel as a customer; expansion of Chongqing to IC substrates and mSAP
- 2016
Brief inclusion in the ATX; partial series production of IC substrates in Chongqing
- 2017
Manufacturing of IC substrates (Plant 1) and mSAP (Plant 2) in Chongqing; around €510 million invested
- 2018
Re-admission of the AT&S share to the ATX
- 2021
Announcement of a new plant for IC substrates in Kulim, Malaysia
- 2024
Sale of AT&S Korea (Ansan) to SO.MA.CI.S. for approx. €405 million; resignation of CEO Andreas Gerstenmayer
- 2025
Dr. Michael Mertin becomes CEO (from 01.05.2025); opening of the Hinterberg 3 competence center in Leoben