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ATLANT 3D – Fertigung

ATLANT 3D manufactures micro- and nanocomponents for microelectronics and photonics using atomically precise DALP® deposition technology

ATLANT 3D Logo

ATLANT 3D

Location not specifiedNew on Amplifa

more than 450 materials processableMaterial portfolio
3NANOFABRICATOR product lines (LITE, PRO, ZERO-G)
14 Mio. EURCLOSER project budget (Horizon Europe)

About ATLANT 3D

ATLANT 3D is a company for atomically precise advanced manufacturing that provides digital and atomically precise process technologies along the entire microelectronics value chain. At its core is the company's proprietary DALP® technology (Direct Atomic Layer Processing), a microreactor-based deposition technology with atomic precision capable of processing more than 450 materials – including silicon, gallium, indium, germanium and copper. The service portfolio ranges from advanced materials research and prototyping of micro- and nanodevices (MEMS/sensors, microfluidics, RF, optical and photonic devices) to scalable manufacturing. For research and industry, ATLANT 3D offers the NANOFABRICATOR™ product series: LITE for academia and research (sample size up to 100 mm, line widths down to 100 µm, deposition speed up to 200 mm/s, up to two materials simultaneously), PRO for industrial R&D, as well as ZERO-G. The technology is low-waste and chemical-reduced and is compatible with semiconductor industry standards. Application areas include optics & photonics, sensors & MEMS, advanced packaging & semiconductor manufacturing, biotechnology & medical devices, energy technology, and RF & printed electronics.

Site
Location not specified
Processes
DALP® – Direct Atomic Layer Processing (atomic material deposition), Prototyping of micro- and nanodevices (MEMS, microfluidics, RF, optical/photonic devices), Edge passivation for highly efficient solar cells (ACES project), Innovation Services, Atomically precise material deposition (DALP®), Prototyping of micro- and nanodevices, Scalable manufacturing
Materials
Silicon, Gallium, Indium, Germanium, Copper (for solar cell metallization), Silver (reference material to be replaced in solar cell metallization), Direct Atomic Layer Processing, Copper
Industries
Optics & Photonics, Sensors & MEMS, Advanced Packaging & Semiconductor Fabrication, Biotechnology & Medical Devices, Energy Technology (Batteries, Fuel Cells, Catalysis), RF & Printed Electronics
  1. 01

    Materials research (Advanced Materials R&D)

  2. 02

    DALP® atomic material deposition

  3. 03

    Prototyping of micro- and nanodevices

  4. 04

    Scalable manufacturing

  5. 05

    Application-specific integration (optics, photonics, MEMS/sensors)

Materials and Processes

DALP®

Direct Atomic Layer Processing

Microreactor-based deposition technology with atomic precision for microelectronics and photonics, capable of processing more than 450 materials.

Si

Silicon

Semiconductor material for microelectronics and solar cell applications such as edge passivation.

Ga

Gallium

Processable material of DALP® technology, among other things for compound semiconductors.

In

Indium

Processable material of DALP® technology for micro- and nanodevices.

Ge

Germanium

Processable material of DALP® technology for semiconductor and photonics applications.

Cu

Copper

Material for solar cell metallization as a substitute for silver.

Locations

Location not specified

Development and manufacturing of the NANOFABRICATOR series

Materials
more than 450 materials (DALP®)
  • NANOFABRICATOR™ LITE
  • NANOFABRICATOR™ PRO
  • NANOFABRICATOR® ZERO-G

Components and Applications

Micro- and nanodevices (DALP® deposition)
Micro- and nanodevices (DALP® deposition)Direct Atomic Layer Processing · Microelectronics
DALP® process illustration
DALP® process illustrationAtomic deposition · Advanced Manufacturing
NANOFABRICATOR application
NANOFABRICATOR applicationAtomic deposition · Research & Industry

Inside the production

DALP® technology
DALP® technology
DALP® material deposition
DALP® material deposition
NANOFABRICATOR system
NANOFABRICATOR system
Application field micro- and nanotechnology
Application field micro- and nanotechnology
Applications of DALP® technology
Applications of DALP® technology
EU-funded projects
EU-funded projects

Industries

Optics & PhotonicsSensors & MEMSAdvanced Packaging & Semiconductor FabricationBiotechnology & Medical DevicesEnergy Technology (Batteries, Fuel Cells, Catalysis)RF & Printed ElectronicsALD & Advanced MaterialsOptics & PhotonicsSensors & MEMSAdvanced Packaging & Semiconductor FabricationBiotechnology & Medical DevicesEnergy Applications (Batteries, Fuel Cells, Catalysis)

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
DALP® – Direct Atomic Layer Processing (atomic material deposition)Additiveatomic precision (details not specified)Sample size up to 100 mm––more than 450 materials processable, Silicon, Gallium, Indium, Germanium, Copper
Prototyping of micro- and nanodevices (MEMS, microfluidics, RF, optical/photonic devices)EngineeringLine Width down to 100 µm (NANOFABRICATOR LITE)100 mm–––
Edge passivation for highly efficient solar cells (ACES project)Surface––––Silicon, Copper (silver substitution in metallization)

3 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
NANOFABRICATOR™ LITE (atomic deposition tool for research/academia)ATLANT 3D NANOFABRICATOR LITE–Sample size up to 100 mm; Line Width down to 100 µm; Deposition speed up to 200 mm/s; up to 2––
NANOFABRICATOR™ PRO (Industrial R&D tool)ATLANT 3D NANOFABRICATOR PRO––––
NANOFABRICATOR® ZERO-GATLANT 3D NANOFABRICATOR ZERO-G––––

Additional services

Innovation ServicesAtomically precise material deposition (DALP®)Prototyping of micro- and nanodevicesScalable manufacturing

History

  1. 2024

    Launch of the EU-funded ACES project (Horizon Europe, budget EUR 3.5 million) in April 2024, among other things for edge passivation for highly efficient solar cells.

  2. 2024

    Launch of the EU-funded CLOSER project (Horizon Europe, budget EUR 14 million) in October 2024 to build a European circular economy supply chain for semiconductor raw materials.

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