Develops and manufactures equipment for semiconductor assembly: die-attach, packaging and plating systems
BE Semiconductor Industries N.V. (Besi)
Duiven (NL) · Steinhausen (CH) · Radfeld (AT) · 's-Hertogenbosch (NL) · Shah Alam (MY) · Leshan (CN) · Singapore (SG) · Sungnam-si (KR) · Muntinlupa (PH) · Shanghai (CN) · Zhubei City (TW) · BangkokNew on Amplifa
About Besi
BE Semiconductor Industries N.V. (Besi) is a manufacturer of assembly equipment for the global semiconductor and electronics industry. The company develops and manufactures systems for leadframe, substrate and wafer-level packaging: die-bonding and hybrid-bonding platforms (Datacon, Esec), molding, trim & form and singulation systems (Fico), as well as continuous plating and cleaning systems for leadframes and solar applications (Meco). Processes cover epoxy, soft solder, flip chip, multi-chip and thermo-compression bonding as well as tin, copper and precious metal plating. Customers are primarily semiconductor manufacturers (IDMs), assembly subcontractors and electronics and industrial companies in the end markets electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar. Besi is a Dutch N.V. (public limited company) headquartered in Duiven; product development takes place mainly in Europe (Netherlands, Switzerland, Austria), manufacturing in Shah Alam (Malaysia) and Leshan (China). At the end of 2025 the company employed 1,964 people, of whom around 66% in Asia and 34% in Europe and North America. The shares are listed on Euronext Amsterdam (BESI).
- Site
- RW Duiven
- Processes
- Die attach (epoxy, soft solder, flip chip, multi-chip, multi module, TCB, hybrid bonding, FOWLP,, Hybrid bonding, Thermo compression bonding (TCB), Molding (conventional, ultra thin, wafer level), Trim & form, Singulation / sawing (including laser cutting), Leadframe plating (tin, copper, precious metal), Connector plating
- Materials
- Copper, Tin, Precious metals (gold/silver), Silicon, Silicon carbide (SiC), Gallium nitride (GaN), Epoxy (die attach / molding compound)
- Certificates
- ISO 9001:2015, ISO 14001:2015, ISO 45001:2018
- Founded
- 1995 (May,
- Employees
- 1,964 (end of 2025;
- Industries
- Semiconductor industry, Electronics, Mobile internet, Cloud server/computing, Automotive, Industrial
- 01
Product development (Europe)
- 02
Design of package/leadframe/process solutions
- 03
Manufacturing (Shah Alam, Leshan)
- 04
Assembly & test
- 05
Sales & service worldwide
- 06
After sales: spares, conversion kits, support
Processes & Materials
Copper
Leadframes, trim & form and copper plating for the semiconductor and solar industry.
Tin
Tin plating on leadframes; autocatalytic immersion tin coating for wettable flank (QFN/DFN).
Precious metals (gold/silver)
Precious metal coatings for leadframe and electronics applications.
Silicon
Chips in die attach, flip chip and hybrid bonding.
Silicon carbide (SiC)
Power electronics chips for hybrid bonding and chiplet applications (among others the HyPACT project).
Gallium nitride (GaN)
Semiconductor material for high-performance and power electronics packages.
Epoxy (die attach / molding compound)
Adhesives and molding compounds for die attach as well as conventional, ultra-thin and wafer-level molding.
Sites & Manufacturing
Duiven, NL
NLHeadquarters; Besi Netherlands B.V. – Packaging product group (Fico)
- Fico molding systems (AMS-X, MMS-X)
- Fico trim & form lines
- Fico sawing lines
- Process technology laboratory (X-ray, acoustic microscope, SEM)
Steinhausen, CH
CHBesi Switzerland AG – Die Attach HQ
- Datacon 2200 evo series
- Esec 2100 series
Radfeld, AT
ATBesi Austria GmbH – Flip-chip and multi-chip development
's-Hertogenbosch, NL
NLMeco Equipment Engineers B.V. – Plating product group
- Meco leadframe/solar/connector plating systems
- Meco WFL-20 wettable flank
Shah Alam, MY
MYBesi APac Sdn. Bhd. – Manufacturing (equipment, tools, molds; plating production since 2015)
Leshan, CN
CNBesi Leshan Co. Ltd – Manufacturing
Singapore, SG
SGBesi Singapore Pte. Ltd. – Die attach (Asia), sales/service
Equipment & Systems
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Die attach (epoxy, soft solder, flip chip, multi-chip, multi module, TCB, hybrid bonding, FOWLP,Assembly | – | – | – | – | Epoxy, Soft solder |
| Hybrid bondingAssembly | – | – | – | – | Silicon, SiC, GaN |
| Thermo compression bonding (TCB)Assembly | – | – | – | – | – |
| Molding (conventional, ultra thin, wafer level)Plastics | – | – | – | – | – |
| Trim & formForming | – | – | – | – | Copper |
| Singulation / sawing (including laser cutting)Cutting | – | – | – | – | – |
| Leadframe plating (tin, copper, precious metal)Surface treatment | – | – | – | – | Tin, Copper, Precious metals (gold, silver) |
| Connector platingSurface treatment | – | – | – | – | – |
| Solar platingSurface treatment | – | – | – | – | – |
| Film and foil platingSurface treatment | – | – | – | – | – |
| Leadframe wet processing / cleaningSurface treatment | – | – | – | – | – |
| Immersion tin plating (autocatalytic) for wettable flank (QFN/DFN)Surface treatment | – | – | – | – | Copper, Tin |
45 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Hybrid bonding platform | Besi (Datacon) Datacon 8800 CHAMEO ultra plus AC | – | – | – | – |
| Thermo compression bonder | Besi 9800 TC next | – | – | – | – |
| Multi-chip die bonder | Besi (Datacon) Datacon 2200 evo | – | – | – | – |
| Multi module attach die bonder | Besi (Datacon) Datacon 2200 evo plus | – | – | – | – |
| Multi-chip die bonder (high bond forces) | Besi (Datacon) Datacon 2200 evo hF | – | – | – | – |
| Multi module attach die bonder | Besi (Datacon) Datacon 2200 evo hS | – | – | – | – |
| Multi module attach die bonder | Besi (Datacon) Datacon 2200 evo advanced | – | – | – | – |
| Die bonder (300 mm high-speed) | Besi (Esec) Esec 2100 hS iXplus | – | 300 mm | – | – |
| Die bonder | Besi (Esec) Esec 2100 sD advanced i | – | – | – | – |
| Die bonder | Besi (Esec) Esec 2100 hS i | – | – | – | – |
| Die bonder (300 mm high-speed) | Besi (Esec) Esec 2100 hS | – | 300 mm | – | – |
| Die bonder (smart card tape) | Besi (Esec) Esec 2100 SC | – | 300 mm | – | – |
| Soft solder die bonder | Besi (Esec) Esec 2100 SSI | – | – | – | – |
| Soft solder die bonder | Besi (Esec) Esec 2009 SSI E | – | – | – | – |
| Soft solder die bonder | Besi (Esec) Esec 2009 fS E | – | – | – | – |
| Flip chip bonder | Besi (Datacon) Datacon 8800 FC QUANTUM advanced | – | – | – | – |
| Flip chip bonder | Besi (Datacon) Datacon 8800 FC QUANTUM advX | – | – | – | – |
| Flip chip bonder | Besi (Datacon) Datacon 8800 CHAMEO advanced | – | – | – | – |
| Flip chip bonder | Besi (Esec) Esec 2100 FC hS | – | – | – | – |
| Molding system | Besi (Fico) AMS-X | – | – | – | – |
| Molding system | Besi (Fico) MMS-X | – | – | – | – |
| Molding line | Besi (Fico) Fico Molding Line | – | – | – | – |
| Molding system | Besi (Fico) Fico AMS-LM | – | – | – | – |
| Molding system | Besi (Fico) Fico AMS-LM Top Foil | – | – | – | – |
| Molding system | Besi (Fico) Fico MMS-LM | – | – | – | – |
| Molding system | Besi (Fico) Fico MMS-LM Top Foil | – | – | – | – |
| Molding system | Besi (Fico) Fico AMS-i | – | – | – | – |
| Molding system | Besi (Fico) Fico MMS-i | – | – | – | – |
| Trim & form line | Besi (Fico) Fico Compact Line - X | – | – | – | – |
| Trim & form line | Besi (Fico) Fico Compact Line - P | – | – | – | – |
| Singulation/sawing line | Besi (Fico) Fico Sawing Line | – | – | – | – |
| Leadframe wet processing / cleaning system | Meco Meco CDL 1500 | – | – | – | – |
| Leadframe wet processing system | Meco Meco FXL | – | – | – | – |
| Leadframe plating system | Meco Meco ACP | – | – | – | – |
| Leadframe plating system (silver, roll-to-roll) | Meco Meco RTR Ag | – | – | – | – |
| Leadframe plating system | Meco Meco EDF/EPL | – | – | – | – |
| Connector plating system | Meco Meco Connector Plating | – | – | – | – |
| Solar plating system | Meco Meco DPL | – | – | – | – |
| Solar plating system | Meco Meco PPL | – | – | – | – |
| Solar plating system (roll-to-roll) | Meco Meco RTR Solar | – | – | – | – |
| Solar plating system | Meco Meco CPL | – | – | – | – |
| Film and foil plating system | Meco Meco FAP | – | – | – | – |
| Plating system | Meco Meco EPL 4 | – | – | – | – |
| Wettable flank plating system (tape ring 8"/10"/12", 20 tape rings/h) | Meco Meco WFL-20 | – | Tape ring 8"/10"/12" | – | – |
| Saw singulation system (substrate 28–90 mm wide, 60–280 mm long, changeover time <5 min) | Besi (Fico) Fico Saw Singulation (Saw Conversion Kit) | – | Substrate width 28–90 mm, substrate length 60–280 mm | – | – |
Additional services
Reference customers
Quality & Certifications
Besi certifications according to ISO 9001, ISO 14001 and ISO 45001 are in place at the Duiven, Steinhausen/Radfeld/Singapore, Shah Alam and Leshan sites and at Meco ('s-Hertogenbosch). Initial certifications were obtained in 2010 (Besi Switzerland) and 2012 (Besi APac).
| Evidence | Besi Netherlands / Meco | Besi Switzerland / Austria / Singapore | Besi APac | Besi Leshan |
|---|---|---|---|---|
| ISO 9001:2015 | ||||
| ISO 14001:2015 | ||||
| ISO 45001:2018 |
History
- 1995
Incorporation under Dutch law (May) and IPO (December); listing on Euronext Amsterdam (BESI), Level 1 ADRs OTC (BESIY).
- 2010
Besi Switzerland AG: first ISO 9001/14001 certification (March).
- 2012
Besi APac: first ISO 9001/14001 certification (July).
- 2015
Relocation of plating production from Meco to Shah Alam, Malaysia.