Development, validation and series production of high-quality electronics solutions (EMS) for Mobility, Healthcare, Energy, IoT, Security and Automation.
BECOM Electronics GmbH
Hochstraß (AT) · Vienna (AT) · Heyuan (CN) · Hungary (HU) · Germany (DE)New on Amplifa
About BECOM Electronics
BECOM Electronics GmbH is an internationally active electronics manufacturing services (EMS) provider with headquarters in Hochstraß, Burgenland. The family-run company, founded in 1984 as Burgenländische Elektronik- und Kommunikationssysteme and today managed by the second generation, supports customers throughout the entire product life cycle: from research & development through design, validation and prototype construction to series production, supply chain management and customer services. Around 2,500 different electronics products and assemblies are manufactured with lot sizes of 10 to 10 million units per year; the Hochstraß site offers capacity for approx. 40,000 3D-ToF cameras per year, including automated calibration rigs. In addition to EMS services, BECOM develops and produces its own products such as 3D time-of-flight cameras (Argos series, TOREO-P650) and embedded vision solutions. Customers come from the automotive, railway, marine, medical technology, IoT/IIoT, energy, security and automation industries. Validation includes accredited EMC testing according to ISO/IEC 17025, environmental and electrical testing as well as thermal management; an in-house microsection laboratory with Zeiss analytical microscopes supports quality analysis. With around 450 employees and eight locations, including in Austria, China, Hungary and Germany, the company generated revenue of 106 million euros in 2018.
- Site
- Hochstraß
- Processes
- Electronics Manufacturing Services (EMS) – Electronics manufacturing (development, validation,, EMC testing according to ISO/IEC 17025, Environmental and electrical testing, thermal management, Cross-section analysis (PCB layer structures, damaged SMD components, hole structures, press-fit, Manufacturing and automated calibration of 3D ToF cameras (approx. 40,000 cameras/year), Research & Development / Engineering (from concept to production-ready product), Manufacturing & Supply Chain Management (NPI, logistics, material and obsolescence management), Research & Development
- Materials
- Electronics Manufacturing (Electronics Manufacturing Services), 3D Time-of-Flight Cameras, Accredited EMC Testing (ISO/IEC 17025), Microsection Laboratory / Cross-Section Analysis, New Product Introduction
- Certificates
- ISO 9001, IATF 16949:2016, ISO 13485, ISO/IEC 17025 (accredited EMC testing), IATF 16949, ISO/IEC 17025
- Founded
- 1984
- Employees
- 450
- Industries
- Mobility (Automotive, Railway, Marine), Medical Technology / Healthcare, IoT / IIoT, Energy (Smart Grids, Energy Storage, Charging Infrastructure), Security, Automation / Industry 4.0
- 01
Research & Development
- 02
Design & Engineering
- 03
Validation (EMC, environmental and electrical testing, thermal management)
- 04
Prototype construction / NPI
- 05
Series production (EMS)
- 06
Manufacturing & Supply Chain (material and obsolescence management)
- 07
Logistics
- 08
Customer Services / After-Sales
Processes and Testing Services
Electronics Manufacturing (Electronics Manufacturing Services)
PCB assembly and series production of electronic assemblies for automotive, industrial and medical applications.
3D Time-of-Flight Cameras
In-house products with sensors from Infineon, manufactured and automatically calibrated in Hochstraß.
Accredited EMC Testing (ISO/IEC 17025)
Electromagnetic compatibility testing for product validation throughout the entire life cycle.
Microsection Laboratory / Cross-Section Analysis
Analysis of PCB layer structures, damaged SMD components, hole structures and press-fit pins with Zeiss analytical microscopes.
New Product Introduction
Industrialization of new products including feasibility assessments and certification.
Locations
Hochstraß
ATHeadquarters and production site
- Lot size
- 10 – 10 Mio. Stück/Jahr (Gruppe)
- Materials
- Electronics / EMS
- Automated calibration rigs for ToF cameras (capacity approx. 40,000/year)
- Zeiss analytical microscopes (microsection laboratory, since 2019)
Vienna
ATSite BECOM Sensor Solutions / Embedded Systems (ToF and sensor development)
Heyuan
CNProduction site (BECOM Electronics (Heyuan) Co. Ltd.)
Hungary
HUSite
Germany
DESite, among others sales (IVP Group Germany)
Products and Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Electronics Manufacturing Services (EMS) – Electronics manufacturing (development, validation,Assembly | – | – | – | 10 Stück/Jahr – 10 Millionen Stück/Jahr | – |
| EMC testing according to ISO/IEC 17025Testing | – | – | – | – | – |
| Environmental and electrical testing, thermal managementTesting | – | – | – | – | – |
| Cross-section analysis (PCB layer structures, damaged SMD components, hole structures, press-fitTesting | – | – | – | – | – |
| Manufacturing and automated calibration of 3D ToF cameras (approx. 40,000 cameras/year)Assembly | – | – | – | 40.000 Kameras pro Jahr | – |
| Research & Development / Engineering (from concept to production-ready product)Engineering | – | – | – | – | – |
| Manufacturing & Supply Chain Management (NPI, logistics, material and obsolescence management)Assembly | – | – | – | – | – |
2 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Analytical microscope (microsection laboratory) | Zeiss | – | – | 2019 | Hochstraß |
| Automated calibration rigs for ToF cameras | – | – | Capacity approx. 40,000 cameras per year | 2018 | Hochstraß |
Additional services
Reference customers
Quality and Certifications
Quality assurance includes accredited EMC testing according to ISO/IEC 17025, environmental and electrical testing, and an in-house microsection laboratory in Hochstraß with Zeiss analytical microscopes for failure analysis prior to series production. The Burgenland site has been ISO 9001 certified for 30 years (Quality Austria); the Heyuan site holds ISO 9001 and IATF 16949:2016.
| Evidence | Hochstraß | Heyuan |
|---|---|---|
| ISO 9001 | ||
| IATF 16949 | ||
| ISO 13485 | ||
| ISO/IEC 17025 |
Company History
- 1984
Founded as Burgenländische Elektronik- und Kommunikationssysteme (subsidiary of BEWAG).
- 1985
Start of production in Hochstraß, among other things mobile phones.
- 2011
Sale of the company by BEWAG.
- 2016
Acquisition of the Vienna-based sensor company Bluetechnix.
- 2018
Record revenue of 106 Mio. €; acquisition of the majority stake in IVP Group Germany.
- 2019
Opening of a state-of-the-art microsection laboratory at the Hochstraß site.
- 2021
Bernhard Wieser takes over management of BECOM Systems GmbH; ISO 9001 certification and IATF Letter of Conformance for Heyuan; COVID-19-related revenue decline of almost 25%.
- 2022
IATF 16949:2016 certification for BECOM Electronics (Heyuan); Burgenland Innovation Award for the 3D camera TOREO-P650.
- 2023
Award for 30 years of ISO 9001 certification.
- 2024
Burgenland Innovation Award (large enterprise category) for "Complex Miniaturization of Embedded Vision for the Smart City".
- 2025
Managing directors Johannes and Roman Bock win Entrepreneur Of The Year in the Innovation & High-Tech category.