Manufacturer of fast high-voltage power switches and pulse generators up to 200 kV in silicon and SiC semiconductor technology
Behlke Power Electronics GmbH
Königstein (DE) · USA (Branch BEHLKE USA)New on Amplifa
About Behlke Power Electronics
Behlke Power Electronics GmbH manufactures fast high-voltage power switches (solid-state switches) for voltages from 1 to 200 kV in single-switch as well as bridge and push-pull configurations for AC and DC. The product range comprises more than 700 standard switches and pulsers based on a highly flexible, modular building-block system, complemented by technical special variants and customer-specific solutions. In addition to semiconductor stacks in silicon and SiC technology (silicon carbide), high-voltage pulsers with rise times down to 0.8 ns and peak currents up to 16,000 A are manufactured. The products are cooled as required by water cooling, dielectric direct liquid cooling (DLC), contact cooling via flange (ALN or copper) or convection; heat sinks are made of copper composite, graphite and ceramic. Customer industries include science and research, industry, military/defense, laser and medical technology, e.g. for particle accelerators, plasma generators, pulse laser drivers or medical shock wave generators. Production is carried out ESD-protected in a clean environment with automated SMD assembly, vacuum potting and MIL/HIREL-qualified microelectronics processes. The company offers a 5-year warranty on its products and supplies worldwide.
- Site
- Königstein
- Processes
- Manufacture of fast high-voltage power switches / semiconductor stacks (1–200 kV, AC & DC, bridge, High-voltage pulsers / pulse generators (± HV pulse, PPC option, di/dt up to 32 kA/µs, rise times, Dielectric direct liquid cooling (DLC) with coolants such as PFPE, PFC & silicone oil;, Water cooling, contact cooling via flange (ALN or copper), convection cooling with/without, Qualified microelectronics manufacturing (MIL/HIREL): dry storage of components, full, Automated SMD assembly, Plasma treatment, Vacuum potting (machined vacuum potting)
- Materials
- Silicon semiconductors, SiC (silicon carbide), PFPE, PFC, Silicone oil, Copper, Aluminum nitride (ALN), Graphite
- Certificates
- Series production with quality statistics, Burn-in procedures, Climate & thermal cycling tests, ESD-safe manufacturing, ISO 9001
- Industries
- Science and research, Industry, Military/defense, Laser, Medical technology
- 01
Engineering: high-voltage circuit development and customer-specific solution
- 02
Component preparation: dry storage, full component screening,
- 03
Plasma treatment of substrates
- 04
Automated SMD assembly in an ESD-safe, clean environment
- 05
Vacuum potting of the power modules
- 06
Laser marking of products and labels
- 07
Final assembly of the semiconductor stacks including cooling integration
- 08
Testing: climate tests, thermal cycling tests, burn-in, series quality
Locations
Königstein
DEHeadquarters; new factory building (building permit granted, investment € 25 Mio., approx. 6,500 m² total usable floor
- Materials
- Silicon, SiC, copper, AlN
- Pump unit PU-2 for DLC cooling
BEHLKE USA
USABranch
Products & assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Manufacture of fast high-voltage power switches / semiconductor stacks (1–200 kV, AC & DC, bridgeAssembly | – | – | – | – | Silicon semiconductors, SiC (silicon carbide), Copper, Aluminum nitride (ALN), Ceramic, Graphite |
| High-voltage pulsers / pulse generators (± HV pulse, PPC option, di/dt up to 32 kA/µs, rise timesAssembly | – | – | – | – | Silicon semiconductors, SiC (silicon carbide) |
| Dielectric direct liquid cooling (DLC) with coolants such as PFPE, PFC & silicone oil;Surface | – | – | – | – | PFPE, PFC, Silicone oil |
| Water cooling, contact cooling via flange (ALN or copper), convection cooling with/withoutSurface | – | – | – | – | Copper, Aluminum nitride (ALN), Copper composite, Graphite, Ceramic |
| Qualified microelectronics manufacturing (MIL/HIREL): dry storage of components, fullAssembly | – | – | – | – | – |
| Automated SMD assemblyAssembly | – | – | – | – | – |
| Plasma treatmentSurface | – | – | – | – | – |
| Vacuum potting (machined vacuum potting)Assembly | – | – | – | – | – |
| Laser marking of products and labelsSurface | – | – | – | – | – |
| ESD-safe manufacturing in a clean environmentAssembly | – | – | – | – | – |
| Testing: climate tests, thermal cycling tests, burn-in procedures, series production withTesting | – | – | – | – | – |
| Engineering: high-voltage circuit development, customer-specific solutions, OEM products forEngineering | – | – | – | – | – |
1 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Pump unit for DLC cooling | BEHLKE PU-2 | – | – | – | – |
Additional services
Quality & testing
Production is carried out ESD-protected in a clean environment with qualified MIL/HIREL microelectronics processes. Quality is ensured through full component screening, component tracking, visual inspection, laser marking with serial number, climate tests, thermal cycling tests and documented burn-in procedures with quality statistics.
| Evidence | Königstein |
|---|---|
| Series production with quality statistics | |
| Burn-in procedures | |
| Climate & thermal cycling tests | |
| ESD-safe manufacturing | |
| ISO 9001 |
History
- 2026
Building permit granted for the new factory in Königstein (Germany); investment of € 25 Mio. ($ 29 Mio.) in a laboratory and production building with approx. 4,000 m² plus 2,500 m² machine/warehouse space (total approx. 6,500 m²). Groundbreaking September 2026, move-in approx. 18 months later.