Development and manufacturing of electronic controls, assemblies and potential-free sensors including encapsulation.
Belatronic Technologies GmbH
89340 Leipheim (Am Tower 4, Areal Pro)New on Amplifa
About Belatronic
Belatronic Technologies GmbH is an electronics service provider based in Leipheim that develops and manufactures custom controls and control systems from the initial idea and requirements specification through to production-ready manufacturing. The service portfolio includes PCB assembly of pure SMD, through-hole and mixed-technology boards including material procurement and stocking, soldering on a wave soldering system and IR soldering system, as well as encapsulation (potting) of electronics with 1- and 2-component compounds for protection against water, weather and environmental influences. The offering is complemented by development-accompanying EMC testing (burst, ESD, radiated emission), final inspection according to customer specifications and shipping-ready packaging. Production is designed for prototypes, small series and medium volumes. In addition to contract manufacturing, the company develops and produces its own potential-free rain, wind and temperature sensors. Customers include businesses from the trades and industry, among them Roto, Velux, Knauf PFT and Winkhaus. Around twelve employees manufacture on approximately 300 m² of production space in the building Am Tower 4 on the Areal Pro site, the former airfield in Leipheim.
- Site
- Leipheim
- Processes
- Development of electronic assemblies and complete control systems (requirements specification,, Development-accompanying EMC testing (burst, ESD, radiated emission of the PCB), Contract manufacturing of PCB assembly: pure SMD boards, through-hole assembled boards,, Soldering of PCBs (SMD & through-hole), rework/addition of SMD components, wave soldering, Encapsulation (potting) of electronic assemblies (1-component and 2-component encapsulation, Final inspection of manufactured assemblies according to customer specifications (electrical and, Production of electronic assemblies, devices and ready-to-sell end products;, Development of custom controls and control systems
- Materials
- SMD assembly, Through-hole assembly, 1-component encapsulation compound, 2-component encapsulation compound
- Certificates
- DIN EN ISO 9001:2015, ISO 9001
- Founded
- 1992
- Employees
- 12
- Industries
- Trades, Industry, Construction machinery/Construction technology, Solar technology, Conservatory/louver drive technology
- 01
Development (requirements specification, prototype, production readiness)
- 02
EMC testing (burst, ESD, radiated emission)
- 03
Material procurement and stocking
- 04
PCB assembly (SMD, through-hole, mixed-technology)
- 05
Soldering (pick-and-place machine, wave soldering, IR soldering system, rework
- 06
Cable assembly
- 07
Encapsulation (1- and 2-component)
- 08
Final inspection according to customer specifications
- 09
Shipping-ready packaging
Processes and Services
SMD assembly
Assembly of pure SMD boards on a modern pick-and-place machine; hand-assembled for prototypes.
Through-hole assembly
Assembly of through-hole boards at five manual workstations, also mixed-technology with SMD.
1-component encapsulation compound
Encapsulation of assemblies for protection against water, weather and environmental influences.
2-component encapsulation compound
Machine encapsulation with 2-component material for special product requirements.
Locations
Leipheim
DEOffice and production site (development, contract manufacturing, encapsulation)
- Lot size
- Prototype, small series, medium volumes
- Materials
- Electronic assemblies, 1- and 2-component encapsulation compounds
- SMD pick-and-place machine
- 2 manual SMD placement machines (prototypes)
- 5 manual workstations for through-hole assembly
- Wave soldering system
- IR soldering system
- Encapsulation machine
- Production-specific test stations
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Development of electronic assemblies and complete control systems (requirements specification,Engineering | – | – | – | – | – |
| Development-accompanying EMC testing (burst, ESD, radiated emission of the PCB)Testing | – | – | – | – | – |
| Contract manufacturing of PCB assembly: pure SMD boards, through-hole assembled boards,Assembly | – | – | – | – | – |
| Soldering of PCBs (SMD & through-hole), rework/addition of SMD components, wave solderingJoining | – | – | – | – | – |
| Encapsulation (potting) of electronic assemblies (1-component and 2-component encapsulationJoining | – | – | – | – | – |
| Final inspection of manufactured assemblies according to customer specifications (electrical andTesting | – | – | – | – | – |
| Production of electronic assemblies, devices and ready-to-sell end products;Assembly | – | – | – | – | – |
7 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD pick-and-place machine | – | 1 | – | – | – |
| Manual SMD placement machine (prototypes) | – | 2 | – | – | – |
| Manual workstation for through-hole assembly | – | 5 | – | – | – |
| Wave soldering system | – | 1 | – | – | – |
| IR soldering system | – | 1 | – | – | – |
| Encapsulation machine | – | – | – | – | – |
| Test station | – | – | – | – | – |
Additional services
Reference customers
Quality
Production is supported by a quality management system according to DIN EN ISO 9001:2015; specially configured test stations are available for every production process. Manufacturing is completed with a final inspection according to customer specifications, including electrical and visual inspections.
| Evidence | Leipheim |
|---|---|
| ISO 9001 |
Company History
- 1992
Foundation of Belatronic Solar- und Regelungssysteme GmbH by Dipl.-Ing. Jürgen Beuth and Josef Laser.
Custom development and production for Roto (conservatory control/windows), sensor development for Velux, development of the potential-free rain sensor RSP-RP1.
Partial conversion to SMD with an IR soldering system, development of the potential-free sensors RP-LCV and RWP-W, expansion of floor space and acquisition of a semi-automatic encapsulation machine.
Entry into solar technology with the first developments of solar-powered controls.
First automated pick-and-place machine; expansion of the development and production departments.
20th anniversary; co-founder Josef Laser passes away unexpectedly.
Continuation of the company by Jürgen Beuth and redesign of the business presence.
Renaming of the company; relocation and modernization of production, acquisition of a second SMD pick-and-place machine.
Restructuring of production, acquisition of a wave soldering system; encapsulation is brought back in-house.
- 2017
Certification according to DIN EN ISO 9001:2015 in time for the 25th anniversary.
- 2019
Development of the SmartControl control system with Knauf PFT; presentation of the PFT RITMO DOUBLE MIX at bauma in Munich.
- 2020
Jenny Beuth becomes Managing Director on 15.10.2020; gradual transition of company leadership.
Move in mid-November to new office and production facilities at Tower 4 on the Areal Pro site, the former airfield in Leipheim.