Development and production of custom industrial electronics, assemblies and devices with full service from SMT assembly to testing.
Bepro AG
Güttingen, Canton Thurgau, SwitzerlandNew on Amplifa
About Bepro
Bepro AG, based in Güttingen in the canton of Thurgau, is a Swiss provider of industrial electronics and has been active in the development and production of electronic assemblies and devices for over 40 years. The company covers the entire value chain: hardware and software development, PCB layout, material procurement as well as SMT and THT assembly, soldering, cleaning, conformal coating, testing and final assembly. Across two SMT production lines, up to 165'000 components per hour can theoretically be placed; the component spectrum ranges from 01005 to QFP400 with 0.35 mm pitch. Thanks to a modular line configuration, Bepro manufactures everything from prototypes and small series to volume production. For quality assurance, 3D AOI, flying probe testing (SPEA 4060), in-circuit, functional and burn-in tests are used. 50 employees work at the Güttingen site on a production floor within a 3200 m² factory building. Customers come from industry, especially from fields involving measurement, control and power electronics.
- Site
- Güttingen, Switzerland
- Processes
- SMT assembly, THT assembly (conventional assembly), Wave soldering (standard wave soldering system, nitrogen wave soldering system), Selective soldering (in-line selective soldering system), Reflow soldering (8-zone convection reflow soldering system), 3D AOI (automatic optical inspection), Screen printing (fully automatic screen printer with optical print inspection), Assembly washing (removal of flux residues, resins)
- Materials
- SMT Assembly
- Certificates
- ISO 9001:2015
- Founded
- 1980
- Industries
- Industrial electronics, Measurement and control technology, Power electronics
Manufacturing Processes
SMT Assembly
Placement of components from 01005 to QFP400 with 0.35 mm pitch on two lines.
Locations
Güttingen
CHDevelopment, Manufacturing, Sales
- Lot size
- Prototypes to volume production
- Materials
- industrial electronics, SMD and THT
- 2 SMT production lines
- SMD placement machine FX-3
- SMD placement machines RS1 series
- 2 screen printers with automatic optical print inspection
- 2 8-zone convection reflow soldering systems
- In-line selective soldering system ErsaFlow
- Nitrogen wave soldering system
- 3D AOI system KohYoung
- Flying probe test system SPEA 4060
Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMT assemblyAssembly | – | – | – | Prototypes – Volume production | 01005 to QFP400 with 0.35mm pitch |
| THT assembly (conventional assembly)Assembly | – | – | – | Small series | – |
| Wave soldering (standard wave soldering system, nitrogen wave soldering system)Joining | – | – | – | – | – |
| Selective soldering (in-line selective soldering system)Joining | – | – | – | – | – |
| Reflow soldering (8-zone convection reflow soldering system)Joining | – | – | – | – | – |
| 3D AOI (automatic optical inspection)Testing | – | – | – | – | – |
| Screen printing (fully automatic screen printer with optical print inspection)Assembly | – | – | – | – | – |
| Assembly washing (removal of flux residues, resins)Surface | – | – | – | – | – |
| Conformal coating / encapsulationSurface | – | – | – | – | – |
| Testing (optical, in-circuit, functional and burn-in tests)Testing | – | – | – | – | – |
| Flying probe test (SPEA 4060, 6 needles, adapter-free)Testing | – | – | – | Prototypes – Small series | – |
| Assembly of subassemblies incl. packaging and accessories, final testingAssembly | – | – | – | – | – |
| Material procurement / electronic components purchasingEngineering | – | – | – | – | – |
| Hardware development (analog, digital and microprocessor technology, measurement and powerEngineering | – | – | – | – | – |
| Software development (C, C++, LabView, real-time applications)Engineering | – | – | – | – | – |
| PCB layout (two-layer and multilayer boards, SMD and THT, multilayer and flex circuits)Engineering | – | – | – | – | – |
9 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD placement machine | FX-3 | – | – | 2011 | Güttingen |
| SMD placement machine | RS1 series | – | – | 2019/2022 | Güttingen |
| Screen printer with automatic optical print inspection | – | 2 | – | 2013 | Güttingen |
| Reflow soldering oven (8-zone convection reflow soldering system) | – | 2 | – | 2019 | Güttingen |
| In-line selective soldering system | ErsaFlow | 1 | – | 2012 | Güttingen |
| Nitrogen wave soldering system | – | 1 | – | 2021 | Güttingen |
| 3D AOI system | KohYoung | – | – | 2018 | Güttingen |
| Flying probe test system (6 freely programmable needles) | SPEA 4060 | 1 | – | – | Güttingen |
| SMT production line | – | 2 | – | – | Güttingen |
Quality
A 3D AOI system (KohYoung) inspects the height, solder volume and position of solder joints. For flexible testing of prototypes and small series, a flying probe test system (SPEA 4060) with six programmable needles is available; supplemented by in-circuit, functional and burn-in tests.
| Evidence | Güttingen |
|---|---|
| ISO 9001:2015 |
History
- 1980
Founding of Gebrüder Bilgery AG
- 1990
Founding of Bepro AG
- 1991
Construction of a new commercial building at Altnauerstrasse 13, Güttingen
- 1997
Commissioning of the first SMD production line
- 2001
Certification according to ISO 9001
- 2004
Merger of the two companies Bepro AG and Bilgery AG; construction and occupancy of the new production building with 1500 m²
- 2005
Expansion of SMD production capacity
- 2008
Expansion of the factory building to 3200 m²
- 2009
Commissioning of the 51-kWp photovoltaic system
- 2011
Commissioning of the SMD placement machine FX-3 and new ERP system
- 2012
Acquisition of the ErsaFlow selective soldering system
- 2013
Two new screen printers with automatic optical print inspection
- 2017
Complete renewal of the IT infrastructure
- 2018
Introduction of 3D AOI from KohYoung
- 2019
Introduction of the SMD placement machine RS1 and replacement of the reflow soldering ovens on both lines
- 2020
Expansion of the management board; further automation of the selective soldering line
- 2021
Replacement of the nitrogen wave soldering system
- 2022
Complete renewal of the high-speed SMD line with placement machines of the RS1 series