Develops and manufactures high-performance die-cutting machines, die-cutting tools and packaging robotics with digital IIoT integration.
BERHALTER Swiss Die-Cutting (A Division of BERHALTER AG)
Lindenstrasse 120, CH-9443 WidnauNew on Amplifa
About BERHALTER Swiss Die-Cutting
BERHALTER Swiss Die-Cutting is a division of BERHALTER AG headquartered in Widnau, Switzerland, specializing in high-performance die-cutting technology for the packaging and label industry. The company develops and manufactures rotary die-cutting machines such as the Swiss Die-Cutter™ B6 and B4, which process substrates of 25–200 µm at over 500 strokes per minute, as well as high-precision die-cutting tools. The portfolio also includes the BEAMstack™ packaging robotics line, the digital IIoT platform CUTcontrol™ for machine data and KPI analysis, material testing and embossing technology. The offering is rounded out by lifecycle services: installation, maintenance, spare parts, tool regrinding service, training, financing consulting and product development through to sampling. Customers are die-cutting companies, printing houses and food manufacturers in the food, beverages, pet care, pharma and non-food sectors; delivery is worldwide.
- Site
- Widnau
- Processes
- Die-Cutting (Rotary Die-Cutting), Embossing, Material Testing / Material Analysis, Die-Cutting Tool Resharpening Service, Tool Manufacturing (Die-Cutting Tools), Sampling & Product Development, Splice Detection / Material Analysis with Ultrasonic Sensor, Packaging Robotics (BEAMstack™ Packaging Robotics)
- Materials
- Film / Substrates 25–200 µm, Plastic film (thin substrates, e.g. 30 µm), Paper (paper rolls), Multilayer films, Swiss Die-Cutter™ B6, Swiss Die-Cutter™ B4, BEAMstack™ Packaging Robotics, CUTcontrol™ IIoT Platform
- Industries
- Food, Beverages, Pet Care, Pharma, Non-Food, Packaging Industry
- 01
Engineering & Product Development
- 02
Material Testing
- 03
Tool Manufacturing (Die-Cutting Tools)
- 04
Machine Assembly (Swiss Die-Cutter)
- 05
Installation & Commissioning
- 06
Service, Regrinding & Maintenance
- 07
Digitalization (CUTcontrol™ IIoT)
Materials & Processes
Swiss Die-Cutter™ B6
High-performance die-cutting machine for substrates 25–200 µm at up to over 500 strokes per minute.
Swiss Die-Cutter™ B4
Die-cutting machine for thin film and paper substrates in the 25–200 µm range.
BEAMstack™ Packaging Robotics
Automated handling and packaging robotics for the further processing of die-cut products.
CUTcontrol™ IIoT Platform
Digital platform for KPI analysis, diagnostics and service optimization of the die-cutting machines.
Embossing
Process for finishing and brand experience on packaging substrates.
Material Testing
Analysis of material behavior under speed, pressure and tension to optimize die-cutting parameters and tool life.
Tool Regrinding Service
Professional regrinding of the die-cutting components with final inspection on a BERHALTER machine and tool data provided via data sheet or RFID.
Locations
Widnau
CHHeadquarters, development and manufacturing
- Materials
- Substrates 25–200 µm (films, plastic film, paper, multilayer films)
- Swiss Die-Cutter™ B6
- Swiss Die-Cutter™ B4
- High-Performance Dancer Unit
- Control Pad Splice Table
- Ultrasonic Sensor for Splice Detection
- CUTcontrol™ IIoT Platform
Products & Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Die-Cutting (Rotary Die-Cutting)Forming | – | – | – | – | Film/substrates 25–200 µm, Plastic film (e.g. 30 µm), Paper |
| EmbossingForming | – | – | – | – | – |
| Material Testing / Material AnalysisTesting | – | – | – | – | Film/substrates 25–200 µm |
| Die-Cutting Tool Resharpening ServiceSurface | – | – | – | – | Steel (tool steel, implied) |
| Tool Manufacturing (Die-Cutting Tools)Engineering | – | – | – | – | Steel (tool steel, implied) |
| Sampling & Product DevelopmentEngineering | – | – | – | – | – |
| Splice Detection / Material Analysis with Ultrasonic SensorTesting | – | – | – | – | – |
| Packaging Robotics (BEAMstack™ Packaging Robotics)Assembly | – | – | – | – | – |
5 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Swiss Die-Cutter™ B6 (Die-Cutting Machine) | BERHALTER B6 | – | substrates 25–200 µm, up to 500+ strokes per minute | – | Widnau, Switzerland |
| Swiss Die-Cutter™ B4 (Die-Cutting Machine) | BERHALTER B4 | – | substrates 25–200 µm, up to 500+ strokes per minute | – | Widnau, Switzerland |
| High-Performance Dancer Unit (Web Transport Unit) | BERHALTER | – | – | – | – |
| Control Pad Splice Table | BERHALTER | – | – | – | – |
| CUTcontrol™ IIoT Platform (Digitalization) | BERHALTER CUTcontrol™ | – | – | – | – |
Additional services
Reference customers