Services around wire bonding: training, process setup, failure analysis, consulting and prototyping
Bond-IQ GmbH
BerlinNew on Amplifa
Services around wire bonding
Bond-IQ GmbH is a Berlin-based service company focused on wire bonding technology for semiconductor and electronics manufacturing. Its offering includes training courses and seminars at engineer and professional level, process setup with parameterization and documentation, failure analysis for root-cause investigation of customer complaints and field failures, independent consulting as well as application tests and prototype assembly. For prototyping, fully automatic F&S Bondtec bonders (58xx and 56xx) for thin and thick wire with wire diameters from 17.5 µm to 500 µm are available; small-lot projects are scheduled within a maximum of eight weeks. Analytics include pull and shear tests, BAMFIT testing, light and stereo microscopy, a Phenom desktop SEM and a confocal 3D microscope (Olympus LEXT). Bond-IQ also coordinates multi-client projects such as surf:guide (specification of bond surfaces) and QUALSi (AlSi1 thin-wire studies). Customers come from semiconductor and electronics manufacturing, automotive, the PCB industry and R&D.
- Site
- Berlin
- Processes
- Ball/Wedge Bonding (thin wire), Wedge/Wedge Bonding (thin wire), Wedge/Wedge Bonding (thick wire), Wire Bonding (thin and thick wire), Ball Shear Test, Shear Test Thick Wire, Pull test thin/thick wire, Pull test (thin) on LAB tester
- Materials
- Aluminium, AlSi1 standard thin wire, AlSi1 corrosion-resistant thin wire (with Ni content), Gold, Copper, CuCorAl, DIG (Direct Immersion Gold) surface, Aluminium thin wire (AlSi1)
- Certificates
- ISO 9001
- Industries
- Semiconductor and electronics manufacturing, Automotive, PCB industry, R&D / product development, Automotive (sensor failures, field failures), PCB industry (surface specification, e.g. DIG)
- 01
Consulting / Inquiry
- 02
Process Setup / DoE
- 03
Application Test / Prototyping
- 04
Pull, shear and BAMFIT tests
- 05
Failure Analysis / Report and recommendation
- 06
Training / Qualification
Bond materials and surfaces
Aluminium thin wire (AlSi1)
Standard and corrosion-resistant AlSi1 thin wire for wedge/wedge bonding, subject of the QUALSi studies.
Aluminium thick wire
Wedge/wedge thick-wire bonding from 125 µm to 500 µm, among others BAMFIT-tested.
CuCorAl
Copper-core aluminium thick wire for applications up to 500 µm diameter.
Gold
Thin and thick wire for ball/wedge and wedge/wedge processes.
Copper
Bonding wire, thick-wire bonding up to max. 300 µm diameter.
DIG surface (Direct Immersion Gold)
Investigated PCB surface for fine-pitch bonding, also processable at room temperature.
Locations
Berlin
DEHeadquarters
- Part weight / size
- Bond areas up to 15 cm × 20 cm
- Lot size
- Small series and prototypes, max. 8 weeks lead time
- Materials
- Aluminium (AlSi1, CuCorAl), gold, copper
- F&S Bondtec 58xx (15 × 20 cm)
- F&S Bondtec 56xx (10 × 10 cm)
- BAMFIT Tester GEN.1
- Bond Pull Tester LAB-Tester
- F&S Bondtec 58xx + TraceX
- Phenom Desktop-SEM
- Olympus LEXT confocal 3D microscope
- Light microscope up to 1000x
- Stereo microscope
- FDM 3D printers (Prusa MK3S, Bambulab, Ultimaker)
- Elegoo Mars resin LCD printer
- Laser cutter 5 W
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Ball/Wedge Bonding (thin wire)Joining | – | – | Wire diameter 17.5 µm to 50 µm | Small series/prototypes | Gold, Copper |
| Wedge/Wedge Bonding (thin wire)Joining | – | – | Wire diameter 17.5 µm to 75 µm | – | Aluminium, Gold, Copper |
| Wedge/Wedge Bonding (thick wire)Joining | – | – | Wire diameter 125 µm to 500 µm | – | Aluminium, CuCorAl, Copper |
| Wire Bonding (thin and thick wire)Joining | – | – | Wire diameter 17.5 µm to 500 µm | Small lot sizes, projects within max. | Aluminium, Gold, Copper |
| Ball Shear TestTesting | – | – | Shear forces up to 500 cN; thick wires | – | Aluminium |
| Shear Test Thick WireTesting | – | Chip max. 1 mm x 1 mm | Shear forces up to 5000 cN; thick wires | – | Aluminium |
| Pull test thin/thick wireTesting | – | – | Tensile forces 100 cN to 5000 cN; wires | – | Aluminium, Gold, Copper |
| Pull test (thin) on LAB testerTesting | – | – | Forces up to 100 cN | – | Aluminium, Gold, Copper |
| BAMFIT TestTesting | – | – | Wire diameter 125 µm – Wire diameter 500 µm | – | Aluminium, Copper |
| Failure Analysis (Light microscopy, SEM/EDX, FIB, Pull/Shear, Cross sections, TOF-SIMS)Testing | – | – | – | – | – |
| Process Setup / process optimization & DoEEngineering | – | – | – | – | – |
| Consulting / auditsEngineering | – | – | – | – | – |
| Seminars & trainings wire bondingEngineering | – | – | – | – | – |
| Prototype assembly (COB, feasibility)Assembly | – | – | – | Small series, max. 8 weeks lead time | Aluminium, Gold, Copper |
14 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Fully automatic wire bond machine | F&S Bondtec 58xx | – | 15 cm x 20 cm | – | Berlin |
| Fully automatic wire bond machine | F&S Bondtec 56xx | – | 10 cm x 10 cm | – | Berlin |
| BAMFIT Tester | GEN.1 | – | 10 cm x 10 cm | – | Berlin |
| Bond Pull Tester | LAB-Tester | – | 7.5 cm x 7.5 cm | – | Berlin |
| Fully automatic bond & data acquisition system | F&S Bondtec 58xx + TraceX | – | 15 cm x 20 cm | – | Berlin |
| Desktop SEM | Phenom | – | – | – | Berlin |
| Confocal 3D microscope | Olympus LEXT | – | – | – | Berlin |
| Light microscope (up to 1000x) | – | – | approx. 125 µm x 125 µm field of view | – | Berlin |
| Stereo microscope | – | – | – | – | Berlin |
| FDM 3D printer | Prusa MK3S | – | – | – | Berlin |
| FDM 3D printer | Bambulab | – | – | – | Berlin |
| FDM 3D printer (dual material) | Ultimaker | – | – | – | Berlin |
| Resin LCD 3D printer | Elegoo Mars | – | – | – | Berlin |
| Laser cutter 5W | – | – | – | – | Berlin |
Additional services
Reference customers
Quality and test methods
Tests include pull tests (100–5000 cN), ball and thick-wire shear tests (up to 5000 cN), BAMFIT tests as well as stitch image evaluation on the high-resolution light microscope. Failure analyses are performed on in-house equipment and in cooperation with external laboratories (SEM/EDX, FIB, TOF-SIMS, cross sections).
| Evidence | Berlin |
|---|---|
| ISO 9001 |
Experience and projects
As of 2025: 65 years of cumulative wire bonding knowledge, 23 years of experience, over 800 customers and seminar participants
Over 200 international customers in more than 500 projects in the last 20 years
Multi-client project surf:guide for the specification of bond surfaces with 70 partners; project phase 2026
QUALSi: AlSi1 thin-wire studies with 25 partners and a €125,000 research budget