Development and production of electronic enclosures made of plastic and aluminium as well as HMI input units and system integration.
Bopla Gehäuse Systeme GmbH
Bünde (headquarters) · Production plants in Europe and AsiaNew on Amplifa
About BOPLA
Bopla Gehäuse Systeme GmbH, based in Bünde (North Rhine-Westphalia), has been developing and producing electronic enclosures made of plastic and aluminium as well as input units such as touch/display systems and membrane keypads since 1970. The product range includes standard enclosures (handheld, desktop, console, wall-mount and 19-inch enclosures up to IP69) as well as custom enclosure solutions including design, toolmaking and plastic injection moulding. As part of its system integration services, BOPLA provides, in addition to enclosure manufacturing, mechanical machining (CNC milling, drilling, cutting), surface finishing (printing processes, laser marking, painting, EMC coating), touch/display integration with optical bonding, electronics manufacturing with SMD/THT assembly and various soldering processes, as well as complete assembly including cleanroom assembly, functional, ingress protection and end-of-line testing. For prototypes and small series, additive processes (FDM, MJF, SLS, SLA) and vacuum casting are available. The enclosures are used, among other things, in measurement, control and automation technology, mechanical and plant engineering, medical and rail technology as well as agricultural technology. More than 240 employees work at the Bünde headquarters, with over 400 more in the production plants. Since 1977, the company has belonged to the internationally active Swiss group Phoenix Mecano AG and distributes its products worldwide.
- Site
- Bünde
- Processes
- CNC machining (milling, drilling, countersinking), Cutting, sawing, welding, Digital printing, screen printing, pad printing, Laser marking, Painting, EMC coating, Sheet metal bending, Stamped and bent parts
- Materials
- PC UL 94 V0, ABS, Polyester, Aluminium, Steel, Stainless steel, Brass, FR4
- Certificates
- DIN EN ISO 9001:2015, DIN EN ISO 14001:2015, ISO 9001, ISO 14001
- Founded
- 1970
- Industries
- Mechanical and plant engineering, Medical technology, Rail technology, Measurement, control and automation technology, Agricultural technology, Safety and building technology
- 01
Design and Engineering
- 02
Toolmaking
- 03
Plastic Injection Moulding / Metal Processing
- 04
Mechanical Machining (CNC)
- 05
Surface Finishing (Printing, Painting, EMC Coating)
- 06
HMI Manufacturing (Membrane Keypads, Touch/Display Integration)
- 07
Electronics Manufacturing (SMD/THT, Soldering)
- 08
Complete Assembly incl. Cleanroom
- 09
Testing and Packaging
Materials and Processes
PC UL 94 V0
Flame-retardant polycarbonate plastic for standard and custom enclosures.
ABS
Standard material for plastic enclosures in various industries.
Polyester
Material for enclosures and front films/membrane keypads.
Aluminium
Material for aluminium enclosures and sheet metal components, machinable and paintable.
Steel
Used for painted enclosure and sheet metal parts.
Stainless steel
For robust enclosure and sheet metal components.
Brass
Used for accessories such as cable glands.
PA
Plastic for enclosure components and accessories.
FR4
PCB material as the base for membrane keypads.
Plastic injection moulding
Process for custom enclosures with in-house toolmaking.
Additive Manufacturing
FDM, MJF, SLS, SLA and vacuum casting for prototypes and small series.
Electronics manufacturing
SMD assembly down to 01005/BGA/fine-pitch, reflow, wave, vapour phase and selective soldering.
Locations
Bünde
DEHeadquarters: development, manufacturing, sales
- Materials
- Plastic, aluminium
- Reflow oven (SMT full convection, PCB width up to 400 mm)
- Vapour phase soldering system
- Wave soldering system (RFID-controlled, dual waves, dual spray head)
- Selective soldering system
- Screw-driving and soldering robots
- CNC machine for depaneling multi-item PCB panels
- Dispenser mini-automat
- Rework station (BGA reballing)
Production plants Europe/Asia
Production plants
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| CNC machining (milling, drilling, countersinking)Machining | – | – | – | – | Plastic, Aluminium |
| Cutting, sawing, weldingMachining | – | – | – | – | – |
| Digital printing, screen printing, pad printingSurface | – | – | – | – | – |
| Laser markingSurface | – | – | – | – | – |
| PaintingSurface | – | – | – | – | Steel, Plastic |
| EMC coatingSurface | – | – | – | – | – |
| Sheet metal bendingForming | – | – | – | – | Aluminium |
| Stamped and bent partsForming | – | – | – | – | – |
| Ultrasonic weldingJoining | – | – | – | – | Plastic |
| Press-fitting (threaded inserts etc.)Joining | – | – | – | – | – |
| Plastic injection moulding (custom enclosures, toolmaking)Plastics | – | – | – | – | PC UL 94 V0, ABS, Polyester |
| Vacuum castingPlastics | – | – | – | – | – |
| Fused Deposition Modeling (FDM)Additive | – | – | – | – | – |
| HP Multi Jet Fusion (MJF)Additive | – | – | – | – | – |
| Selective Laser Sintering (SLS)Additive | – | – | – | – | – |
| Stereolithography (SLA)Additive | – | – | – | – | – |
| THT assembly (axial/radial)Assembly | – | – | – | – | – |
| SMD assembly down to 01005, BGA, µBGA, fine pitch 0.3 mmAssembly | – | – | – | – | – |
| Reflow soldering (SMT full convection, PCB width up to max. 400 mm)Joining | – | – | – | – | – |
| Wave soldering (RoHS-compliant, under nitrogen/inert gas atmosphere)Joining | – | – | – | – | – |
| Vapour phase solderingJoining | – | – | – | – | – |
| Selective solderingJoining | – | – | – | – | – |
| PCB assembly coating (automatic)Surface | – | – | – | – | – |
| Touch/display integration incl. optical bondingAssembly | – | – | – | – | – |
| Membrane keypads (incl. Profiline, doming, dual contact, FR4)Assembly | – | – | – | – | Polyester, FR4 |
| Assembly of electronic modules / complete assembly (also cleanroom)Assembly | – | – | – | – | – |
| Functional testing / end-of-line testing / ingress protection testingTesting | – | – | – | – | – |
| Custom enclosure manufacturing (design, toolmaking, production)Engineering | – | – | – | – | Plastic, Aluminium |
8 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Reflow oven (SMT full convection system, PCB width up to max. 400 mm) | – | – | PCB width up to max. 400 mm | – | Bünde |
| Vapour phase soldering system | – | – | – | – | Bünde |
| Wave soldering system (RFID-controlled, dual waves, dual spray head) | – | – | – | – | Bünde |
| Selective soldering system | – | – | – | – | Bünde |
| Screw-driving and soldering robots | – | – | – | – | Bünde |
| CNC machine for depaneling multi-item PCB panels | – | – | – | – | Bünde |
| Dispenser mini-automat (solder paste application) | – | – | – | – | Bünde |
| Rework station (BGA reballing) | – | – | – | – | Bünde |
Additional services
Reference customers
Quality
A continuous quality management system accompanies the contract manufacturing from assembly through to end-of-line, functional and ingress protection testing. The company is certified according to DIN EN ISO 9001:2015 and DIN EN ISO 14001:2015 (TÜV SÜD).
| Evidence | Bünde |
|---|---|
| ISO 9001 | |
| ISO 14001 |
History
- 1970
Start of the development and production of electronic enclosures
- 1977
BOPLA becomes part of the internationally active Swiss group Phoenix Mecano AG