
Development of cellular modem chipsets (LTE Cat1.bis, 5G RedCap, 5G eMBB) for the IoT market

Bridgecom Semiconductors GmbH
Munich · LinzNew on Amplifa
About Bridgecom Semiconductors
Bridgecom Semiconductors GmbH is a Europe-based semiconductor company headquartered in Munich with a branch office in Linz (Austria). The company develops cellular modem chipsets for the IoT market: an LTE Cat1.bis solution based on the 3GPP Release 13 standard for massive IoT applications such as intelligent sensors, tracking and smart metering; a 5G RedCap solution (3GPP R17) for devices with medium data throughput and low latency such as wireless gateways, wearables, telematics and smart factory applications; and a 5G eMBB solution (3GPP R17/18) for mobile broadband IoT applications with high throughput. According to the company, the chipsets are characterized by a high degree of integration, low cost and low power consumption. Manufacturing is supported by a partnership with Samsung Foundry. The team consists of experienced professionals from the wireless semiconductor industry as well as a growing engineering team and a partner network.
- Site
- München
- Processes
- Development of cellular modem chipsets (LTE Cat1.bis, 5G RedCap, 5G eMBB) for IoT
- Industries
- IoT, Wireless/Semiconductor, Smart Metering, Tracking, Telematics, Wearables
- 01
Development of cellular modem chipsets (LTE Cat1.bis, 5G RedCap, 5G eMBB)
- 02
Manufacturing via foundry partnership with Samsung Foundry
Locations
Munich
DEHeadquarters
Linz
ATBranch office (Quadrill Memphis)
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