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Calterah – Fertigung

Fabless design and development of CMOS millimeter-wave radar SoCs (77/79 GHz, 60 GHz) and UWB SoCs for automotive, industrial and consumer applications.

Calterah Logo

Calterah Microsystems Technology (Shanghai) Co., Ltd.

Shanghai (CN) · Munich (DE)New on Amplifa

Fabless semiconductor company withCompany type
Germany site in Munich since 2024Locations
Over 20 million chips shipped (as ofShipments

About Calterah

Calterah (加特兰微电子) is a fabless semiconductor company headquartered in Shanghai that develops millimeter-wave radar systems-on-chips in CMOS technology as well as ultra-wideband SoCs. The portfolio comprises 77/79 GHz and 60 GHz radar SoCs, SoC-AiP and SoC-RoP products, and UWB chips compliant with IEEE 802.15.4ab (FiRa Core 3.0/4.0) for applications such as ADAS front and camera radars, imaging radar, in-cabin and door radar, digital keys, parking assistance, smart home, smart city, traffic monitoring, industrial automation, drones, robotics, wearables and smart lock devices. Manufacturing and testing of the chips is carried out by certified partners (wafer fabs, packaging and test), while the company's own value creation lies in chip design, software (AUTOSAR MCAL/CDD, Radar Signal Processor RSP 2.0, Timing Engine 2.0), development kits and failure analysis. Since 2015, more than 20 million radar chips have been shipped, deployed in vehicle models of numerous OEMs. In 2024, a Germany site in Munich was put into operation and was fully staffed in 2025.

Site
Shanghai
Processes
Chip design (fabless): MMW radar SoC, SoC AiP, SoC RoP, UWB SoC, Failure Analysis (FA), Customer Support (CQE, FAE, 8D process), Software (AUTOSAR MCAL/CDD, Radar Signal Processor RSP 2.0, Timing Engine 2.0), Development Kits (UWB CPD)
Materials
CMOS millimeter-wave radar SoC, UWB SoC (IEEE 802.15.4ab), Automotive reliability standard
Certificates
ISO 9001:2015, ISO 26262:2018 ASIL-D (functional safety management system), ISO 26262:2018 ASIL-B (product certification Alps series), ISO 26262:2018 ASIL-B (product certification Andes series), ISO 26262:2018 ASIL-B (MCAL/CDD software components Alps Pro), ISO/SAE 21434:2021 (cybersecurity management system), ISO/IEC 27001:2022 (information security), TISAX AL3, ASPICE CL2 (Alps Pro AUTOSAR project), TMMi Level 4, FiRa Core 3.0 / 4.0 (UWB), ISO 9001:2015 (SGS), ISO 26262:2018 ASIL-D (Management, TÜV Rheinland), ISO/SAE 21434:2021 (TÜV Rheinland), ISO/IEC 27001:2022 (TÜV Rheinland), TISAX AL3 (TÜV SÜD), ASPICE CL2, FiRa Core 3.0/4.0
Industries
Automotive (ADAS, imaging radar, in-cabin radar, digital key), Industrial (smart home, smart city, security, traffic monitoring,, Consumer goods (smart home devices, wearables, smart locks)
  1. 01

    Chip design (fabless)

  2. 02

    Wafer fabrication by certified partner fabs

  3. 03

    Packaging by certified partners

  4. 04

    Testing by certified partners

  5. 05

    Software & development kits

  6. 06

    Customer support & failure analysis

Technologies & Standards

MMW

CMOS millimeter-wave radar SoC

77/79 GHz and 60 GHz SoC, SoC AiP and SoC RoP for automotive, industrial and consumer applications.

UWB

UWB SoC (IEEE 802.15.4ab)

Dubhe ultra-wideband SoC series for cm-accurate measurement, positioning and radar sensing.

AEC-Q100

Automotive reliability standard

Reliability qualification testing per JESD and AEC-Q100 through accredited third-party laboratories.

Locations

Shanghai

CN

Headquarters (research & development, J-Lab ATE laboratory)

Munich

DE

Sales/office site (in operation since 2024, fully staffed in 2025)

Products & Chips

ADAS radar platform (Kunlun Pro)
ADAS radar platform (Kunlun Pro)77 GHz radar SoC · Automotive
Front/camera radar applications
Front/camera radar applicationsMMW radar SoC · Automotive
UWB digital key application
UWB digital key applicationUWB SoC · Automotive
Vehicle radar zones 1
Vehicle radar zones 1MMW radar SoC · Automotive
Vehicle radar zones 2
Vehicle radar zones 2MMW radar SoC · Automotive
Vehicle radar zones 3
Vehicle radar zones 3MMW radar SoC · Automotive
In-cabin lighting/radar zone
In-cabin lighting/radar zoneMMW/UWB radar SoC · Automotive

Inside the production

Company banner
Company banner
Product image (16x9)
Product image (16x9)

Industries

Automotive (ADAS, imaging radar, in-cabin radar, digital key)Industrial (smart home, smart city, security, traffic monitoring,Consumer goods (smart home devices, wearables, smart locks)

Additional services

Chip design (fabless): MMW radar SoC, SoC AiP, SoC RoP, UWB SoCFailure Analysis (FA)Customer Support (CQE, FAE, 8D process)Software (AUTOSAR MCAL/CDD, Radar Signal Processor RSP 2.0, Timing Engine 2.0)Development Kits (UWB CPD)

Quality

Calterah is certified to ISO 9001:2015 (SGS) and operates a quality system that includes reliability testing per JESD and AEC-Q100 through accredited third-party laboratories. Automotive development is additionally governed by ISO 26262 (ASIL-D management), ISO/SAE 21434, ISO/IEC 27001, TISAX AL3 and ASPICE CL2; customer complaints are handled via an 8D process.

EvidenceShanghai
ISO 9001:2015 (SGS)
ISO 26262:2018 ASIL-D (Management, TÜV Rheinland)
ISO/SAE 21434:2021 (TÜV Rheinland)
ISO/IEC 27001:2022 (TÜV Rheinland)
TISAX AL3 (TÜV SÜD)
ASPICE CL2
TMMi Level 4
FiRa Core 3.0/4.0

Company History

  1. 2015

    Tape-out of the world's first fully integrated 77 GHz radar transceiver chip.

  2. 2017

    Series introduction of the first automotive 77 GHz MMW radar chip Yosemite.

  3. 2018

    First industrial 60 GHz MMW radar chip Yellowstone in series production; world's first vehicle with a CMOS 77 GHz radar chip; ISO 9001 certification.

  4. 2019

    Second generation: Alps (77 GHz) and Rhine (60 GHz), including AiP products.

  5. 2020

    ISO 26262 FS management system up to ASIL-D; Alps and Rhine series launch.

  6. 2021

    Alps as the first Chinese chip fully compliant with ISO 26262; 1 million chips shipped; Alps Mini/Rhine Mini released.

  7. 2022

    Alps Pro and Andes released; 3.5 million chips shipped; ATE laboratory J Lab put into operation.

  8. 2023

    ISO/SAE 21434, ISO/IEC 27001 and ASPICE CL2; 7 million chips shipped; recognized as a national 'specialized little giant' (专精特新小巨人).

  9. 2024

    10 million chips shipped; Kunlun USRR/Lancang USRR and RoP technology; Germany site in Munich put into operation.

  10. 2025

    20 million chips shipped; TISAX AL3 and TMMi 4; UWB series Dubhe (IEEE 802.15.4ab, FiRa Core 3.0/4.0); Munich office completed.

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