Independent pure-play foundry for photonic integrated circuits in thin-film lithium niobate (TFLN) – from MPW prototypes to high-volume manufacturing.
CCRAFT
SwitzerlandNew on Amplifa
About CCRAFT
CCRAFT is an independent pure-play foundry for photonic integrated circuits (PICs) based on thin-film lithium niobate (TFLN). Founded in 2025 as a spin-off of the Swiss research center CSEM, the company manufactures monolithic TFLN chips on lithium niobate-on-insulator substrates (LNOI) with up to ten main process steps, including precision TFLN micromachining, multilayer metallization, cladding, layer openings, device-layer undercut and back-end-of-line processes. The offering ranges from multi-project wafer runs for prototyping and dedicated wafer runs from four wafers to high-volume production with a target capacity of 2,000 wafers per month in a dedicated TFLN fab. In addition, TFLN chiplets for micro-transfer printing, specialty processes such as etching, metal and oxide deposition, as well as periodic poling (PPLN) and micromachining services for silicon photonics fabs are offered. Customers are found in communications, quantum technologies, AI/datacenter and sensing. Manufacturing takes place with an in-house cleanroom and characterization laboratory in Switzerland.
- Site
- Switzerland
- Processes
- TFLN Etching (Thin-Film Lithium Niobate Etching), Metallization Layers (Multilayer Metallization), Cladding and Layer Openings, Back End of Line (BEOL) Processes, Precision TFLN Micromachining, Multilayer Metallization, Device-Layer Undercut, Metal Deposition (Specialty Process)
- Materials
- Thin-Film Lithium Niobate (TFLN), Lithium Niobate on Insulator (LNOI) Substrates, PPLN (Periodically Poled Lithium Niobate), Silicon Photonics (SiPh) Wafers, Thin-Film Lithium Niobate, Lithium Niobate on Insulator Substrate, Periodically Poled Lithium Niobate, Silicon Photonics Wafers
- Founded
- 2025
- Industries
- Communications/Telecommunications, Quantum Technologies, AI/Datacenter, Sensing, Spectroscopy, Silicon Photonics Foundries
- 01
Process Design & PDK
- 02
MPW / Custom Wafer Runs
- 03
TFLN Wafer Fabrication (Etching, Metallization, Cladding, BEOL)
- 04
Specialty Processes (PPLN, Deposition)
- 05
Characterization
- 06
Chiplets & Integration
Materials & Processes
Thin-Film Lithium Niobate
Core material for monolithic photonic integrated circuits with electro-optic and acousto-optic modulation.
Lithium Niobate on Insulator Substrate
Substrate platform for monolithic TFLN chip manufacturing with up to ten main process steps.
Periodically Poled Lithium Niobate
Enables frequency conversion for spectroscopy as well as optical and quantum computing.
Silicon Photonics Wafers
Substrates for TFLN micromachining services and hybrid/heterogeneous integration with silicon photonics fabs.
Sites
Switzerland
DEManufacturing, R&D and characterization
- Lot size
- MPW (shared wafer); custom runs from 4 wafers; high-volume (target 2,000)
- Materials
- TFLN, LNOI, PPLN, silicon photonics wafers
- In-house cleanroom
- Characterization lab
Components & Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| TFLN Etching (Thin-Film Lithium Niobate Etching)Surface | – | – | – | – | Lithium Niobate (Thin-Film), LNOI |
| Metallization Layers (Multilayer Metallization)Surface | – | – | – | – | Lithium Niobate (Thin-Film) |
| Cladding and Layer OpeningsSurface | – | – | – | – | Lithium Niobate (Thin-Film), LNOI |
| Back End of Line (BEOL) ProcessesSurface | – | – | – | – | Lithium Niobate (Thin-Film) |
| Precision TFLN MicromachiningSurface | – | – | – | – | Lithium Niobate (Thin-Film), LNOI, Silicon Photonics Wafers |
| Multilayer MetallizationSurface | – | – | – | – | Lithium Niobate (Thin-Film) |
| Device-Layer UndercutSurface | – | – | – | – | Lithium Niobate (Thin-Film), LNOI |
| Metal Deposition (Specialty Process)Surface | – | – | – | 4 Wafers | TFLN, similar materials |
| Oxide Deposition (Specialty Process)Surface | – | – | – | 4 Wafers | TFLN, similar materials |
| Periodic Poling (PPLN)Surface | – | – | – | 4 Wafers | Lithium Niobate (Thin-Film) |
| Monolithic TFLN PIC Manufacturing (up to 10 main process steps)Additive | – | – | – | – | Lithium Niobate on Insulator (LNOI) |
| Multi-Project Wafer (MPW) RunsAdditive | – | – | – | – | Lithium Niobate on Insulator (LNOI) |
| Custom Dedicated Wafer RunsAdditive | – | – | – | 4 Wafers | Lithium Niobate on Insulator (LNOI) |
| High-Volume TFLN Manufacturing (Target Capacity 2,000 Wafers/Month)Additive | – | – | – | 2,000 Wafers/Month (Target) | Lithium Niobate on Insulator (LNOI) |
| TFLN Chiplets (compatible with Micro-Transfer Printing)Assembly | – | – | – | – | Lithium Niobate (Thin-Film) |
| TFLN-Enhanced Silicon Photonics (Micromachining Service for SiPh Fabs)Engineering | – | – | – | – | Silicon Photonics Wafers, Lithium Niobate (Thin-Film) |
| Hybrid & Heterogeneous Integration with Silicon Photonics (Interface)Assembly | – | – | – | – | Silicon Photonics Wafers, Lithium Niobate (Thin-Film) |
| Low-Loss Fiber CouplingAssembly | – | – | – | – | Lithium Niobate (Thin-Film) |
| Electro-Optic Modulators (On-Chip Component)Engineering | – | – | – | – | Lithium Niobate (Thin-Film) |
| Acousto-Optic Modulation (On-Chip Functionality)Engineering | – | – | – | – | Lithium Niobate (Thin-Film) |
| Frequency Conversion via PPLN (Spectroscopy, Optical/Quantum Computing)Engineering | – | – | – | – | Lithium Niobate (Thin-Film), PPLN |
| PDK Development & Characterization (C-band 1550 nm qualified; O-band 1310 nm alpha; 500–900 nmTesting | – | – | – | – | Lithium Niobate (Thin-Film) |
2 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| In-house Cleanroom | – | – | – | – | – |
| Characterization Lab | – | – | – | – | – |
Additional services
Reference customers
History
- 2019–2025
More than six years of research and process development at CSEM lead to an industrial-grade TFLN PIC platform; pilot production with thousands of chips to over 40 partners worldwide.
- 2025
Founding of CCRAFT as a CSEM spin-off to scale production capacity; CSEM continues to act as R&D house