CelLink manufactures high-performance flexible circuit boards (Flex Harness, CCA+, PowerPlane™) for power and data transmission
CelLink Corporation
Redwood City, CA · Georgetown, TX · Brighton, MI · Hamburg · ShanghaiNew on Amplifa
About CelLink
CelLink Corporation, headquartered in Redwood City, California, develops and produces large-format, conductive flexible circuit boards for power, data and sensor transmission. The product platforms include Flex Harness as a replacement for conventional round-wire harnesses (approx. 1/4 of the weight, 1/10 of the volume), the CCA+ platform for battery interconnects with integrated bussing, voltage and temperature sensing and fusing, and the PowerPlane™ for data centers with integrated liquid cooling and a stack height of under 3 mm. Production is carried out in copper (35–500 µm) and aluminum (50–800 µm), some nickel-plated or tin-plated, on dielectrics such as PET, PEN and PP. Processes include laser welding, resistance welding, wire bonding, ultrasonic welding, wave soldering and highly automated assembly with 100% hipot testing. Customer industries include automotive, aerospace/defense, commercial vehicles, data centers and stationary energy storage. Production sites are located in California and Texas (Georgetown MegaPlant); sales and engineering offices are located in Brighton (Michigan), Hamburg and Shanghai.
- Site
- Redwood City, CA, USA
- Processes
- Current Collector Assembly+ (CCA+) Platform – battery interconnects (bussing,, Flex Harness – flexible power and data lines (high/low voltage, shielded/unshielded), CelLink PowerPlane™ – ultra-thin (<3 mm) flexible power circuit board with integrated, Laser welding (termination/laser-welded connections), Resistance Weld, Wire Bonding, Ultrasonic Welding (termination), Wave soldering (connectors)
- Materials
- Copper, Aluminum, Ni-plated Aluminum, Tin-plated Copper, PET, PEN, PP, Copper (35–500 µm)
- Certificates
- 100% Hipot Testing
- Industries
- Automotive (passenger cars/commercial vehicles), Aerospace/Defense, Industrial Vehicles, Data Centers/Server, Stationary Energy Storage, Data Center/Server
- 01
Engineering & design (digital pattern generation of the circuit)
- 02
Manufacturing of the flexible multilayer circuit board (Cu/Al on PET/PEN/PP)
- 03
Termination (laser, resistance and ultrasonic welding, wave soldering, wire
- 04
Highly automated assembly and connectorization
- 05
100% hipot testing (dielectric withstand)
Materials & Processes
Copper (35–500 µm)
Conductor traces for high current-carrying capacity, also as tin-plated Cu.
Aluminum (50–800 µm)
Lightweight conductors for bussing and EMI shielding, also as nickel-plated Al.
PET
Dielectric of the flex layers (V0/HB options).
PEN
Dielectric for higher thermal requirements.
PP
Dielectric film option for flexible layer build-ups.
Laser Welding
Termination of high-current contacts, SMT connectors and eyelets.
Resistance Welding
Contacting of the interconnects to cell busbars.
Wire Bonding
Direct contacting of circuit structures.
Ultrasonic Welding
Termination of USCAR/LV214 terminals.
Wave Soldering
Population of connector contacts.
Sites
Redwood City, CA
USHeadquarters
Georgetown, TX
USMegaPlant (Texas Manufacturing)
Brighton, MI
USAutomotive Sales & Engineering Office
Hamburg
DEAutomotive Sales & Engineering Office Germany
Shanghai
CNAutomotive Sales & Engineering
Products & Components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Current Collector Assembly+ (CCA+) Platform – battery interconnects (bussing,Joining | – | – | – | – | Cu, Al, Ni-plated Al, Tin-plated Cu, PET, PEN, PP |
| Flex Harness – flexible power and data lines (high/low voltage, shielded/unshielded)Joining | – | 3m+ (entire vehicle length) | – | – | Cu (35–500 μm), Al (50–800 μm), Ni-plated Al, Tin-plated Cu, PET, PEN, PP |
| CelLink PowerPlane™ – ultra-thin (<3 mm) flexible power circuit board with integratedJoining | – | <3 mm | – | – | Cu, Al, Ni-plated Al, Tin-plated Cu, PET, PEN, PP |
| Laser welding (termination/laser-welded connections)Joining | – | – | – | – | Cu, Al |
| Resistance WeldJoining | – | – | – | – | Cu, Al |
| Wire BondingJoining | – | – | – | – | Cu, Al |
| Ultrasonic Welding (termination)Joining | – | – | – | – | Cu, Al |
| Wave soldering (connectors)Joining | – | – | – | – | Cu |
| Highly automated harness assembly and connectorizationAssembly | – | – | – | – | – |
| 100% hipot testing (dielectric withstand test)Testing | – | – | – | – | – |
3 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Laser welding system | – | – | – | – | – |
| Resistance welding system | – | – | – | – | – |
| Wire bonder | – | – | – | – | – |
Additional services
Quality
All flexible circuits undergo 100% hipot testing (dielectric withstand); products meet ISO specifications for foot traffic, abrasion and flex cycles as well as IP67 sealing.
| Evidence | Redwood City, CA |
|---|---|
| 100% Hipot Testing |
History
- 2020
Flex Harness production in electric vehicles
- 2022
$250 million Series D venture financing
- o. A.
$362 million DOE loan drawn for construction of the Georgetown, TX plant (MegaPlant)