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Cencorp Automation – Fertigung

Back-end automation for the electronics industry: depaneling, odd-form placement, laser applications and test handling.

Cencorp Automation Logo

Cencorp Automation Oy

Salo (FI) · Waldmohr (DE) · Risskov (DK) · McAllen, Texas (US) · Zhuhai (CN)New on Amplifa

1978Roots (Colorado Engineering Corporation)
1989Founded PMJ Automec (Finland)
>500Employees worldwide
5Locations: FI, DE, DK, US, CN
ISO 9001certified by DNV

About Cencorp Automation

Cencorp Automation Oy specializes in back-end automation for the electronics industry, offering solutions in depaneling, odd-form placement (through-hole assembly), test handling, laser processing and scalable production automation from single cells to complete lines. The flexible product platforms allow adaptation to customer-specific requirements and shorten lead times. With nearly 50 years of experience in automation technologies, the company serves manufacturers in automotive electronics, telecommunications, consumer and industrial electronics as well as the semiconductor industry. Production is located in Salo (Finland) and Zhuhai (China); sales and service offices are located in Germany (Waldmohr), the USA, France, China and Denmark, complemented by a global network of sales partners. Cencorp employs over 500 people worldwide and is part of the Cencorp Industrial Group, which also has expertise in 3D surface processing and semiconductor automation.

Site
Waldmohr
Processes
Depaneling, Odd-form placement (through-hole placement), Automation solutions (single cells to full lines), Laser application (standard and custom-built laser processes), Test handling (inline test handlers), Odd-form placement, Automation solutions (single cells to complete lines), Laser applications
Materials
Depaneling, Odd-form Placement, Automation cells and lines, Laser applications, Test Handling
Certificates
ISO 9001, ISO 14001 (compliant, environmental management system), ISO 14001
Industries
Automotive electronics, Telecommunications, Consumer electronics, Industrial electronics, Semiconductors, Telecom
  1. 01

    Consulting and requirements analysis

  2. 02

    Engineering on flexible product platforms

  3. 03

    Manufacturing and assembly (Salo, Zhuhai)

  4. 04

    Testing and quality inspection

  5. 05

    Commissioning and training

  6. 06

    Support, maintenance and spare parts

Processes & Platforms

DEP

Depaneling

Flexible and robust machines for separating printed circuit boards in all electronics production environments.

OF

Odd-form Placement

Fast and precise through-hole assembly cells with full process control.

AUT

Automation cells and lines

Scalable solutions from single cells to complete production lines, e.g. HiSAC platform.

LAS

Laser applications

Standard and custom laser processes for electronics manufacturing.

TEST

Test Handling

Inline test handlers for seamless testing and a smooth material flow.

Locations

Standort Salo, Finland

Salo, Finland

FI

Headquarters, production and development

  • HiSAC High Speed Assembly Cell
  • 1000BR Depaneling Cell
  • 1000OF Odd-Form Cell
Standort Waldmohr, Germany

Waldmohr, Germany

DE

Sales and service Germany (Cencorp Deutschland GmbH)

Standort Risskov, Denmark

Risskov, Denmark

DK

Cencorp APS Denmark (sales/service)

Standort McAllen, Texas, USA

McAllen, Texas, USA

US

Sales and service North America (Cencorp Americas LLC)

Standort Zhuhai, China

Zhuhai, China

CN

Production and China base (Cencorp Industrial Technology Co.)

Solutions & Machines

Depaneling machine
Depaneling machineDepaneling · Electronics industry
Odd-form placement cell
Odd-form placement cellThrough-hole assembly · Electronics industry
Automation cell
Automation cellAutomation · Electronics industry
Laser application
Laser applicationLaser processing · Electronics industry
Inline test handler
Inline test handlerTest handling · Electronics industry
HiSAC system at Grundfos
HiSAC system at GrundfosAutomation cell · Industrial electronics

Inside the production

Cencorp Automation team
Cencorp Automation team
Trade fair appearance Evertiq Expo Gothenburg
Trade fair appearance Evertiq Expo Gothenburg
HiSAC system at Grundfos Denmark after 26 years in operation
HiSAC system at Grundfos Denmark after 26 years in operation

Industries

Automotive electronicsTelecommunicationsConsumer electronicsIndustrial electronicsSemiconductorsTelecom

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
DepanelingAutomation––––Electronics printed circuit boards
Odd-form placement (through-hole placement)Assembly––––Through-hole components
Automation solutions (single cells to full lines)Automation–––––
Laser application (standard and custom-built laser processes)Surface–––––
Test handling (inline test handlers)Testing–––––

3 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Depaneling/Assembly cellCencorp HiSAC (High Speed Assembly Cell)––1994Salo, Finland
Depaneling cellCencorp 1000BR––––
Odd-form cellCencorp 1000OF––––

Additional services

DepanelingOdd-form placementAutomation solutions (single cells to complete lines)Laser applicationsTest handlingTechnical supportSpare partsMaintenanceTrainingPSIRT/Product Security

Reference customers

Grundfos (Denmark)

Quality & Environment

Cencorp Automation is ISO 9001 certified by DNV; the quality and environmental management system covers sales, engineering, manufacturing and customer service of production automation for the electronics industry. The company's own environmental management system is ISO 14001 compliant, and every delivered solution is inspected and tested.

EvidenceSalo, Finland
ISO 9001
ISO 14001

History

  1. 1978

    Founding of Colorado Engineering Corporation in Longmont, Colorado; development of the world's first depaneling machine for the electronics industry

  2. 1989

    Markku Jokela acquires Evox's automation business, founding of PMJ Automec (Finland)

  3. 1994

    PMJ launches HiSAC – High Speed Assembly Cell, the first modular production cell

  4. 1999

    PMJ Automec acquires Cencorp (USA), growth into a global company, driven by the Nokia mobile phone boom

  5. 2000-2005

    Cencorp launches several innovative platforms for depaneling, odd-form and testing

  6. 2005

    Renamed Cencorp Corporation

  7. 2014

    Chinese investors acquire Cencorp Oyj's automation business; founding of Cencorp Automation Oy

  8. 2017

    Relocation of headquarters and production to the Salo IoT Campus

  9. 2021

    Release of the new 1000BR and 1000OF cells

  10. 2022

    Expansion of the ownership base in China; founding of Cencorp Industrial Technology based in Zhuhai (focus on semiconductors and special automation); Cencorp Automation Salo focuses on depaneling and odd-form

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