Testing service provider for machine capability analyses (MFU/MCS) and measurement systems for SMT production lines
CeTaQ GmbH
Dresden (DE) · Pessac (FR) · Manchester, NH (USA) · Shanghai (CN) · Penang (MY)New on Amplifa
About CeTaQ
CeTaQ GmbH, based in Dresden, has specialized since 1996 in manufacturer-independent machine and process capability analyses (MFU/MCS) in electronics manufacturing (SMT). Using mobile measurement systems, pick-and-place machines, printers, SPI and AOI systems, ovens, dispensers, die bonders, depanelers, laser marking systems as well as robots and special machines are tested directly in the customer's production environment – without a measurement room. Measured parameters include placement accuracy (x, y, Theta), repeatability, placement and squeegee forces as well as temperature and reflow characteristics. Since December 2017, CeTaQ has been accredited to DIN EN ISO/IEC 17025 for the determination of placement accuracy of SMT machines (DAkkS D-PL-20318-01-00). In addition to its measurement services, the company develops and manufactures its own measurement systems, reference PCBs and software such as the CmController 9, CMForce, CmPrint 2.0 and the 3D-SPI Board. Customers come from electronics manufacturing and the automotive sector (IATF 16949); the service is represented in Europe, Asia and America with partners in France, the USA, China and Malaysia.
- Site
- Dresden
- Processes
- Machine Capability Study (MCS) / machine capability analysis (MFU) for SMT systems, Machine capability test printer (accuracy, squeegee force), Machine capability test SPI (measurement system analysis, height, volume, area), Machine capability test placer/pick-and-place machine (accuracy, placement force), Machine capability test AOI (measurement system analysis xy), Oven test (repeatability, temperature, reflow time), Laser/labeler test (accuracy), Robot and special machine test (accuracy)
- Materials
- High-precision glass (measurement plates/MPL02/MPL07/MPL09, glass components TQFP100, BGA228,, Ceramic (chip components 0402), Stainless steel (Laser Board, composite stainless steel), Aluminum carrier (3D-SPI Board frame), High-precision glass, Ceramic, Stainless steel composite, Aluminum
- Certificates
- DIN EN ISO/IEC 17025 (accreditation placement accuracy, DAkkS), ISO 9001, DIN EN ISO/IEC 17025 (placement accuracy, DAkkS D-PL-20318-01-00)
- Founded
- 1996
- Industries
- Electronics manufacturing/SMT, Automotive (IATF 16949 environment)
- 01
Inquiry and problem analysis
- 02
Test planning (measurement board, component spectrum)
- 03
Preparation and programming by the operator
- 04
Measurement directly in the production line
- 05
Numerical and graphical analysis of the results
- 06
Root cause analysis and optimization with on-site technicians
- 07
Test report with documentation (DAkkS/ILAC for accredited measurements)
Measurement systems and materials
High-precision glass
Measurement plates (MPL02, MPL07, MPL09) and glass replicas of components (TQFP100, BGA228) with micrometer-accurate measurement structures.
Ceramic
Chip components 0402 as measurement components from the tape-and-reel feeder.
Stainless steel composite
Laser Board as a reference PCB for testing laser marking systems, storage- and laser-resistant.
Aluminum
Carrier frame of the 3D-SPI Board to protect the structured glass.
Locations and partners
Dresden
DEHeadquarters, development and manufacture of the measurement systems
- Materials
- Glass, ceramic, stainless steel, aluminum
- CmController 9 (position measurement system)
- CMForce (force measuring device)
- CmPrint 2.0 (Basic & Expert)
- 3D-SPI Board
- Measurement plates MPL02/MPL07/MPL09
- Measurement components TQFP100, BGA228, 0402 ceramic
- Laser Board
- Mobile measurement system for machine capability studies
Pessac
FRLocation/representative office France
Manchester, NH
USPartner: CeTaQ Americas, LLC – service and sales America
Shanghai
CNPartner: Shanghai Range Industrial Equipment Co., Ltd. – service and sales China
Penang
MYPartner: Dual Matrix Sdn. Bhd. – service and sales Southeast Asia
Products and components
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Machine Capability Study (MCS) / machine capability analysis (MFU) for SMT systemsTesting | – | – | – | – | – |
| Machine capability test printer (accuracy, squeegee force)Testing | – | – | – | – | – |
| Machine capability test SPI (measurement system analysis, height, volume, area)Testing | – | – | – | – | – |
| Machine capability test placer/pick-and-place machine (accuracy, placement force)Testing | – | – | – | – | – |
| Machine capability test AOI (measurement system analysis xy)Testing | – | – | – | – | – |
| Oven test (repeatability, temperature, reflow time)Testing | – | – | – | – | – |
| Laser/labeler test (accuracy)Testing | – | – | – | – | – |
| Robot and special machine test (accuracy)Testing | – | – | – | – | – |
| Dispenser test (accuracy, diameter)Testing | – | – | – | – | – |
| Die bonder test (accuracy, placement force)Testing | – | – | – | – | – |
| Depaneler test (accuracy)Testing | – | – | – | – | – |
| Handling systems: testing of repeatability and process stabilityTesting | – | – | – | – | – |
| Process capability analysis (PFU, long-term analysis)Testing | – | – | – | – | – |
| Accredited determination of placement accuracy of SMT machines (DIN EN ISO/IEC 17025, DAkkS)Testing | – | – | – | – | – |
| Force measurement on pick-and-place machines and printers (sensor board, CMForce)Testing | – | – | – | – | – |
| Process optimization / root cause analysis / system comparison / machine acceptance andEngineering | – | – | – | – | – |
8 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Position measurement system for machine capability analyses (SMT) | CeTaQ CmController 9 | – | approx. 340 x 300 x 5 mm | – | Dresden (manufacturing site) |
| Force measuring device for pick-and-place machines | CeTaQ CMForce | – | – | – | – |
| Measurement system for placement accuracy and squeegee force in solder paste printing | CeTaQ CmPrint 2.0 (Basic & Expert) | – | – | – | – |
| 3D reference PCB for SPI systems (structured glass in aluminum carrier) | CeTaQ 3D-SPI Board | – | – | – | – |
| Measurement plates (glass, in frame/housing) | CeTaQ MPL02 (340×240 mm), MPL09 (216×185 mm), MPL07 (7"x4" / 153.4 mm x 101.6 mm) | – | – | – | – |
| Measurement components (glass/ceramic replicas) | CeTaQ TQFP100, BGA228, 0402 ceramic | – | – | – | – |
| Reference PCB for laser marking systems (stainless steel composite) | CeTaQ Laser Board | – | – | – | – |
| Mobile measurement system for machine capability studies (on-site at the customer) | CeTaQ | – | – | – | Dresden, Germany |
Additional services
Accreditation and quality
CeTaQ is the first company in the world accredited to DIN EN ISO/IEC 17025 for the determination of placement accuracy of SMT machines (DAkkS D-PL-20318-01-00) and is ISO 9001 certified. All measurements are traceable; test reports in the accredited area bear DAkkS and ILAC markings and meet, among other things, IATF 16949 requirements.
| Evidence | Dresden |
|---|---|
| DIN EN ISO/IEC 17025 (placement accuracy, DAkkS D-PL-20318-01-00) | |
| ISO 9001 |
History
- 1996
Foundation of CeTaQ GmbH
- 2017
First company worldwide accredited to DIN ISO 17025 for the determination of placement accuracy of SMT machines (since December 2017)