Specialized laser job shop for micromachining of glass wafers, technical glasses, sapphire and ceramics.
ChiemLas GmbH
PruttingNew on Amplifa
About ChiemLas
ChiemLas is a specialized laser job shop for industrial laser micromachining of glass wafers, technical glasses and glass substrates. At its site in Prutting near Rosenheim, the company manufactures high-precision components from glass, sapphire and ceramics. Its service portfolio includes contour-accurate laser cutting of brittle materials, laser-based microdrilling with hole diameters from 150 µm, wafer dicing, and the structuring and selective ablation of functional thin films such as ITO, ZnO, SnO₂, metal layers and photovoltaic absorbers. In addition, the company offers laser-based macromachining of surfaces, in particular cleaning, pretreatment, marking and ablation of technical components and tires. ChiemLas supports customers from feasibility testing and initial sampling through prototypes and small series to quality control. Its customers can be found in medical technology, the semiconductor, display and life sciences industries, augmented reality, the automotive industry and aerospace.
- Site
- Prutting
- Processes
- Laser cutting of glass and brittle materials, Laser microdrilling (laser drilling), Wafer dicing, Laser structuring / selective ablation of functional thin films, Laser cleaning (laser-based surface cleaning), Laser ablation (selective removal of layers/surfaces), Laser-based pretreatment and marking of surfaces (technical components and tires), Laser filamentation (process/parameter development filamentation + ablation)
- Materials
- Glass (technical glasses), Glass wafers, Glass substrates, Sapphire, Ceramics, ITO (indium tin oxide thin film), ZnO (zinc oxide thin film), SnO2 (tin oxide thin film)
- Certificates
- Internal quality control / surface analysis, ISO 9001 (documented), Dimensional inspection reports to standard (optionally agreed)
- Industries
- Medical technology, Semiconductors, Display, Life Sciences, Augmented Reality, Automotive industry
- 01
Feasibility testing and preliminary trials
- 02
Process and parameter development (filamentation, ablation)
- 03
Programming and job setup
- 04
Sample machining / prototypes
- 05
Small series production
- 06
Quality control
- 07
Shipping (FCA Prutting, DHL Express)
Materials & Processes
Technical glasses
Machined from 100 µm material thickness by laser cutting, microdrilling and structuring.
Glass wafers
Substrates for wafer dicing and micromachining, among others for semiconductor and display applications.
Glass substrates
Base materials for laser-based micromachining and thin-film structuring.
Sapphire
Brittle hard material for contactless laser cutting and microdrilling.
Ceramics
Brittle material system for precise laser-based cutting and drilling processes.
ITO thin film
Selectively structured transparent conductive layer, e.g. for display and sensor applications.
ZnO thin film
Functional layer for selective laser ablation in the micrometer range.
SnO2 thin film
Functional oxide layer for laser-based structuring.
Metal layers
Thin metal layers for selective laser structuring.
Photovoltaic absorbers
Thin-film absorbers for laser-based structuring.
Tires (rubber)
Surface for laser-based cleaning, pretreatment and marking, e.g. on tire molds.
Locations
Prutting
DEProduction / headquarters
- Lot size
- Prototypes, small series
- Materials
- Glass, glass wafers, glass substrates, sapphire, ceramics, thin films
- Laser micromachining systems
- Surface analysis equipment
Components & Services
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Laser cutting of glass and brittle materialsMachining | – | – | – | Prototype – Small series | Glass, Sapphire, Ceramics, Glass wafers, Glass substrates |
| Laser microdrilling (laser drilling)Machining | – | – | – | – | Glass, Sapphire, Ceramics |
| Wafer dicingMachining | – | – | – | – | Glass wafers, Glass |
| Laser structuring / selective ablation of functional thin filmsSurface | – | – | – | – | ITO, ZnO, SnO2, Metal layers, Photovoltaic absorbers, Glass |
| Laser cleaning (laser-based surface cleaning)Surface | – | – | – | – | Molds (tire molds, injection molds), Weld seams, Surfaces with paint/coating/rust/oxides |
| Laser ablation (selective removal of layers/surfaces)Surface | – | – | – | – | Rust, Paints, Coatings, Oxide layers, Technical components, Tires |
| Laser-based pretreatment and marking of surfaces (technical components and tires)Surface | – | – | – | – | Technical components, Tires |
| Laser filamentation (process/parameter development filamentation + ablation)Surface | – | – | – | – | Glass, Glass-like substrates |
| Quality control / feasibility testing and initial samplingTesting | – | – | – | – | Glass, Sapphire, Ceramics |
Additional services
Quality
ChiemLas performs feasibility tests, initial samplings and documented quality control of the machined components. Process and parameter documentation, including parameter set and job file version, is part of sample machining.
| Evidence | Prutting |
|---|---|
| Internal quality control / surface analysis | |
| ISO 9001 (documented) | |
| Dimensional inspection reports to standard (optionally agreed) |