Develops systems for the automated integration of nanomaterials such as carbon nanotubes into semiconductor chips at wafer level.

Chiral Nano AG

Dübendorf (Switzerland)New on Amplifa

2023Founded as an ETH Zurich spin-off

AGLegal form (Switzerland)

DübendorfLocation

>1,000/hAssembly motions of the Nanoassembly Equipment

About Chiral Nano

Chiral Nano AG is a deep-tech company founded in Switzerland in 2023 and a spin-off of ETH Zurich. The company develops semiconductor manufacturing equipment for producing electronic transistors with integrated nanomaterials such as carbon nanotubes (CNTs), TMDs, hBN, graphene and nanowires. The offering includes the Nanodevice Foundry (material growth, material selection, mechanical transfer, device fabrication, as well as electrical and structural characterization), design and process flow support, substrate/wafer fabrication as a service, and the company's own Nanoassembly Equipment for automated CNT integration. Mechanical transfer is performed contamination-free at room temperature and replaces liquid-based deposition methods. The company serves industries such as semiconductor manufacturing, quantum technology, nanoelectronics, photonics and nanofluidics. It is located in Dübendorf near Zurich, with access to a cleanroom at the Binnig and Rohrer Nanotechnology Center (BRNC).

Site: Dübendorf
Processes: Nanomaterial integration (mechanical transfer of 1D/2D nanomaterials onto wafers), Nanomaterial growth, Nanomaterial characterization, Substrate fabrication (wafer fabrication service), Device design / layout design and process flow, Electrical/structural characterization of devices (e.g. CNT FET room and low temperature, Nanodevice Foundry (material growth, selection, mechanical transfer, device fabrication,, Nanodevice Foundry (material growth, material selection, mechanical transfer, device fabrication)
Materials: Carbon nanotubes (CNT), Nanowires, TMDs, hBN, Graphene, Silicon (traditional, comparison basis), 200mm wafers, Carbon Nanotubes
Founded: 2023
Industries: Semiconductor manufacturing, Quantum technology, Nanoelectronics, Photonics, Nanofluidics

01
Device design and process flow
02
Substrate/wafer fabrication
03
Nanomaterial growth
04
Nanomaterial characterization and selection
05
Automated mechanical transfer (nanoassembly)
06
Electrical/structural characterization

Nanomaterials & Processes

CNT

Carbon Nanotubes

1D nanomaterial with high electrical and thermal conductivity for high-performance transistors, interconnects and quantum-dot systems.

Nanowires

Linear 1D structures for transistors, interconnects and nanoscale sensors.

TMD

TMDs

Two-dimensional materials with tunable band gaps for ultra-thin transistors and optoelectronics (roadmap).

hBN

Atomically thin 2D dielectric for heterostructures and quantum devices (roadmap).

Graphene

2D nanomaterial for flexible electronics and advanced optoelectronics (roadmap).

Si-Wafer

200mm Wafers (Silicon)

Substrates as carrier material for wafer-level integration of nanomaterials.

Locations

Dübendorf

Headquarters, office and development; cleanroom access via BRNC

Part weight / size: Wafer level (200mm; upgrade path toward 12-inch)
Lot size: Prototypes to pilot production
Materials: CNTs, nanowires; TMDs, hBN, graphene (roadmap)

Nanoassembly Equipment (automated CNT transfer, >1,000 assembly motions/h, sub-micron alignment)

Devices & Equipment

**Nanoassembly Equipment – automated CNT integration**Robot-based nanoassembly · Semiconductor manufacturing

**Nanomaterial Growth**Material growth · Nanoelectronics

**Nanomaterial Characterization**Metrology · Quality assurance

Inside the production

Device design and process flow at the workstation

Industries

Semiconductor manufacturingQuantum technologyNanoelectronicsPhotonicsNanofluidics

Processes & technical limits

Processes	Tolerance	Max. part	Weight	Lot size	Materials
Nanomaterial integration (mechanical transfer of 1D/2D nanomaterials onto wafers)Assembly	sub-micron alignment accuracy	–	–	–	Carbon Nanotubes, TMDs, hBN, Graphene, Nanowires
Nanomaterial growthEngineering	–	–	–	–	Carbon Nanotubes, 2D materials (graphene, hBN, TMDs in roadmap)
Nanomaterial characterizationTesting	–	–	–	–	Carbon Nanotubes, nanomaterials
Substrate fabrication (wafer fabrication service)Engineering	–	–	–	–	wafers
Device design / layout design and process flowEngineering	–	–	–	–	–
Electrical/structural characterization of devices (e.g. CNT FET room and low temperatureTesting	–	–	–	–	–
Nanodevice Foundry (material growth, selection, mechanical transfer, device fabrication,Assembly	–	–	–	–	Carbon Nanotubes

2 Anlagen & Maschinen

Machine	Manufacturer / model	Quantity	Working area	Year built	Site
Nanoassembly Equipment (automated nanoassembly system for CNT transfer)	Chiral	–	wafer-level (upgrade path toward 12-inch wafer support)	–	Dübendorf, Switzerland
Wafer processing machines	–	–	200mm wafers	–	–

Additional services

Nanodevice Foundry (material growth, material selection, mechanical transfer, device fabrication)Device design and process flow supportSubstrate/wafer fabrication as a serviceNanoassembly Equipment (automated CNT integration)Electrical characterization (room- and low-temperature measurements)

History

2023
Founded in Switzerland as a spin-off of ETH Zurich