Swiss EMS provider for electronic PCBs, box building and microprecision systems
Cloos Electronic SA
Le Locle (CH)New on Amplifa
About CLOOS electronic
CLOOS electronic SA is a Swiss EMS provider (Electronic Manufacturing Services) based in Le Locle in the Canton of Neuchâtel. The company manufactures electronic PCBs with SMD and THT assembly down to 01005 components and PCB sizes up to 1.50 m on substrates such as FR4, ceramic, flex and aluminium, including 100% AOI inspection and 100% functional testing. Beyond PCBA manufacturing, the service portfolio includes box building, cable assembly, control cabinet construction based on Eplan documentation, conformal coating, bonding of housings with IP67 protection, assembly of microprecision systems, battery qualification as well as 19-inch rack assembly from 10 U to 42 U. Founded in 1986 as the electronics supplier of the German Cloos Schweisstechnik group, the company spun off in 2022 and now focuses entirely on the Swiss market, supplying industries such as medical technology, watchmaking and luxury goods, IoT, IT servers, energy systems, industrial electronics and robotics. On 2,500 m² of production space, prototypes through series production are manufactured; delivery is worldwide.
- Site
- Le Locle
- Processes
- PCBA – SMD assembly (down to 01005, micro-BGA), PCBA – THT assembly (computer-controlled coordinate table), Selective soldering, Wave soldering (under nitrogen), Reflow soldering (under nitrogen), Robotic soldering (soldering robot for precision electronics), AOI inspection 100%, In-circuit test (ICT), boundary scan, functional test, burn-in test
- Materials
- FR4, Ceramic (PCB substrate), Flex (Flexible PCB), Aluminium (PCB substrate / die casting), MIM precision parts, Plastic (injection moulding), Silicone (seal), Gold (4N gilding)
- Certificates
- ISO 9001:2015 (SN EN ISO 9001:2015), ISO 13485:2016 (SN EN ISO 13485:2016), IPC-A-610 expert certification, IPC/WHMA-A-620 expert certification, IPC-A-600 expert certification, IPC-7711/7721 expert certification, ISO 9001, ISO 13485, IPC-A-610, IPC/WHMA-A-620, IPC-A-600, IPC-7711/7721
- Founded
- 1986
- Industries
- Medical technology, Watch industry/luxury goods, IoT, IT servers and energy systems, Industrial electronics, Robotics/automation
- 01
Procurement and logistics of electronic components
- 02
PCBA manufacturing (SMD and THT assembly)
- 03
Soldering (wave, selective, reflow, robotic soldering)
- 04
Depaneling (CNC milling)
- 05
Coating and bonding
- 06
Testing (AOI, ICT, boundary scan, functional test, burn-in)
- 07
Box building and system assembly
- 08
Worldwide shipping
Materials & Processes
FR4
Standard substrate for SMD and THT assembly of electronic PCBs.
Ceramic
Ceramic PCB substrate for demanding electronic applications.
Flex (Flexible PCB)
Flexible PCBs, among other things for flexprint assembly in medical technology applications.
Aluminium (PCB substrate)
Aluminium substrates, among other things for LED lighting PCBAs with high thermal requirements.
MIM precision parts
Injection-moulded metal precision parts with micrometre tolerances for microprecision systems.
Gold (4N gilding)
Jewellery-quality gilding for PCBs of high-end watches.
Silicone (seal)
Silicone seals for housing assemblies, e.g. for human-machine interfaces.
Plastic (injection moulding, 3D printing)
Plastic parts from injection moulding as well as 3D-printed gripper components for robotics.
Locations
Le Locle
CHHeadquarters, production, administration
- Materials
- FR4, ceramic, flex, aluminium, MIM, gold, plastic
- Inline SMD assembly line with 100% AOI
- THT assembly with computer-controlled coordinate table
- Selective soldering machine (nitrogen)
- Wave soldering system (nitrogen)
- Reflow oven (nitrogen)
- Soldering robot (since 2023)
- 4-axis dispensing robot
- CNC milling machine for PCBA depaneling
- X-ray component counter
- Automatic PCBA test stations
- Climatic chambers according to IPC/JEDEC J-STD-033A
Products & Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| PCBA – SMD assembly (down to 01005, micro-BGA)Assembly | – | 1.50 m (PCB size) | – | – | FR4, Ceramic, Flex, Aluminium (PCB) |
| PCBA – THT assembly (computer-controlled coordinate table)Assembly | – | – | – | – | FR4, Ceramic, Flex, Aluminium (PCB) |
| Selective solderingJoining | – | – | – | – | – |
| Wave soldering (under nitrogen)Joining | – | – | – | – | – |
| Reflow soldering (under nitrogen)Joining | – | – | – | – | – |
| Robotic soldering (soldering robot for precision electronics)Joining | – | – | – | – | – |
| AOI inspection 100%Testing | – | – | – | – | – |
| In-circuit test (ICT), boundary scan, functional test, burn-in testTesting | – | – | – | – | – |
| Automatic PCBA testers (100% functional testing with traceability)Testing | – | – | – | – | – |
| Box building / device and system assemblyAssembly | – | – | – | – | Aluminium (housing), Silicone (seal) |
| Cable assembly and cable harnesses (100% cable testing)Assembly | – | – | – | – | – |
| Control cabinet construction (schematics in Eplan, control cabinet testing)Assembly | – | – | – | – | – |
| Conformal coating / tropicalisation / PCB lacquering / Parylene coatingSurface | – | – | – | – | – |
| Bonding of housings and mechanical assemblies (IP67)Joining | – | – | – | – | Silicone (seal) |
| Assembly of microprecision systems (MPS)Assembly | Micrometre range · Ra 0.007 | – | – | – | MIM components, Metal |
| Procurement, testing and qualification of batteriesAssembly | – | – | – | – | – |
| 19-inch rack assembly (10 U to 42 U)Assembly | – | – | – | – | – |
| 3D printing of complex gripper systemsAdditive | – | – | – | – | Plastic |
| PCBA rework, repair, modification and retrofit (IPC 7711/7721)Assembly | – | – | – | – | – |
| Bonding (wire bonding) for watch PCBsAssembly | – | – | – | – | Gold (4N gilding) |
| Development and construction of testers (in-circuit, boundary scan, data acquisition)Engineering | – | – | – | – | – |
| Purchasing and logistics of electronic components (procurement management, component sales)Engineering | – | – | – | – | – |
| Depaneling of PCBA (CNC milling machine)Machining | – | – | – | – | – |
| Procurement of injection-moulded, MIM and die-cast aluminium parts (partner)Assembly | – | – | – | – | Plastic, MIM, Aluminium (die casting) |
9 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD assembly line (inline, 100% AOI from the first board) | – | – | PCB sizes up to 1.50 m; components down to 01005 | – | Le Locle, Switzerland |
| THT assembly with computer-controlled coordinate table | – | – | – | – | Le Locle, Switzerland |
| Selective soldering machine (under nitrogen) | – | – | – | – | Le Locle, Switzerland |
| Soldering robot | – | 1 | – | 2023 | Le Locle, Switzerland |
| 4-axis dispensing robot | – | 1 | – | 2021 | Le Locle, Switzerland |
| CNC milling machine for PCBA depaneling | – | – | – | 2019 | Le Locle, Switzerland |
| X-ray component counter | – | – | – | 2020 | Le Locle, Switzerland |
| Automatic PCBA test stations | – | – | – | 2022 | Le Locle, Switzerland |
| Climatic chambers according to IPC/JEDEC J-STD-033A (moisture treatment) | – | – | – | – | Le Locle, Switzerland |
Additional services
Reference customers
Quality & Certification
Quality assurance includes 100% AOI inspection from the first board, in-circuit test, boundary scan, functional testing of all manufactured boards as well as burn-in tests with full traceability via data matrix. The company is certified according to ISO 9001 and ISO 13485 by Bureau Veritas and employs certified IPC experts (IPC-A-600, IPC-A-610, IPC/WHMA-A-620, IPC-7711/7721).
| Evidence | Le Locle |
|---|---|
| ISO 9001 | |
| ISO 13485 | |
| IPC-A-610 | |
| IPC/WHMA-A-620 | |
| IPC-A-600 | |
| IPC-7711/7721 |
Company History
- 1986
Foundation of Cloos Engineering SA by the German Cloos Schweisstechnik group to cover the group's internal needs for electronic PCBs and digital control cabinets.
- 1994
Expansion of the contract manufacturing segment for electronics and electrical engineering with a focus on the Swiss market.
- 1995
First ISO 9001 certification.
- 1996
Integration of SMD technology.
- 1997
Market entry into medical technology (electronic PCBs and control units).
- 2000
Takeover of a 2,500 m² building at the Le Locle site.
- 2003
Full integration of an ERP system.
- 2006
RoHS compliance of the soldering processes (Directive 2002/95/EC).
- 2010
Consolidation of all Swiss electronics business segments under the name CLOOS electronic.
- 2012
Introduction of nitrogen technology for SMD and THT manufacturing.
- 2013
Fully inline SMD production with 100% AOI inspection.
- 2015/2016
First ISO 13485 certification (website: since 2015, certificate: first certification 25.08.2016).
- 2017
Introduction of complete traceability in SMD production.
- 2019
CNC milling machine for PCBA depaneling; air conditioning of the box assembly workshop.
- 2020
Integration of an X-ray component counter.
- 2021
Integration of the first 4-axis dispensing robot.
- 2022
Spin-off from the Cloos group to fully focus on the Swiss market; additional PCBA test stations for 100% functional testing.
- 2023
Integration of the first soldering robot.
- 2024
Recertification of ISO 9001 and ISO 13485 by Bureau Veritas (valid until 24.08.2027).
- 2025
Participation in the Night of Industry in the Canton of Neuchâtel.