Development of embedded computing building blocks: Computer-on-Modules, Single Board Computers and custom embedded systems
congatec GmbH
DeggendorfNew on Amplifa
About congatec
congatec is a German manufacturer and provider of embedded and edge computing technologies headquartered in Deggendorf, Lower Bavaria. The company develops Computer-on-Modules (COMs) compliant with the COM-HPC, COM Express, SMARC and Qseven standards, as well as Single Board Computers, carrier boards, starter kits and custom embedded system solutions. The modules integrate processors from Intel, AMD, Qualcomm, NXP and Texas Instruments and are used in industrial automation, medical technology, robotics, railway technology, energy and communication infrastructure, as well as edge computing. As a fabless developer, congatec does not operate its own manufacturing but has products produced by contract manufacturers; the company covers the entire lifecycle – from design services through system integration including tests and certifications to global logistics. In addition, congatec offers the aReady. platform with pre-configured hardware and software building blocks including IEC 62443-4-1 certified components, cooling concepts and real-time hypervisor technology. Founded in 2004, the company employs over 500 people.
- Site
- Deggendorf
- Processes
- Carrier Board Design, Full Custom Hardware Design, Cooling Solution Design, Mechanics Design, Customization of Single Board Computers and Computer-on-Modules, BIOS/UEFI/Firmware Customization, System Integration incl. Tests and Certifications, Efficient High Quality Production Services (Manufacturing)
- Materials
- Design Services, BIOS/UEFI/Firmware Customization, Signal Integrity Simulation, Real-Time Hypervisor (aReady.VT), IEC 62443-4-1 certified Building Blocks
- Certificates
- IEC 62443-4-1, IEC 62443-4-1 (aReady. Building Blocks), System Integration incl. Tests and Certifications
- Founded
- 2004
- Employees
- +500
- 01
Product selection and design-in
- 02
Hardware and firmware design (carrier boards, full custom, BIOS/UEFI)
- 03
Signal integrity simulation and design reviews
- 04
Prototyping and bring-up support
- 05
Manufacturing by contract manufacturers
- 06
System integration incl. tests and certifications
- 07
Global sales and logistics
- 08
Technical support throughout the entire product lifecycle
Technologies & Processes
Design Services
Customization of Single Board Computers and Computer-on-Modules, carrier board design, full custom hardware, cooling and mechanical design.
BIOS/UEFI/Firmware Customization
Implementation of customer-specific features and settings for embedded applications.
Signal Integrity Simulation
High-speed simulation allows layout adjustments before the first prototype is manufactured.
Real-Time Hypervisor (aReady.VT)
Operation of multiple operating systems including hard real-time on an x86 multicore platform.
IEC 62443-4-1 certified Building Blocks
aReady. building blocks meet many requirements of the EU Cyber Resilience Act already ex works.
Locations
Deggendorf
DEHeadquarters, development and engineering
- Lot size
- Prototype, small to large series (manufacturing by contract manufacturers)
- Materials
- Electronic assemblies, embedded computing hardware
- Signal integrity simulation up to 36 GHz
- Compliance measurements
- EMC measurement support
- MTBF calculations according to Telcordia 3, SN 29500, IEC 61709
Products & Components
Inside the production
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Carrier Board DesignEngineering | – | – | – | – | – |
| Full Custom Hardware DesignEngineering | – | – | – | – | – |
| Cooling Solution DesignEngineering | – | – | – | – | – |
| Mechanics DesignEngineering | – | – | – | – | – |
| Customization of Single Board Computers and Computer-on-ModulesEngineering | – | – | – | – | – |
| BIOS/UEFI/Firmware CustomizationEngineering | – | – | – | – | – |
| System Integration incl. Tests and CertificationsPrüfung | – | – | – | – | – |
| Efficient High Quality Production Services (Manufacturing)Montage | – | – | – | – | – |
| Signal Integrity SimulationEngineering | – | – | – | – | – |
| Schematic Review and Layout ReviewPrüfung | – | – | – | – | – |
| Compliance Measurements (Signal Integrity up to 36 GHz for Rx and Tx)Prüfung | – | – | – | – | – |
| Support for EMC MeasurementsPrüfung | – | – | – | – | – |
| Thermal Solutions (heat stacks, heat pipes, vapor chambers)Engineering | – | – | – | – | – |
| MTBF Reliability Calculations (Telcordia 3, SN 29500, IEC 61709)Prüfung | – | – | – | – | – |
| Cooling solutions: active cooling, passive cooling for edge servers, cooling for fully encapsulatedEngineering | – | – | – | – | – |
| Real-Time Hypervisor (aReady.VT)Engineering | – | – | – | – | – |
Additional services
Reference customers
Quality & Testing
Design quality is ensured through signal integrity simulations, schematic and layout reviews, compliance measurements up to 36 GHz as well as EMC measurement support and MTBF calculations; system integration takes place including tests and certifications.
| Evidence | Deggendorf |
|---|---|
| IEC 62443-4-1 (aReady. Building Blocks) | |
| System Integration incl. Tests and Certifications |
History
- 2004
Founded on December 9, 2004 by 13 former JUMPtec or Kontron employees
- 2014
Growth of the workforce from 13 to over 177
- 2015
Planned Nasdaq IPO cancelled due to a weakening capital market
- 2019
Announced IPO in the Prime Standard of the Frankfurt Stock Exchange postponed to 2020
- 2020
Acquisition by Deutsche Beteiligungs AG; IPO plans become obsolete
- 2025
Acquisition of a majority stake in JUMPtec, the former COM division of Kontron