Cooling systems and heat sinks for power electronics – developed, simulated, manufactured and tested in Germany.
COOLTEC GmbH
New on Amplifa
About COOLTEC
COOLTEC specialises in thermal management for power electronics and delivers cooling solutions from the initial idea through to series supply, all from a single source. The portfolio includes liquid cooling plates for direct-to-chip applications with internal and microchannel structures – milled, joined or additively manufactured – as well as air-cooled heat sinks made from more than 500 standard profiles and customer-specific extrusion profiles. Parts are manufactured in aluminium and copper, including press-fitted and drawn tubes, turbulators and embedded copper spreaders as heat spreaders. Component sizes range from approx. 3 cm to 3 m in length. In addition to development, simulation and design, COOLTEC offers manufacturability and cost reviews, sample and prototype construction (standard 6–8 weeks, express 2–4 weeks) as well as highly automated series production in Germany and low-cost series from Asia. Framework agreements, warehousing and last-time-buy ensure supply throughout the entire product life cycle. Customers include companies from semiconductor technology (EUV lithography), data centers, aerospace, defence, RF & microwave, medical technology, energy and mechanical engineering, including ZEISS, ASML, TRUMPF, SIEMENS, AIRBUS, RHEINMETALL, ABB and GE.
- Processes
- Manufacturing of liquid cooling plates (direct-to-chip, milled, joined or printed), Microchannel / internal channel structures in liquid cooling plates, Air-cooled heat sinks made from more than 500 standard profiles (cutting, drilling, threading), Anodising, Press-fitted tubes (with turbulators), Drawn tubes, Additive Manufacturing (printed heat sinks), Copper inserts as heat spreaders (embedded copper spreaders)
- Materials
- Aluminium, Copper, Anodising, Liquid Cooling Plates (Direct-to-Chip), Extrusion Profiles, Press-Fitted Tubes with Turbulators, Drawn Tubes, Additive Manufacturing
- Industries
- Semiconductors (EUV lithography), Data Center (Direct-to-Chip Cooling), Aerospace, Defence, RF & Microwave, Medical Technology
- 01
Development & Simulation
- 02
Design
- 03
Manufacturability & Cost Review
- 04
Sample & Prototype Construction
- 05
Series Production
- 06
Testing under Extreme Conditions
- 07
Supply & Lifecycle (framework agreements, warehousing, last-time-buy)
Materials & Processes
Aluminium
Base material for air and liquid heat sinks, extrusion profiles and press-fitted tubes – lightweight and cost-effective.
Copper
With approx. 400 W/m·K roughly twice as thermally conductive as aluminium, used for heat spreaders at hotspots.
Anodising
Surface treatment for aluminium heat sinks for corrosion and wear protection.
Liquid Cooling Plates (Direct-to-Chip)
Milled, joined or printed cooling plates with internal and microchannel structures dissipate heat directly from the chip.
Extrusion Profiles
More than 500 standard profiles as well as customer-specific profiles with tooling as the basis for air-cooled heat sinks.
Press-Fitted Tubes with Turbulators
Up to 40 % more cooling capacity at acceptable pressure loss, positioned millimetre-precisely beneath the hotspots.
Drawn Tubes
Forming process for heat sinks with integrated tube channels.
Additive Manufacturing
Printed heat sinks for complex internal channel and microchannel structures.
Copper Inserts as Heat Spreaders
Embedded copper spreaders distribute locally high heat loads in the lightweight aluminium base body.
Locations
Manufacturing and development in Germany
- Lot size
- from a single piece to series
- Materials
- Aluminium, Copper
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Manufacturing of liquid cooling plates (direct-to-chip, milled, joined or printed)Joining | – | up to 3 m length | – | from a single piece – Series | Aluminium, Copper |
| Microchannel / internal channel structures in liquid cooling platesMachining | – | – | – | – | Aluminium, Copper |
| Air-cooled heat sinks made from more than 500 standard profiles (cutting, drilling, threading)Machining | – | – | – | no minimum quantity | Aluminium |
| AnodisingSurface | – | – | – | – | Aluminium |
| Press-fitted tubes (with turbulators)Forming | – | – | – | – | Aluminium |
| Drawn tubesForming | – | – | – | – | Aluminium |
| Additive Manufacturing (printed heat sinks)Additive | – | – | – | – | – |
| Copper inserts as heat spreaders (embedded copper spreaders)Joining | – | – | – | – | Copper |
| Extrusion profiles (customer-specific profiles with tooling)Forming | – | – | – | – | Aluminium |
| Development, simulation and design of cooling solutionsEngineering | – | – | – | – | – |
| Sample and prototype construction (standard 6-8 weeks, express 2-4 weeks)Engineering | – | – | – | 1 | – |
| Series production (highly automated high-tech manufacturing)Joining | – | – | – | – | – |
| Testing under extreme conditions (shock, vibration, temperature)Testing | – | – | – | – | – |
Additional services
Reference customers