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D&S Electronics – Fertigung

Electronics manufacturing: prototype assembly, manual placement from 0201 and SMD/THT assembly through to the finished device.

D&S Electronics Logo

D&S Electronics LTD

Kaufbeuren (P.O. box/administration) · Production facilities Czech RepublicNew on Amplifa

2006Founded
Kaufbeuren, DEAdministrative headquarters
Czech RepublicProduction sites
0201 (metric 0603)Smallest placeable package
±0.03 mmManual placement precision

About D&S Electronics

D&S Electronics LTD is a Bavarian electronics service provider (EMS) with its administrative headquarters in Kaufbeuren and production facilities in the Czech Republic. Since 2006 the company has manufactured electronic assemblies: from the circuit diagram through PCB fabrication and material procurement to the populated, tested and ready-to-ship assembly or complete device. The service portfolio covers prototype manufacturing within a few days, manual placement of all package types from 0201 including BGA, QFP and through-hole, automatic SMD placement, THT and mixed assembly for small and volume production, BGA rework with reballing under the microscope using IR technology, as well as reflow soldering, AOI inspection, programming, functional testing and firmware updates. In addition, SMD stencils, PCB repair, device manufacturing, assembly, warehousing and logistics are offered. Customers thus receive a single point of contact for the entire electronics manufacturing process; entrepreneurs in Germany and Europe are supplied.

Site
Kaufbeuren
Processes
Prototype manufacturing, Manual placement, SMD placement (automatic), THT / through-hole assembly, Mixed assembly (SMD + THT), BGA rework & reballing, BGA/QFN placement, Through-hole construction / free-wired special builds
Materials
Printed circuit board / multilayer, Solder paste, SMD/THT components
Certificates
AOI inspection, Visual inspection of every solder joint, Functional test & firmware update
Founded
2006-12-11
Industries
Electronics/EMS, Development/Prototyping, Small and volume production
  1. 01

    Data intake (circuit diagram, Gerber, BOM)

  2. 02

    Quotation & feasibility check

  3. 03

    Material procurement

  4. 04

    PCB fabrication & SMD stencil manufacturing

  5. 05

    Solder paste printing (stencil)

  6. 06

    SMD/THT/mixed or manual placement

  7. 07

    Reflow soldering

  8. 08

    AOI inspection & visual inspection

  9. 09

    Programming, functional test & firmware update

  10. 10

    Device manufacturing & final assembly

  11. 11

    Warehousing & shipping

Materials & Processes

PCB

Printed circuit board / multilayer

Multilayer PCBs form the basis of every populated assembly, built to customer data.

SMD

SMD/THT components

Electronically sourced components worldwide from package size 0201 including BGA, QFP and QFN.

LP

Solder paste

Applied reproducibly to the pads via precise SMD stencils and melted in the reflow process.

Locations

Kaufbeuren

DE

Administration & Sales

Czech Republic

CZ

Production

Lot size
Single piece to series
Materials
Printed circuit boards, SMD/THT components
  • Automatic SMD placement line (from 0201)
  • Reflow ovens
  • AOI inspection system
  • IR rework station (BGA/reballing)
  • Microscope

Components & Assemblies

Populated multilayer assembly
Populated multilayer assemblySMD placement · EMS
Prototype PCB with BGA
Prototype PCB with BGAPrototype manufacturing · Development
Assembly with QFP and fine-pitch components
Assembly with QFP and fine-pitch componentsManual placement · Small series
Complex mixed assembly
Complex mixed assemblySMD/THT · Volume production

Inside the production

Printed circuit board on the IR rework station
Printed circuit board on the IR rework station

Industries

Electronics/EMSDevelopment/PrototypingSmall and volume production

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Prototype manufacturingAssembly±0.03 mm––Single piece – Small series–
Manual placementAssembly±0.03 mm––Single piece – Small series–
SMD placement (automatic)Assembly–––Single piece – Volume production–
THT / through-hole assemblyAssembly–––––
Mixed assembly (SMD + THT)Assembly–––––
BGA rework & reballingAssembly–––––
BGA/QFN placementAssembly–––––
Through-hole construction / free-wired special buildsAssembly–––––
PCB fabrication (board manufacturing)Joining––––Multilayer PCB
SMD stencils (stencil manufacturing)Joining–––––
Reflow solderingJoining–––––
Programming / flashing of components and assembliesTesting–––––
Functional test & firmware updateTesting–––––
AOI inspection / visual inspectionTesting–––––
PCB repair & repair (TFT/plasma monitors, notebooks)Assembly–––––
Device manufacturing & final assembly (cabling, device building)Assembly–––––
Material procurement (BOM)Engineering–––––
Warehousing & logisticsEngineering–––––

5 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Automatic placement line (SMD)––from package size 0201 (metric 0603)–Czech Republic (production facilities)
Microscope (manual placement/inspection)–––––
IR rework station (BGA replacement/reballing)–––––
AOI inspection system–––––
Reflow ovens–––––

Additional services

Prototype manufacturingManual placement (from 0201, BGA, QFP, through-hole)PCB assembly SMD/THT/mixed assemblyPCB fabricationBGA rework & reballingProgramming/flashingFunctional test & firmware updateRepair (PCBs, TFT/plasma monitors, notebooks)SMD stencilsMaterial procurement (BOM)Device manufacturing & assemblyWarehousing & logistics

Quality

Every assembly is tested before it leaves the house: automatic AOI inspection, visual inspection of every solder joint, functional test and firmware update are part of the standard process.

EvidenceCzech Republic
AOI inspection
Visual inspection of every solder joint
Functional test & firmware update

History

  1. 2006

    Foundation of D&S Electronics LTD on 11.12.2006

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