Develops and manufactures high-tech adhesives as well as dispensing and curing technology for electronics, automotive and semiconductors
DELO Industrie Klebstoffe GmbH & Co. KGaA
Windach (Headquarters) · Shanghai · Shenzhen · Taipei · Boston · Singapore · Yokohama · Kuala Lumpur · SeoulNew on Amplifa
About DELO
DELO Industrie Klebstoffe is a family-owned company headquartered in Windach (Bavaria) that manufactures high-tech adhesives for demanding industrial applications. The portfolio includes UV-, heat- and room-temperature-curing epoxy and acrylate adhesives (including DELO MONOPOX, PHOTOBOND, KATIOBOND, DUALBOND), anaerobic products, encapsulants, electrically conductive and EMI-shielding adhesives, optical bonding materials and black epoxy coatings. In addition, DELO develops and manufactures microdispensing valves, volumetric dispensing systems and LED curing lamps. The adhesives are applied to metals, plastics, glass, ceramics and difficult-to-bond materials such as nickel or PTFE and are used in semiconductor packaging, automotive, consumer and medical electronics, optics/photonics, smart cards and aerospace. Production takes place at the main Windach site; a second production site in Malaysia is planned. The company employs more than 1,200 people worldwide, invests 15% of revenue in R&D and generated revenue of €264 million in 2026 with an export share of 87%.
- Site
- Windach
- Processes
- High-tech adhesives (Industrial Adhesives), UV-/light-curing adhesives (DELO PHOTOBOND, KATIOBOND), Dual curing (DELO DUALBOND, curing from 45 °C / 80 °C), Heat curing (DELO MONOPOX, curing temperature +60 °C to +150 °C), Anaerobic curing (DELO-ML threadlocker, thread sealant), 2-component epoxy adhesives (DELO-DUOPOX, room-temperature curing), Encapsulation and potting (encapsulants), Optical bonding (transparent adhesives with matched refractive indices)
- Materials
- Metals (general, difficult to bond: nickel), Aluminium, Polyamide PA, PBT, Polycarbonate PC, PET, FR4 (glass fiber composite), LCP
- Certificates
- IATF 16949, ISO 9001:2015, ISO 14001:2015, EMAS
- Founded
- 1961
- Employees
- 1,200+
- Industries
- Semiconductors/chip packaging, Automotive, Consumer electronics, Medical electronics, Optics & Photonics, Smart Cards & Labels
- 01
Customer advisory & project consulting
- 02
Customer- or application-specific adhesive development (Customer Innovation
- 03
Mixing & filling of adhesives (production in Windach)
- 04
Development & manufacture of dispensing systems and LED curing lamps
- 05
Quality assurance & documentation
- 06
Logistics & worldwide distribution via subsidiaries and partners
Materials & Processes
Epoxy resin adhesives
One- and two-component epoxy resins (DELO MONOPOX, DUOPOX) for heat- or room-temperature-curing structural bonds and encapsulants.
Light-curing acrylates
UV-/light-curing acrylates (DELO PHOTOBOND) for transparent bonding of glass, plastic and metal.
Cationic epoxy systems
Light-fixable, cationically curing epoxy resins (DELO KATIOBOND), also for opaque components through pre-activation.
Dual-curing adhesives
DELO DUALBOND combines light fixing with a second curing mechanism for shadow areas; curing from 45 °C.
Anaerobic adhesives
DELO-ML as threadlocker and thread sealant for metal connections.
Encapsulation and potting compounds
Encapsulation and potting protect electrical components from moisture, dust and mechanical influences.
Optical materials
Transparent adhesives for optical bonding and black epoxy coatings for stray-light suppression.
Conductive & EMI adhesives
Electrically conductive and shielding adhesives for electronics and semiconductor applications.
Bio-based raw materials
Adhesives such as DELO PHOTOBOND SJ4192 with over 60% share of renewable raw materials (e.g. cashew nut shell oil).
Substrate materials
Adhesive portfolio matched to metal, aluminium, nickel, glass, ceramics as well as plastics such as PA, PBT, PC, PET, FR4, LCP, CFRP, POM, PP and PTFE.
Sites
Windach
DEHeadquarters: administration, production, logistics, R&D
- Materials
- Epoxy and acrylate adhesives
- Pilot plant/trial production (2017)
- Production and logistics facilities
- Automated logistics building (2026)
- Customer Innovation Center
Shanghai
CNSubsidiary DELO Industrial Adhesives (Shanghai) Co., Ltd.
- Customer Innovation Center
Boston
USSubsidiary DELO Industrial Adhesives LLC (since 2008)
- Customer Innovation Center
Singapore
SGSubsidiary DELO Industrial Adhesives (Singapore) Pte. Ltd. (since 2012)
- Customer Innovation Center
Kuala Lumpur
MYSubsidiary (since 2021); planned second production site
Yokohama
JPSubsidiary DELO Industrial Adhesives (Japan) Inc. (since 2017)
Taipei
TWBranch office
Shenzhen
CNOffice
Seoul
KRRepresentative office (since 2014)
Components & Applications
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| High-tech adhesives (Industrial Adhesives)Bonding | – | – | – | – | Metal, Plastic, Glass, Ceramics, PA, PBT, PC, PET, FR4, LCP, CFRP, POM, PP, PTFE, Nickel, Aluminium |
| UV-/light-curing adhesives (DELO PHOTOBOND, KATIOBOND)Bonding | – | – | – | – | Glass, Metal, Aluminium, transparent plastics |
| Dual curing (DELO DUALBOND, curing from 45 °C / 80 °C)Bonding | – | – | – | – | – |
| Heat curing (DELO MONOPOX, curing temperature +60 °C to +150 °C)Bonding | – | – | – | – | – |
| Anaerobic curing (DELO-ML threadlocker, thread sealant)Bonding | – | – | – | – | Metal |
| 2-component epoxy adhesives (DELO-DUOPOX, room-temperature curing)Bonding | – | – | – | – | – |
| Encapsulation and potting (encapsulants)Plastic | – | – | – | – | – |
| Optical bonding (transparent adhesives with matched refractive indices)Bonding | – | – | – | – | Glass, optical components |
| Black epoxy coatings (stray-light suppression, jetting/screen-printing/spray-coating)Surface | – | – | – | – | – |
| Conductive and EMI-shielding adhesivesBonding | – | – | – | – | – |
| Structural bonding (e.g. UV-curing for P-HUD)Bonding | – | – | – | – | – |
| Debonding on demand (removable bonding for repair/recycling)Bonding | – | – | – | – | – |
| Thermally conductive structural adhesives for battery cellsBonding | – | – | – | – | – |
| Liquid pressure-sensitive adhesives (PSA, UV-curing)Bonding | – | – | – | – | – |
| UV lens molding / imprint materials for wafer-level micro-optics (300 mm wafer, TTV < 5 µm)Bonding | TTV < 5 µm | 300 mm (wafer) | – | – | – |
| Sealing of electrical pins and busbars (e-mobility)Bonding | – | – | – | – | – |
| ONSERT (adhesive fasteners for lightweight construction, aerospace)Bonding | – | – | – | – | – |
| Project consulting / engineering for bonding processesEngineering | – | – | – | – | – |
| Customer-specific adhesive development (Customer Innovation Center)Engineering | – | – | – | – | – |
14 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Microdispensing valve | DELO DELO-DOT PN5 / PN5 LV | – | – | – | – |
| Vacuum cleaning station for dispensing valves | DELO DELO-DropX VP2 | – | – | – | – |
| Volumetric dispensing systems | DELO DELO-DIV Series | – | – | – | – |
| Semi-automatic dispensing unit | DELO DELOMAT 101 | – | – | – | – |
| Activation-on-the-flow dispensing unit (dispensing + pre-activation in one step) | DELO DELO-ACTIVIS 330 / 600 | – | – | – | – |
| Pneumatic small cartridge adapter | DELO DELO-XPRESS C30 | – | – | – | – |
| Retraction valve | DELO DELO-DOT RE | – | – | – | – |
| LED area curing lamp (small area emitter, >25,000 mW/cm²) | DELO DELOLUX 30 / 30 all-in-one | – | Light exit area Ø 23 mm | – | – |
| LED line curing lamp (peak >22,500 mW/cm², working distance up to 100 mm) | DELO DELOLUX 301 | – | Light exit 38.7 mm × 8.45 mm | – | – |
| LED area lamp series | DELO DELOLUX 20 / 202 / 203 / 204 | – | – | – | – |
| High-intensity LED spot lamps | DELO DELOLUX 50 / 502–506 | – | – | – | – |
| Control unit for LED lamps | DELO DELOLUX pilot Axi / AxT (PROFINET) | – | – | – | – |
| Light intensity meter (1 mW/cm² – 40 W/cm²) | DELO DELOLUXcontrol / RS232 | – | – | – | – |
| Pilot plant / trial production | DELO | – | – | 2017 | Windach |
Additional services
Reference customers
Quality & Certification
DELO is certified according to ISO 9001, ISO 14001 and IATF 16949 (certified by DEKRA) as well as according to EMAS. Testing and metrology equipment includes, among others, the light intensity meter DELOLUXcontrol for calibrating the curing lamps.
| Evidence | Windach |
|---|---|
| ISO 9001:2015 | |
| ISO 14001:2015 | |
| IATF 16949 | |
| EMAS |
Company History
- 1961
Founded in Munich with polyester fillers and epoxy resins
- 1994
Relocation to Landsberg am Lech
- 1998
Management buy-out by Dr. Wolf-Dietrich Herold and Sabine Herold
- 2005
Own offices in Shanghai and Singapore
- 2007
Complete relocation of the site to Windach
- 2008
Subsidiary in Boston; revenue exceeds €30 million for the first time, 210 employees
- 2012
Subsidiary in Singapore
- 2013
Subsidiary in Shanghai; €51 million revenue; 5,000 m² production and logistics building
- 2014
Representative offices in South Korea and Malaysia; German Economy Innovation Award
- 2016
Revenue €80 million; n-tv Hidden Champion Award
- 2017
Subsidiary in Yokohama; world market leader in smart card bonding (~80% market share); administration building and pilot plant
- 2018
660 employees, €159 million revenue
- 2019
World record: 17.5-t truck lifted with 3 g of adhesive
- 2020
New technology building; production expanded by over 4,000 m²
- 2021
Subsidiary in Malaysia; Apple recognizes DELO as an important partner
- 2023
More than 1,000 employees
- 2024
Land purchase near Kuala Lumpur for second production site
- 2025
Revenue €245 million; Best Managed Company Award (Deloitte)
- 2026
Revenue €264 million; new automated logistics building in Windach