Development and manufacture of plasma, parylene and vacuum systems as well as contract surface treatment
Diener electronic GmbH & Co. KG
Ebhausen (headquarters) · Ebhausen (contract treatment, cleanroom) · Jettingen (management) · Shanghai (laboratory)New on Amplifa
About Diener electronic
Diener electronic GmbH & Co. KG, headquartered in Ebhausen (Baden-Württemberg), has been developing and manufacturing systems for plasma surface treatment since 1993. The portfolio covers low-pressure plasma systems from laboratory size (approx. 1 liter) to production systems with over 12,000 liters of chamber volume, atmospheric-pressure plasma systems of the PlasmaBeam series, parylene coating systems, as well as vacuum systems and aluminium vacuum chambers. In-house developed RF generators (40 kHz, 13.56 MHz, 2.45 GHz) and an own design department for custom systems complement the system engineering. Around 30 systems are available in the technical center for process development. As a service provider, the company offers contract treatment including plasma treatment in a cleanroom per ISO 14644-1, parylene contract coating, silanization (CVD) as well as vacuum processes such as degassing, drying and potting. Approximately 700 plasma systems are built per year; around 13,000 systems have been sold worldwide. The company employs more than 110 staff, has provided apprenticeship training since 2002 and supplies industries ranging from medical technology and electronics to automotive, optics and aerospace.
- Site
- Ebhausen
- Processes
- Plasma cleaning, Plasma activation, Plasma etching (isotropic/anisotropic etching, RIE), Plasma coating, Parylene coating (N, C, D, F-VT4), Silanization (CVD), Vacuum degassing, Vacuum drying
- Materials
- Parylene N, Parylene C, Parylene D, Parylene F-VT4, Plastics, Rubber, Ceramics, Glass
- Certificates
- Cleanroom ISO 14644-1
- Founded
- 1993
- Employees
- more than 110
- Industries
- Automotive engineering/automotive suppliers, Medical technology, Electronics and electrical engineering, Semiconductor technology, Optics, Precision engineering
- 01
Process development in the in-house technical center (approx. 30 systems)
- 02
Design of custom systems in an in-house design department
- 03
System engineering (low-pressure, atmospheric pressure, parylene, vacuum)
- 04
In-house development of RF generators
- 05
Contract treatment incl. cleanroom treatment
- 06
Service, maintenance and modernization worldwide
Materials and processes
Poly(p-xylylene) N
Basic form with good crevice penetration and dielectric properties, preferred for electronic components and catheters.
Parylene C
Most commonly used type with excellent barrier effect and high moisture protection.
Parylene D
Parylene type for applications with increased thermal and chemical requirements.
Parylene F-VT4
Fluorinated parylene type with high temperature resistance.
Aluminium
Material of the flexible vacuum chambers made from extruded profiles, easily heatable.
Stainless steel
Chamber material of many low-pressure plasma systems and parylene systems.
Silicon
Substrate for wafer cleaning, hydrogen plasma activation and silanization in semiconductor technology.
Ceramics
Material that can be cleaned and activated with atmospheric-pressure plasma.
Glass
Treatable material e.g. in plasma activation and silanization; borosilicate glass as chamber material of the Zepto systems.
Rubber/elastomers
Typical bulk material for plasma treatment in rotating drum chambers, e.g. O-rings.
Copper
Metallic material that can be cleaned by plasma.
Locations
Ebhausen
DEHeadquarters: system engineering, administration, process development, technical center
- Lot size
- Individual systems to series systems
- Materials
- Aluminium, stainless steel
- Low-pressure plasma systems Zepto to Tetra 12600
- Atmospheric-pressure systems PlasmaBeam
- Parylene coating systems P6 to P300
- Aluminium vacuum chambers
- RF generators 40 kHz, 13.56 MHz, 2.45 GHz
- CVD/silanization systems
Ebhausen (Carl-Schickhardt-Str. 40)
DEContract treatment (Diener Plasma GmbH & Co. KG), since 2025 with cleanroom per ISO 14644-1
- Lot size
- Prototype to series
- Materials
- Plastics, metal, ceramics, glass
- Plasma systems for contract treatment
- Cleanroom ISO 14644-1
- Parylene contract coating
Jettingen
DESeat of the management
Shanghai
CNLaboratory/site with distributor Shanghai Verde Instrument Technology
Systems and treatment solutions
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Plasma cleaningSurface | – | – | – | – | Polymers, Metals, Ceramics, Glass, Hybrid materials, Plastics |
| Plasma activationSurface | – | – | – | – | Plastics, Metals, Ceramics, Glass, Elastomers |
| Plasma etching (isotropic/anisotropic etching, RIE)Surface | – | – | – | – | PTFE, Silicon, Plastics |
| Plasma coatingSurface | – | – | – | – | Plastics, various substrates |
| Parylene coating (N, C, D, F-VT4)Surface | – | – | – | – | Parylene |
| Silanization (CVD)Surface | – | – | – | – | Plastics, Glass, Silicon |
| Vacuum degassingSurface | – | – | – | – | – |
| Vacuum dryingSurface | – | – | – | – | – |
| Manual vacuum pottingSurface | – | – | – | – | – |
| Altitude simulation / pressure testTesting | – | – | – | – | – |
| Leak testingTesting | – | – | – | – | – |
| Sensor calibrationTesting | – | – | – | – | – |
| Powder and bulk material plasma treatmentSurface | – | – | – | – | Rubber, Plastics, Powder, Granulate |
| Contract surface modification in a cleanroom per ISO 14644-1Surface | – | – | – | – | – |
| Process developmentEngineering | – | – | – | – | – |
| Wafer cleaning with plasmaSurface | – | – | – | – | Silicon |
| Activation with hydrogen plasma / water vaporSurface | – | – | – | – | Silicon |
63 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Low-pressure plasma system | Diener electronic Zepto ONE | – | approx. 2 liters | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Zepto | – | approx. 1-3 liters | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Atto | – | approx. 10 liters | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Femto | – | approx. 2-4 liters | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Pico | – | approx. 4-8 liters | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Nano | – | approx. 18-24 liters | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 30 | – | approx. 28-57 liters | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 45 | – | approx. 46 liters | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 100 | – | approx. 100 liters | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 150 | – | approx. 150 liters | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 270 | – | approx. 270 liters, chamber W 600 x H 600 x D 750 mm | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 320R | – | approx. 322 liters, ⌀ 640 mm x D 1000 mm | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 360 | – | approx. 360 liters, chamber W 600 x H 600 x D 1000 mm | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 640 | – | approx. 640 liters, chamber W 800 x H 800 x D 1000 mm | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 1000 | – | approx. 1000 liters, chamber W 1000 x H 1000 x D 1000 mm | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 1440 | – | approx. 1440 liters, chamber W 1200 x H 1200 x D 1000 mm | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 2800 | – | approx. 2827 liters, ⌀ 1200 mm x D 2500 mm | – | Ebhausen |
| Low-pressure plasma system (custom systems) | Diener electronic Tetra 140 RAPID | – | – | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 2880 | – | – | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 3600 | – | – | – | Ebhausen |
| Low-pressure plasma system | Diener electronic Tetra 12600 | – | approx. 12,600 liters | – | Ebhausen |
| Low-pressure plasma system (powder/bulk material) | Diener electronic Tetra 120 | – | – | – | Ebhausen |
| Low-pressure plasma system (powder) | Diener electronic Tetra 300 | – | – | – | Ebhausen |
| Low-pressure plasma system (bulk material, rotating) | Diener electronic Tetra 1400 | – | approx. 1400 liters | – | Ebhausen |
| Atmospheric-pressure plasma system (PlasmaBeam) | Diener electronic PlasmaBeam STANDARD | – | Treatment width approx. 8-12 mm | – | Ebhausen |
| Atmospheric-pressure plasma system | Diener electronic PlasmaBeam 19" | – | Treatment width approx. 8-12 mm | – | Ebhausen |
| Atmospheric-pressure plasma system | Diener electronic PlasmaBeam DUO | – | 2 nozzles, treatment width approx. 8-12 mm | – | Ebhausen |
| Atmospheric-pressure plasma system | Diener electronic PlasmaBeam PC | – | – | – | Ebhausen |
| Atmospheric-pressure plasma system | Diener electronic PlasmaBeam Mini | – | Treatment width 3-5 mm | – | Ebhausen |
| Atmospheric-pressure plasma system | Diener electronic PlasmaBeam Quattro | – | Treatment width approx. 32 mm | – | Ebhausen |
| Atmospheric-pressure plasma system (rotating) | Diener electronic PlasmaBeam RT | – | Treatment width approx. 120 mm | – | Ebhausen |
| DBD plasma system | Diener electronic DBD B4.2 | – | 4.25 liter glass chamber | – | Ebhausen |
| DBD quartz glass tube | Diener electronic DBD 565 | – | – | – | Ebhausen |
| DBD quartz glass reactor | Diener electronic DBD 228 | – | ⌀ 27 mm x H 400 mm (approx. 228 cm³) | – | Ebhausen |
| DBD Plasma Beam | Diener electronic DBD Plasma Beam Mini Helium | – | Treatment width approx. 5-10 mm | – | Ebhausen |
| Parylene coating system | Diener electronic Parylene P6 | – | ⌀ 200 mm x H 200 mm, approx. 6 liters | – | Ebhausen |
| Parylene coating system | Diener electronic Parylene P17 | – | ⌀ 300 mm x H 295 mm, approx. 21 liters | – | Ebhausen |
| Parylene coating system | Diener electronic Parylene P35 | – | ⌀ 250 mm x H 450 mm, approx. 35 liters | – | Ebhausen |
| Parylene coating system | Diener electronic Parylene P1200D | – | – | – | Ebhausen |
| Parylene coating system | Diener electronic Parylene P260 | – | – | – | Ebhausen |
| Parylene coating system | Diener electronic Parylene P300 | – | – | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC P110x120 | – | approx. 4-8 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC P150x160 | – | approx. 8-14 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC P240x240 | – | approx. 24 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC P305x300 | – | approx. 34-58 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC P572x125 | – | approx. 21-46 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC P400x400 | – | approx. 95 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC P400x400 HV | – | approx. 100 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC P400x600 / VC P600x400 | – | approx. 151 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC P700D | – | approx. 322-450 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC M600² | – | approx. 360 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC M800² | – | approx. 640 liters | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC M1000² | – | approx. 1000 liters, 1000 x 1000 x 1000 mm | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC M1200² | – | approx. 1440 liters, 1200 x 1200 x 1000 mm | – | Ebhausen |
| Vacuum chamber (aluminium) | Diener electronic VC M1600x1800 | – | approx. 4320 liters, 1600 x 1800 x 1500 mm | – | Ebhausen |
| RF generator 13.56 MHz | Diener electronic 13.56 MHz 100 W | – | – | – | Ebhausen |
| RF generator 13.56 MHz | Diener electronic 13.56 MHz 300 W | – | – | – | Ebhausen |
| LFG generator | Diener electronic LFG 500W | – | – | – | Ebhausen |
| LFG generator | Diener electronic LFG 1000W | – | – | – | Ebhausen |
| LFG generator | Diener electronic LFG 3000W | – | – | – | Ebhausen |
| LFG generator | Diener electronic LFG 5000W | – | – | – | Ebhausen |
| Microwave generator | Diener electronic 2.45 GHz 1000 W | – | – | – | Ebhausen |
| CVD/silanization system | Diener electronic | – | – | – | Ebhausen |
Additional services
Quality
Processes are monitored via PC control systems that continuously record and document all relevant process parameters (pressure, temperature and time profiles). For contract treatment, a cleanroom per ISO 14644-1 is available; service includes calibration of measuring devices and VDE testing.
| Evidence | Ebhausen |
|---|---|
| Cleanroom ISO 14644-1 |
History
- 1993
Founded by Christof Diener at the Jettingen site, focusing on plasma systems and high-frequency generators.
- 1997
Growth to five employees, relocation to Nagold.
- 2000
Official incorporation of the GmbH.
- 2002
Hiring of the first apprentice; continuous apprenticeship training since then with approx. 10 apprentices.
- 2004
Sale of the first in-house developed atmospheric-pressure system.
- 2010
Relocation of headquarters to Ebhausen, Nagolder Str. 61.
- 2011
Sale of the first own parylene system.
- 2015
Expansion of the product portfolio with vacuum chambers.
- 2018
Introduction of own vacuum systems; opening of an own laboratory in Shanghai with the distributor Shanghai Verde Instrument Technology.
- 2023
Appointment of Felix Diener as managing director, start of the generational change.
- 2025
Expansion into the renovated building on Carl-Schickhardt-Straße in Ebhausen; contract treatment moves into new premises including a cleanroom.