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Dietze Group – Fertigung

Hermetic glass-to-metal feedthroughs, contact pins and stamped parts for electronics, sensor technology and automotive

Dietze Group Logo

Dietze Group (Eldur AG)

Maienfeld (CH) · Kehl (DE) · Altena (DE) · Bangor, ME (US) · Nesvady (SK)New on Amplifa

1921Founded as Brückner & Dietze in Coburg
5Production sites in Europe and the USA
3Business divisions: glass-to-metal, contact pins/stamped
up to 3000 barOperating pressure of pressure glass feedthroughs
up to 30 × 20 cmSize of hermetic terminal plates

About the Dietze Group

The Dietze Group is a family-owned corporate group headquartered in Maienfeld (Switzerland), specialising in customised electrical connection components. The portfolio comprises glass-to-metal feedthroughs for hermetically sealed housings, wire-based and stamped contact pins (EloPin®, Elbik-X-Press®) as well as current feedthroughs for lighting technology. Core processes include glass-to-metal joining technology in self-developed precision furnaces at around 1000 °C under inert or reducing atmosphere, wire forming technology (blunt-pyramidal swaging and thermal tearing), stamping technology on Bruderer stamping presses, and in-house stamping tool manufacturing with wire EDM, die-sinking EDM, hard machining and precision grinding. Materials range from brass, bronze and copper alloys to stainless steel, titanium and special alloys (Kovar, Alloy 42, Inconel), through to technical glasses, glass-ceramics and sapphire. The group supplies the automotive, aerospace, electronics, lighting, energy, refrigerant, medical technology and sensor industries. Production sites are located in Switzerland, Germany, the USA and Slovakia.

Site
Maienfeld
Processes
Wire forming / blunt-pyramidal swaging for contact pins, Thermal tearing of pin ends, Stamping technology for stamped connectors (EloPin), Tool manufacturing for stamping tools (progressive compound dies in modular design), Wire EDM, die-sinking EDM, hard machining, precision grinding (tool manufacturing), Glass-to-metal joining technology (pressure glass feedthroughs and matched feedthroughs), Glass-ceramic feedthroughs (controlled crystallisation during sealing), Hermetic integration of ceramic and sapphire parts into glass feedthroughs
Materials
Brass, Bronze, Copper-based alloys, Copper, Stainless steel, Titanium, Carbon steel, Kovar
Certificates
ISO 9001:2015, ISO 9001, IATF 16949 (processes aligned with the standard)
Founded
1921
Industries
Automotive, Aerospace & Defence, Electronics, Lighting/Lighting Technology, Energy, Refrigerant Industry
  1. 01

    Wire/stamped part and glass body pre-fabrication

  2. 02

    Wire forming (swaging, thermal tearing) or stamping technology

  3. 03

    In-house tool manufacturing (EDM, hard machining, grinding)

  4. 04

    Glass-to-metal sealing in precision furnaces

  5. 05

    Surface finishing (electroplating)

  6. 06

    Brazing / press-fit technology

  7. 07

    Final inspection (100% optical inspection, leak testing, burst pressure,

Materials and Processes

CuZn

Brass

The most common wire material for customised contact pins in wire forming technology.

CuSn

Bronze

Used as a contact pin wire material with good spring properties.

Cu

Copper and copper-based alloys

Allow high current-carrying capacity at small pin diameters, e.g. in glass-ceramic feedthroughs.

1.4xxx

Stainless steel

Housing material for pressure glass feedthroughs with high pressure resistance.

Ti

Titanium

Can be sealed completely oxide-free in specially developed precision furnaces.

FeNi

Kovar / Alloy 42 / NiFe47

NiFe alloys for matched glass feedthroughs with low residual stresses.

NiMo

Inconel / Hastelloy / Molybdenum

High-grade special alloys for extreme environmental conditions.

Glas

Borosilicate and technical glasses

Lens glasses and sealing glasses as sintered glass bodies or drawn glass tubes.

Glaskeramik

Glass-ceramic

Temperature-resistant up to 700 °C through controlled crystallisation during sealing.

Al2O3

Ceramic and sapphire

Can be hermetically integrated into glass feedthroughs, e.g. for optical sensors.

Lot

Ag-Cu-Pd / Au-Ni brazing alloys

Brazing at 800–1000 °C in combination with the glass feedthrough process.

HM

Carbide and tool steel

Tool components for in-house stamping tool manufacturing.

Production Sites

Standort Eldur AG, Maienfeld

Eldur AG, Maienfeld

CH

Holding, administration and production of glass-to-metal feedthroughs, contact pins, current feedthroughs

Materials
Stainless steel, titanium, copper, technical glasses, glass-ceramic
  • In-house precision sealing furnaces with multiple temperature zones
  • Wire processing machines with swaging units
  • Camera systems for 100% inspection
Standort Elbik GmbH, Kehl

Elbik GmbH, Kehl

DE

Production of contact pins and hybrid parts

Lot size
Small to large series
Materials
Brass, bronze, copper-based alloys
  • Wire processing machines with swaging units
  • Thermal tearing process
Standort Elbik Stanztechnik GmbH, Altena

Elbik Stanztechnik GmbH, Altena

DE

Production of stamped parts, hybrid parts, stamping tool manufacturing

Lot size
Large series (stamping presses)
Materials
Steel, copper alloys, carbide
  • Bruderer stamping presses
  • Wire EDM machine
  • Die-sinking EDM machine
  • Hard machining centre
  • Precision grinding machine
Standort Eldur Corporation, Bangor

Eldur Corporation, Bangor

US

Production of glass-to-metal feedthroughs, contact pins, stamped parts, current feedthroughs

Standort Eldur Slovakia k.s., Nesvady

Eldur Slovakia k.s., Nesvady

SK

Production of glass-to-metal feedthroughs and current feedthroughs

Components

Glass-to-metal feedthroughs
Glass-to-metal feedthroughsGlass-to-metal joining technology · sensor technology, energy, medical technology
Contact pins and stamped parts
Contact pins and stamped partsWire forming / stamping · automotive, electronics
Current feedthroughs (Lead-in Wires)
Current feedthroughs (Lead-in Wires)Wire technology · lighting technology
Hermetic terminal plates
Hermetic terminal platesGlass-to-metal joining technology · refrigerant industry
Reeled press-fit contacts
Reeled press-fit contactsPress-fit technology (Elbik-X-Press®) · automotive

Inside the production

Precision sealing furnace for glass-to-metal joints
Precision sealing furnace for glass-to-metal joints
Wire processing machine
Wire processing machine
Inside the production hall
Inside the production hall
Maienfeld site
Maienfeld site

Industries

AutomotiveAerospace & DefenceElectronicsLighting/Lighting TechnologyEnergyRefrigerant IndustryMedical TechnologySensor Technology

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Wire forming / blunt-pyramidal swaging for contact pinsForming––small to medium-sized series–Brass, Bronze, Copper-based alloys
Thermal tearing of pin endsFormingseamless, burr-free pin ends–––Brass, Bronze, Copper-based alloys
Stamping technology for stamped connectors (EloPin)Forming––––Steel, Copper alloys
Tool manufacturing for stamping tools (progressive compound dies in modular design)Engineeringhighest precision–––Steel, Carbide
Wire EDM, die-sinking EDM, hard machining, precision grinding (tool manufacturing)Machining––––Steel, Carbide
Glass-to-metal joining technology (pressure glass feedthroughs and matched feedthroughs)Joining–up to 30 cm × up to 20 cm (terminal plates)–Current-carrying capacity up to 300A;Stainless steel, Titanium, Copper, Kovar, Alloy 42, Molybdenum, NiFe47 / Alloy 52, Inconel, Hastelloy, Carbon steel
Glass-ceramic feedthroughs (controlled crystallisation during sealing)Joining–up to 30 cm × up to 20 cm–Temperatures up to 700 °C;Copper, Stainless steel
Hermetic integration of ceramic and sapphire parts into glass feedthroughsJoining––––Ceramic, Sapphire
Glass preform technology (sintered glass bodies by pressing and sintering; drawn glass tubes)Plastics––––Technical glasses, Borosilicate, Barium oxide, Soda-lime, Aluminoborate
Brazing in combination with the glass feedthrough processJoining–––Brazing temperatures 800 to 1000 °CAg-Cu-Pd, Au-Ni
Surface finishing / electroplating (full or selective)Surface––––Nickel, Soft gold, Hard gold, Zinc, Tin (Sn 100% matte on Ni)
Press-fit technology (EloPin®, Elbik-X-Press®) for solder-free PCB assemblyAssemblyHole diameter 0.60 +/-0.05 mm to 1.49 +/-0.05 mm––Temperature range -40°C to +150°C; IECCopper, Brass, Bronze, Copper-based alloys
Manufacture of current feedthroughs / lead-in wiresJoining––––Silicon, Glass
Final inspection / testing: optical inspection (100%), leak testing, burst pressure testing,Testing–––––
Moulding of customer-specific products (hybrid parts with plastic injection moulding partners)Plastics–––––

7 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Bruderer stamping pressesBruderer–––ELBIK Stanztechnik GmbH, Altena
Precision furnaces (sealing furnaces) for glass-to-metal joints, multiple temperature zones,in-house development–Furnace temperature approx. 1000 °C–Dietze Group
Wire processing machines with swaging units––––Dietze Group
Wire EDM machine––––ELBIK Stanztechnik GmbH (tool manufacturing)
Die-sinking EDM machine––––ELBIK Stanztechnik GmbH (tool manufacturing)
Hard machining centre––––ELBIK Stanztechnik GmbH (tool manufacturing)
Precision grinding machine––––ELBIK Stanztechnik GmbH (tool manufacturing)

Additional services

Custom design from concept to series productionWire forming technology for contact pins (swaging, thermal tearing)Stamping technology / stamped carrier stripsStamping tool manufacturing (design and production in-house, wire/die-sinking EDM, hard machining,Press-fit technology (EloPin, Elbik-X-Press)Glass-to-metal joining technology (pressure glass and matched feedthroughs, glass-ceramic,Glass preform technology (sintered glass bodies, drawn glass tubes)Surface finishing (electroplating: Ni, gold, zinc etc.)100% optical inspection, leak, burst pressure and insulation testingBrazing combined with glass feedthroughs

Quality

The Dietze Group operates a quality management system certified to ISO 9001; as an automotive supplier, many internal processes are aligned with IATF 16949. Final inspection includes 100% optical inspection as well as leak, burst pressure and insulation tests.

EvidenceDietze Group
ISO 9001
IATF 16949 (processes aligned with the standard)

History

  1. 1921

    Foundation of Brückner & Dietze in Coburg by Bruno Dietze and Gustav Brückner; mechanical engineering for the lighting industry

  2. 1931

    Focus on current feedthroughs; operations in Vienna, Paris, Turin and London

  3. 1960

    Foundation of Eldur AG in Maienfeld by Dr. Wolfgang Dietze

  4. 1989

    Werner Dietze acquires Elbik GmbH; entry into the contact pin and connector industry

  5. 1996

    Foundation of Eldur Corporation in Bangor, Maine (USA)

  6. 2000

    Foundation of Eldur (Shanghai) Electronic Components Co for diode current feedthroughs and SMD stamped parts

  7. 2005

    Foundation of Eldur Slovakia k.s. in Nesvady

  8. 2006

    Acquisition of GMV Steinach; entry into glass-to-metal joining technology

  9. 2015

    Acquisition of Kasperzik Werkzeugbau to strengthen the stamping division

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