Custom sensor solutions and electronics manufacturing from chip-on-board prototypes to series production
duotec GmbH
Halver (DE) · Greifswald (DE) · Delémont (CH) · Arteaga (MX) · Białe Błota (PL)New on Amplifa
About duotec
duotec GmbH, headquartered in Halver (North Rhine-Westphalia), specializes in custom sensor solutions and electronics manufacturing. The portfolio includes force, pressure and position sensors, quantum crypto sensors (Quantum Key Distribution) and a sensor gateway. As a service provider, the company offers electronics development (E²MS), electronics manufacturing (EMS) with SMT and THT assembly, box-build, new product introduction and test equipment design. In the technology lab, chip-on-board production, thick-film hybrid technology, wire bonding, potting, micro dispensing, vapor phase soldering and glass frit technology for MEMS assemblies are realized; functional samples are created in rapid prototyping within 48 hours. Special technologies include direct overmolding, printing on glass and automation & process development. Part of production takes place in a 250 m² cleanroom of Class ISO 6. An international manufacturing network with sites in Delémont (Switzerland), Greifswald, Arteaga (Mexico) and Białe Błota (Poland) enables worldwide scaling. Customers come from industries such as automotive, medical technology, industrial, robotics, food, chemical and energy sectors, telecommunications and quantum technology.
- Site
- Halver
- Processes
- Chip-on-Board (CoB) manufacturing, Thick-film hybrid technology, Wire bonding (Al/Au wire bonding), Potting, Micro dispensing, Rapid prototyping (functional sample within 48 hours), SMT assembly, THT assembly
- Materials
- Aluminium (bond wire), Gold (bond wire), Glass frit, Plastic (encapsulation compounds/overmolding), Glass (printing on glass), Steel (pressure-shock-resistant steel construction), Glass, Steel
- Certificates
- ISO 9001, IATF 16949
- Industries
- Automotive industry, Medical technology, Industry & automation, Robotics, Food industry, Chemical industry
- 01
Electronics development (E²MS) / Design for Manufacturing
- 02
Rapid prototyping / sample building (48 h functional sample)
- 03
New Product Introduction
- 04
Technology lab: CoB, wire bonding, thick-film hybrid, potting, micro dispensing
- 05
SMT/THT assembly and vapor phase soldering
- 06
Special technologies: direct overmolding, printing on glass, electronics
- 07
Box-build / final assembly
- 08
Inspection & testing / quality inspection
- 09
Series production in the manufacturing network (DE, CH, MX, PL)
- 10
End-of-Life Production
Materials & Processes
Gold (bond wire)
Wire bonding for chip-on-board assemblies in the technology lab
Aluminium (bond wire)
Al wire bonding for CoB and hybrid assemblies
Glass frit
Glass frit technology for joining MEMS assemblies in special furnaces
Plastic (encapsulation compounds/overmolding)
Potting and direct overmolding for protection and integration of electronics
Glass
Substrate for thick-film printing technology (printing on glass)
Steel
Pressure-shock-resistant steel construction in differential pressure sensors
Thick-film pastes
Screen printing and sintering for thick-film hybrid circuits
Sites & Manufacturing Network
Halver
DEHeadquarters, development, technology lab and manufacturing
- Lot size
- Prototypes to medium series
- Materials
- Aluminium, gold, glass frit, plastic, glass
- Cleanroom Class ISO 6 (250 m²)
- Automated screen printing system
- Pick-and-place machine (SMT)
- COB technology (dispensing, die bonding, Al/Au wire bonding, glob top)
- Special furnaces / process furnaces (200–900 °C)
- Vapor phase oven
- Adhesive & potting systems
- Automation cell
Greifswald
DEManufacturing network (ml&s GmbH & Co. KG)
Delémont
CHManufacturing network (ml&s Suisse SA)
Arteaga, Coahuila
MXManufacturing network (ml&s Mexico S de RL de C.V.)
Białe Błota
PLManufacturing partner (Tabemax Sp.J.)
Components & Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Chip-on-Board (CoB) manufacturingAssembly | – | – | – | Prototypes – medium series | – |
| Thick-film hybrid technologyEngineering | – | – | – | – | – |
| Wire bonding (Al/Au wire bonding)Joining | – | – | – | – | Aluminium, Gold |
| PottingAssembly | – | – | – | – | Plastic (encapsulation compounds) |
| Micro dispensingAssembly | – | – | – | – | – |
| Rapid prototyping (functional sample within 48 hours)Assembly | – | – | – | – | – |
| SMT assemblyAssembly | – | – | – | – | – |
| THT assemblyAssembly | – | – | – | – | – |
| Vapor phase soldering (gentle SMT soldering process)Joining | – | – | – | – | – |
| Glass frit technology for MEMS assembliesJoining | – | – | – | – | Glass frit |
| Drying, curing and sintering (200 °C to 900 °C)Heat treatment | – | – | – | – | – |
| Printing & sintering technologies (thick-film and hybrid technology)Engineering | – | – | – | – | Thick-film pastes |
| Manual assembly tasks / final assemblyAssembly | – | – | – | – | – |
| Material qualificationTesting | – | – | – | – | – |
| Quality inspection & analysesTesting | – | – | – | – | – |
| Cleanroom manufacturing (Class ISO 6, 250 m² cleanroom)Assembly | – | – | – | – | – |
| Automation & process developmentEngineering | – | – | – | – | – |
| Direct overmoldingPlastics | – | – | – | – | Plastic |
| Printing on glassSurface | – | – | – | – | Glass |
| Sample buildingEngineering | – | – | – | – | – |
| Box-buildAssembly | – | – | – | – | – |
| Electronics protectionSurface | – | – | – | – | – |
| Inspection & testingTesting | – | – | – | – | – |
| Test equipment designEngineering | – | – | – | – | – |
| New Product Introduction (NPI)Engineering | – | – | – | – | – |
| Design for ManufacturingEngineering | – | – | – | – | – |
| End-of-Life ProductionAssembly | – | – | – | – | – |
| Miniaturization of electronic componentsEngineering | – | – | – | – | – |
| Electronics development (E²MS)Engineering | – | – | – | – | – |
7 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Automated screen printing system | – | – | – | – | Halver (technology lab) |
| Pick-and-place machine (SMT) | – | – | – | – | Halver (technology lab) |
| Vapor phase oven | – | – | – | – | Halver (technology lab) |
| Special furnaces / process furnaces (200 °C to 900 °C) | – | – | – | – | Halver (technology lab) |
| Adhesive & potting systems | – | – | – | – | Halver (technology lab) |
| Cleanroom (Class ISO 6) | – | – | 250 m² | – | Halver |
| Automation cell | – | – | – | – | – |
Additional services
Reference customers
Quality & Certification
duotec GmbH is certified to ISO 9001 and holds the automotive certification IATF 16949. Quality assurance includes inspection & testing, test equipment design, material qualification as well as cleanroom manufacturing in Class ISO 6.
| Evidence | Halver |
|---|---|
| ISO 9001 | |
| IATF 16949 |
History
More than 30 years of experience in sensor technology and electronics
Establishment of a 250 m² cleanroom of Class ISO 6 at the technology lab in Halver
Development of an international manufacturing network with sites in Delémont, Greifswald, Arteaga and Białe Błota