Vacuum pumps, gas abatement systems and equipment for semiconductor manufacturing
EBARA Precision Machinery Europe GmbH
Germany · Livingston (Scotland) · Presence in eight countries in Europe and IsraelNew on Amplifa
About EBARA Precision Machinery Europe
EBARA Precision Machinery Europe (EPME) is part of the EBARA Group and has been established in Germany since 1994. The company sells dry-running vacuum pumps, turbomolecular pumps with mechanical bearings as well as magnetically levitated rotors, gas abatement systems of the G and TND series, and semiconductor manufacturing equipment. The system portfolio includes CMP tools (Chemical Mechanical Polishing) for 200-mm and 300-mm wafers of the F-REX200M2 and F-REX300X series, electroplating systems of the UFP series for through-mask plating, redistribution and bumping in wafer-level packaging, and bevel polishing systems for wafer edge conditioning. Fully equipped service centers in Livingston (Scotland) and Dresden perform overhaul and refurbishment of EBARA pumps and third-party products, including dry, turbo, scroll and wet pumps. An applications team develops adaptation solutions for vacuum pumps and abatement systems. EPME is represented in eight countries across Europe and Israel and serves industries such as semiconductors, analytics, vacuum technology, chemicals, photovoltaics and LED manufacturing.
- Site
- Germany
- Processes
- Chemical Mechanical Polishing (CMP) for 200mm and 300mm wafers, Wafer Bevel Polishing (mechanical slurry-free process for edge conditioning), Substrate Plating / Electroplating (through-mask plating, redistribution and bumping in, Overhaul/refurbishment of vacuum pumps and accessories (Dry Pumps, Turbo Pumps, Scroll Pumps, Wet, Engineering: applications team develops adaptation solutions for vacuum pumps and abatement systems, Gas Abatement Systems (G and TND series), Sales of vacuum and turbomolecular pumps, Gas abatement systems
- Materials
- Dry-Running Vacuum Pumps, Turbomolecular Pumps, Gas Abatement Systems, CMP Tools, Electroplating Systems, Wafer Bevel Polishing
- Founded
- 1994 (EPME
- Employees
- > 230 in Europe &
- Industries
- Semiconductors, Analytical Instruments, General Vacuum, Research and Development, Chemical Industry, Photovoltaics
- 01
Engineering and application consulting
- 02
Sales of vacuum and turbomolecular pumps as well as gas abatement systems
- 03
Systems business: CMP, electroplating, bevel polishing
- 04
Installation and integrated solutions
- 05
Overhaul and refurbishment at the service center
Products and Systems
Dry-Running Vacuum Pumps
Solutions for various vacuum applications, backed by more than 100 years of pump technology experience.
Turbomolecular Pumps
With mechanical bearings or magnetically levitated rotor, suitable among other things for ultrahigh vacuum.
Gas Abatement Systems
Highly efficient universal abatement solutions of the G and TND series for emission reduction.
CMP Tools
Chemical Mechanical Polishing for 200-mm and 300-mm wafers with high flexibility and productivity.
Electroplating Systems
Ultra Fine Plating for through-mask plating, redistribution and bumping in wafer-level packaging.
Wafer Bevel Polishing
Mechanical, slurry-free process for cleaning and profiling the wafer edge to increase yield.
Locations
Germany (EPME Headquarters)
DEHeadquarters and sales, since 1994
Dresden
DEService center for overhaul and refurbishment
- Service center for Dry Pumps, Turbo Pumps, Scroll Pumps, Wet Pumps
Livingston
GBService center for overhaul and refurbishment
- Service center for vacuum pumps and accessories
Components and Systems
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Chemical Mechanical Polishing (CMP) for 200mm and 300mm wafersAssembly | – | – | – | – | Wafer |
| Wafer Bevel Polishing (mechanical slurry-free process for edge conditioning)Assembly | – | – | – | – | Wafer |
| Substrate Plating / Electroplating (through-mask plating, redistribution and bumping inSurface | – | – | – | – | Wafer/substrate |
| Overhaul/refurbishment of vacuum pumps and accessories (Dry Pumps, Turbo Pumps, Scroll Pumps, WetAssembly | – | – | – | – | – |
| Engineering: applications team develops adaptation solutions for vacuum pumps and abatement systemsEngineering | – | – | – | – | – |
| Gas Abatement Systems (G and TND series)Other | – | – | – | – | – |
8 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| CMP Tool (Chemical Mechanical Polishing) | EBARA F-REX200M2 | – | 200mm wafer | – | – |
| CMP Tool (Chemical Mechanical Polishing) | EBARA F-REX300X | – | 300mm wafer | – | – |
| Electroplating Tool | EBARA UFP Ultra Fine Plating series | – | – | – | – |
| Wafer Bevel Polishing Tool | EBARA | – | – | – | – |
| Dry Vacuum Pump | EBARA | – | – | – | – |
| Turbo Molecular Pump (mechanical bearings and magnetically levitated rotors) | EBARA | – | – | – | – |
| Gas Abatement System | EBARA G series | – | – | – | – |
| Gas Abatement System | EBARA TND series | – | – | – | – |
Additional services
History
- 1912
Founding of the EBARA Group; engagement in vacuum and semiconductor systems ever since
- 1994
EBARA Precision Machinery Europe established in Germany