Engineering office with in-house electronics manufacturing: development, EMS services and IoT solutions from idea to series production.
EBS-SYSTART GmbH
Gröbenzell (Industriestraße 33a, 82194) · Bulgaria (branch office)New on Amplifa
About EBS-SYSTART
EBS-SYSTART GmbH, based in Gröbenzell near Munich, is an engineering office with in-house electronics manufacturing. The company develops custom electronics solutions – from hardware design with schematics, PCB layout and EMC-compliant design, through embedded firmware and mechanics, to IoT cloud integration with its own platform IoTART. In its own manufacturing facility, prototypes, small series and medium series are produced: SMD assembly down to component size 0201, THT assembly with selective soldering, vapor phase and reflow soldering, module assembly through to the finished device, as well as functional testing and end-of-line testing. A key focus is custom power electronics with switched-mode power supplies up to 16 kW for laser and piezo applications. Customers come, among others, from mechanical engineering, industrial automation, robotics, medical technology, logistics, the automotive industry, aerospace and laser technology. Through white-label electronics solutions such as motor electronics, cellular modules, GPS trackers, display and relay boards, the company offers series-ready, brandable modules. In 2021, a branch office was established in Bulgaria.
- Site
- Gröbenzell
- Processes
- SMD assembly (0201, double-sided, fully automatic/semi-automatic/manual), THT assembly, Machine-based selective soldering, Vapor phase soldering, Reflow soldering, Stencil printing, Module assembly (housing installation, cabling, labeling, conversions), Functional test / end-of-line test / commissioning
- Materials
- Printed circuit boards (PCB), Solder alloy, Plastic (housings, 3D printing), Battery cells, Printed circuit boards, SMD and THT components, Plastic (3D printing)
- Certificates
- DIN EN ISO 9001:2015, ISO 9001
- Founded
- 2010
- Industries
- Mechanical engineering, Industrial automation, Robotics, Medical technology, Logistics, Automotive industry
Materials & Processes
Printed circuit boards
Basis for SMD and THT assembly down to component size 0201, suitable for double-sided assembly.
SMD and THT components
Assembly of all common package types and packaging formats including bulk material and tape sections.
Solder alloy
Used in the selective soldering system with two pots of 15 kg each under a nitrogen protective atmosphere.
Plastic (3D printing)
Housing and carrier prototypes produced by 3D printing for mechanical development.
Battery cells
In-house manufactured battery packs for battery-powered IoT and tracking systems.
Locations
Gröbenzell
DEHead office with development and electronics manufacturing
- Lot size
- Prototypes, small series, medium series
- Materials
- Printed circuit boards, SMD/THT components, plastic
- Siemens Siplace F4 placement machine
- Two identical SMD lines (from 2020)
- EKRA stencil printer E4/E5
- PAGGEN TDS-360 manual stencil printing device
- ASSCON vapor phase soldering system VP1000-66
- ERSA selective soldering system ECOSELECT 1 (2 pots, nitrogen)
- 3D AOI
- In-circuit tester (ICT)
- Hot-air soldering station / infrared preheating units for rework
Bulgaria
DEBranch office for development and production
Components & Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD assembly (0201, double-sided, fully automatic/semi-automatic/manual)Assembly | – | – | – | Prototype/single piece – Medium series | Printed circuit boards, SMD components |
| THT assemblyAssembly | – | – | – | – | through-hole components, printed circuit boards |
| Machine-based selective solderingJoining | – | – | – | – | Printed circuit boards, THT components |
| Vapor phase solderingJoining | – | – | – | – | Printed circuit boards, SMD components |
| Reflow solderingJoining | – | – | – | – | Printed circuit boards, SMD components |
| Stencil printingAssembly | – | – | – | – | Printed circuit boards, Solder paste |
| Module assembly (housing installation, cabling, labeling, conversions)Assembly | – | – | – | – | – |
| Functional test / end-of-line test / commissioningTesting | – | – | – | – | – |
| AOI (3D), ICT, FCTTesting | – | – | – | – | – |
| Rework work and sample buildingAssembly | – | – | – | – | – |
| Hardware development (schematics, PCB layout, EMC-compliant design)Engineering | – | – | – | – | Printed circuit boards |
| Firmware development (embedded systems, microcontrollers)Engineering | – | – | – | – | – |
| Power electronics development (switched-mode power supplies up to 16 kW)Engineering | – | – | 16 kW | – | – |
| Mechanical development (housing design, 3D design, 3D printing of prototypes)Engineering | – | – | – | – | Plastic |
| ESD-compliant packaging service / packing serviceAssembly | – | – | – | – | – |
| Battery and battery pack manufacturing (in-house manufactured battery packs)Assembly | – | – | – | – | Battery cells |
10 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Placement machine | Siemens Siplace F4 | – | – | – | Gröbenzell |
| SMD line (2 units, identical) | – | 2 | – | 2020 | Gröbenzell |
| Stencil printer | EKRA E4 / E5 | 2 | – | – | Gröbenzell |
| Stencil printing device (manual) | PAGGEN TDS-360 | 1 | – | – | Gröbenzell |
| Vapor phase soldering system | ASSCON VP1000-66 | 2 | – | – | Gröbenzell |
| Selective soldering system | ERSA ECOSELECT 1 | 1 | 2 solder pots of 15 kg solder alloy each, nitrogen protective atmosphere | – | Gröbenzell |
| 3D AOI | – | 1 | – | 2018 | Gröbenzell |
| ICT (in-circuit tester) | – | 1 | – | 2018 | Gröbenzell |
| Hot-air soldering station / infrared preheating units (rework) | – | – | – | – | Gröbenzell |
| Soldering stations (manual selective soldering) | – | – | – | – | Gröbenzell |
Additional services
Quality
Manufacturing has been certified to DIN EN ISO 9001:2015 since 25.07.2014. The test field performs 3D AOI, ICT, FCT as well as functional tests and end-of-line tests at PCB, housing and system level; the company also offers EMC qualification, CE-preparation work and in-house test equipment construction.
| Evidence | Gröbenzell |
|---|---|
| ISO 9001 |
History
- 2010
Foundation of SYSTART GmbH by Michael Bittner as a 1-man engineering office with in-house electronics manufacturing; setup of prototype manufacturing and an online calculator for prototype assembly.
- 2011
First development contracts in consumer electronics and smart metering; acquisition of the first placement machine.
- 2012
Development contracts for industrial controls of punching machines and laser systems; hiring of the first employees.
- 2013
Development contracts in GPS tracking, cellular communication and sensor technology.
- 2014
Certification to ISO 9001; team of 6 colleagues; transition to the Altium CAD system and the Siplace F4 placement machine.
- 2015
Expansion of development rooms to approx. 110 m²; acquisition of a large batch vapor phase system.
- 2016
Optimization of the EMS area toward small-series assembly; acquisition of a selective soldering system with two pots.
- 2017
Acquisition of the EMS provider EBS Electronic GmbH; move to its premises in June 2017.
- 2018
Merger to form EBS-SYSTART GmbH; acquisition of 3D AOI and ICT.
- 2019
Spatial reorganization of production and warehouse; air conditioning of the production rooms.
- 2020
Implementation of a second, identical SMD line for redundancy and reliability.
- 2021
New ERP system; establishment of a branch office in Bulgaria; team of 29 colleagues.