Development and manufacturing of custom electronics – from ASICs to IoT systems
EDC Electronic Design Chemnitz GmbH
Chemnitz · Technologie-Campus 4, 09126 ChemnitzNew on Amplifa
About EDC Electronic Design Chemnitz
EDC Electronic Design Chemnitz GmbH develops and manufactures custom electronics – from application-specific integrated circuits (ASICs) and PLC/control electronics to complete electronic systems. The portfolio includes IC design (mixed-signal, high-voltage, MEMS sensor technology, lab-on-chip), hardware and software development, PCB design, design of housings and mechanical components, as well as prototyping with in-house 3D printing. In its own production facility in Chemnitz, electronic systems are assembled, tested and shipped; ASIC/ASSP manufacturing is carried out with partners under full supply chain control by EDC. For series testing, the company operates its own in-house test equipment for wafer- and chip-level tests up to 12 inch in a cleanroom (comparable to ISO class 6). With the IoT platform EDC smartFIT connect, the company also manufactures industrial IoT gateways for machine and plant connectivity. Customers come from industrial automation, semiconductor and microelectronics, sensor technology/MEMS, life science/IVD, power electronics and fuel cell technology. The company was founded in 2008, employs around 45 people and is located on the Technology Campus in Chemnitz, in close collaboration with Fraunhofer ENAS and Chemnitz University of Technology.
- Site
- Chemnitz
- Processes
- IC design (ASIC development: high-voltage, mixed-signal, MEMS, sensor technology, lab-on-chip), Electronics hardware development (PCB design, mixed-signal and high-voltage ASICs, PLC on, Assembly and mounting of electronic systems (final assembly, packaging, shipping), In-house testing: series tests at wafer and chip level (semi-automated to fully automatic,, 3D printing prototyping (in-house 3D printers for prototypes of mechanical components and housings), Manufacturing of housings and mechanical components, Industrial IoT gateway manufacturing (EDC smartFIT connect, series production with MQTT/OPC UA), Project management (V-model, agile methods, SIL/MTBF analyses)
- Materials
- PC (polycarbonate, UL 94 V-0), Silicon (CMOS/MEMS chips), Gallium nitride (GaN), PCB base materials (various), Silicon wafers up to 12 inch, Silicon (CMOS/MEMS), Gallium nitride, Polycarbonate (UL 94 V-0)
- Certificates
- DIN EN ISO 9001, RoHS/REACH conformity
- Founded
- 2008
- Employees
- approx. 45
- Industries
- Industrial automation / mechanical engineering, Semiconductors / microelectronics, Sensor technology / MEMS, Life science / IVD medical technology, Power electronics / e-mobility / renewable energies, Fuel cells
- 01
Project management (V-model/agile)
- 02
IC design and hardware/software development
- 03
Prototyping (3D printing, EMC testing)
- 04
Assembly and mounting of electronics
- 05
In-house series tests (wafer, chip and system level)
- 06
Final assembly, packaging, shipping
Materials and Processes
Silicon (CMOS/MEMS)
Base material for ASIC and MEMS design including post-CMOS microfluidics and sensor chips.
Gallium nitride
Power semiconductor technology in research focus for power electronics, e-mobility and renewable energies.
Polycarbonate (UL 94 V-0)
Housing material of the smartFIT IoT gateways with flammability requirement UL 94 V-0.
PCB base materials
Various base materials for the discrete PCB design of custom electronics.
Silicon wafers up to 12 inch
Processing and test scope of the in-house test equipment in the cleanroom.
Locations
Chemnitz
DEHeadquarters, development and production
- Lot size
- Batch production (final assembly, packaging, shipping)
- Materials
- Silicon, GaN, PC, PCB
- In-house test equipment for wafer- and chip-level tests up to 12 inch
- Cleanroom ISO class 6
- 3D printers for prototyping
- smartFIT connect product line (IoT gateways)
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| IC design (ASIC development: high-voltage, mixed-signal, MEMS, sensor technology, lab-on-chip)Engineering | – | – | – | – | Silicon (CMOS/MEMS), Gallium nitride (GaN) |
| Electronics hardware development (PCB design, mixed-signal and high-voltage ASICs, PLC onEngineering | – | – | – | – | PCB base materials (various), Semiconductors |
| Assembly and mounting of electronic systems (final assembly, packaging, shipping)Assembly | – | – | – | – | Electronic systems, PCBs |
| In-house testing: series tests at wafer and chip level (semi-automated to fully automatic,Testing | – | – | – | – | Wafers (up to 12 inch), ICs, Electronic systems |
| 3D printing prototyping (in-house 3D printers for prototypes of mechanical components and housings)Additive | – | – | – | – | Plastic |
| Manufacturing of housings and mechanical componentsAssembly | – | – | – | – | Plastic (PC) |
| Industrial IoT gateway manufacturing (EDC smartFIT connect, series production with MQTT/OPC UA)Assembly | – | – | – | – | PC (UL 94 V-0), PCB, Espressif ESP32 microcontroller |
| Project management (V-model, agile methods, SIL/MTBF analyses)Engineering | – | – | – | – | – |
| Production and assembly of ASICs/ASSPs (via partners, supply chain control by EDC)Assembly | – | – | – | – | Silicon (ASICs/ASSPs) |
| IC characterization and qualification according to customer specificationTesting | – | – | – | – | ICs, MEMS |
3 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| 3D printer | – | – | – | – | Chemnitz |
| In-house test equipment (wafer- and chip-level tests, partly fully automatic up to 12 inch) | – | – | Wafer level up to 12 inch | – | Chemnitz (cleanroom ISO class 6) |
| IoT gateway production line (EDC smartFIT connect) | EDC smartFIT connect | – | 35 mm x 89 mm x 58 mm (device) | – | Chemnitz |
Additional services
Quality and Certification
All delivered products are tested on in-house test equipment; for ICs, semi- to fully automatic wafer- and chip-level tests up to 12 inch are available in the cleanroom (comparable to ISO class 6). The QM system is certified to DIN EN ISO 9001, and production meets, among others, RoHS/REACH conformity.
| Evidence | Chemnitz |
|---|---|
| DIN EN ISO 9001 | |
| RoHS/REACH conformity |
History and Research Projects
- 2008
Foundation of EDC Electronic Design Chemnitz GmbH in Chemnitz
- 2019
Research project Hzwo: Frame VP2.2 – turbo compressor with magnetic bearings for mobile fuel cell drives (with Voith, Chemnitz University of Technology, Fraunhofer ENAS, among others)
- 2019
Research project post-CMOS µFluidics (Lab on a CMOS Chip) with Fraunhofer ENAS
- 2020
Research project VerEFab – administration shell for energy-flexible factory operation (with MicroStep Europa, TEKA, Oscar PLT, Fraunhofer IGCV)
- 2023
Research project MultiDiag – automated IVD platform (with Roboscreen and imk Health Intelligence)
- 2025
Research project ZuverSichT – reliability of GaN power semiconductors (with X-FAB Dresden, Fraunhofer IKTS/IIS-EAS/IWS, among others)
- 2025
Project light grid IC X138 – market launch of an IC for light barriers and light grids