EMS provider for SMD/THT PCB assembly, cable assembly, mechanical manufacturing and device assembly.
EFB GmbH - Elektronische Fertigungsstätten Blankenfelde
Blankenfelde-MahlowNew on Amplifa
About EFB GmbH
EFB GmbH (Elektronische Fertigungsstätten Blankenfelde) is an EMS provider based in Blankenfelde-Mahlow south of Berlin. Founded in 1968 as a cable forming shop in Berlin-Neukölln, the company manufactures populated and soldered printed circuit boards (SMD and THT, including mixed assembly, RoHS-compliant and non-RoHS-compliant), assembled cables, machined parts and assembled small devices on approximately 2,500 m² of production floor space. SMD assembly is carried out on Essemtec pick-and-place machines with components from size 01005 (0402, Fine-Pitch, QFP, QFN, BGA); vapor phase and wave soldering systems are available for soldering. In the mechanical area, individual parts, assembly and production jigs made of metal, aluminum, plastics and wood are produced using CNC and NC milling machines as well as lathes. Customers come, among others, from environmental medicine, metrology, the automotive industry and laser technology; the customer list includes Siemens AG. In addition to series production, EFB GmbH offers prototype manufacturing from lot size 1, after-sales service, as well as purchasing and logistics.
- Site
- Blankenfelde-Mahlow
- Processes
- SMD assembly, THT assembly (machine/manual), Mixed assembly SMD/THT, Vapor phase soldering, Wave soldering, Reflow soldering, Hand soldering (temperature-controlled soldering stations), Rework / repair of electronic assemblies
- Materials
- Aluminum, Plastics (various), Wood, Metal, Printed circuit boards (populated, soldered), Cables / assembled wires
- Certificates
- ISO 9001:2015, ISO 14001:2015, DIN EN ISO 45001:2023, ISO 9001, ISO 14001, ISO 45001, ISO 50001, IATF 16949, EN 9100, ISO 13485, EN 1090
- Founded
- 1968
- Employees
- 40
- Industries
- Environmental medicine, Metrology, Automotive industry, Laser technology
- 01
Purchasing and material procurement
- 02
Mechanical manufacturing (milling, turning, drilling)
- 03
Cable assembly
- 04
SMD/THT PCB assembly
- 05
Soldering (vapor phase, wave, hand soldering)
- 06
AOI and electrical testing
- 07
Device assembly and programming/commissioning
- 08
Warehousing and logistics
- 09
After-sales service
Materials and Processes
Aluminum
Machinable lightweight metal for mechanical individual parts and jigs.
Plastics (various)
Material for milled individual parts and assembly aids.
Wood
Used in the mechanical manufacturing of aids and jigs.
Metal
Machined metal parts for individual part production and jig construction.
Printed circuit boards (populated, soldered)
Core product of EMS manufacturing within the scope of the certificate.
Cables / assembled wires
Assembly in many variations, up to the finished device.
Manufacturing Site
Blankenfelde-Mahlow
DEProduction and administration (manufacturing facility)
- Lot size
- Prototypes from 1 unit, small series from 5 assemblies, up to large series
- Materials
- Aluminum, plastics, wood, metal, printed circuit boards, cables
- Essemtec SMD pick-and-place machine (2023, components from 01005, Jetter module)
- Pick-and-place machines (Essemtec)
- Vapor phase soldering system
- Wave soldering system
- AOI system Göpel stand-alone
- CNC milling machine
- NC turning and NC milling machines
- Milling-drilling machines
- Lathes
- ESD-protected workstations with temperature-controlled soldering stations
Components and Products
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD assemblyAssembly | – | – | – | Samples/small series from 5 assemblies – Large series | Printed circuit boards, Components from size 0402, Fine-Pitch, QFP, QFN, BGA |
| THT assembly (machine/manual)Assembly | – | – | – | Samples – Series | Printed circuit boards, Through-hole components |
| Mixed assembly SMD/THTAssembly | – | – | – | – | Printed circuit boards |
| Vapor phase solderingJoining | – | – | – | – | Printed circuit boards |
| Wave solderingJoining | – | – | – | – | Printed circuit boards |
| Reflow solderingJoining | – | – | – | – | Printed circuit boards |
| Hand soldering (temperature-controlled soldering stations)Joining | – | – | – | – | Printed circuit boards |
| Rework / repair of electronic assembliesAssembly | – | – | – | – | Printed circuit boards |
| Automated optical inspection (AOI)Testing | – | – | – | – | Electronic assemblies |
| Electrical tests / functional testsTesting | – | – | – | – | Electronic assemblies, Devices |
| CNC millingMachining | – | – | – | – | Metal, Aluminum, Plastics, Wood |
| NC millingMachining | – | – | – | – | Metal, Aluminum, Plastics, Wood |
| Turning (lathes, NC)Machining | – | – | – | – | Metal |
| Drilling (milling-drilling machines)Machining | – | – | – | – | Metal, Aluminum, Plastics |
| Mechanical individual part production / jig constructionEngineering | – | – | – | – | Metal, Aluminum, Plastics, Wood |
| Cable assemblyAssembly | – | – | – | – | Cables, Wires, Connectors |
| Device construction / device assembly (small devices)Assembly | – | – | – | – | – |
| Prototype manufacturing (samples from 1 unit, manual or machine production)Assembly | – | – | – | 1 unit | – |
| RoHS-compliant and non-RoHS-compliant production (lead-free/leaded)Assembly | – | – | – | – | Printed circuit boards |
| Repairs / rework / product upgrades (after sales)Assembly | – | – | – | – | Wires, Electronic assemblies |
10 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD pick-and-place machine | Essemtec | – | – | 2023 | Blankenfelde-Mahlow |
| Pick-and-place machine (SMD) | Essemtec | – | – | – | Blankenfelde-Mahlow |
| Vapor phase soldering system | – | – | – | – | Blankenfelde-Mahlow |
| Wave soldering system | – | – | – | – | Blankenfelde-Mahlow |
| AOI system (stand-alone) | Göpel | – | – | – | Blankenfelde-Mahlow |
| CNC milling machine | – | – | – | – | Blankenfelde-Mahlow |
| NC turning machine | – | – | – | – | Blankenfelde-Mahlow |
| NC milling machine | – | – | – | – | Blankenfelde-Mahlow |
| Milling-drilling machine | – | – | – | – | Blankenfelde-Mahlow |
| Lathe | – | – | – | – | Blankenfelde-Mahlow |
Additional services
Reference customers
Quality and Certifications
Quality assurance includes automated optical inspection (AOI) with a Göpel stand-alone system, electrical tests and product-specific functional tests according to customer requirements, production in accordance with IPC 610, as well as programming and commissioning of electronic assemblies and devices. The integrated management system is audited annually by GUTcert (TÜV AUSTRIA).
| Evidence | Blankenfelde-Mahlow |
|---|---|
| ISO 9001 | |
| ISO 14001 | |
| ISO 45001 | |
| ISO 50001 | |
| IATF 16949 | |
| EN 9100 | |
| ISO 13485 | |
| EN 1090 |
Company History
- 1968
Founded as Günter Erhardt GmbH (cable forming shop) on Lahnstraße in Berlin-Neukölln.
- 1975
Expansion of the production range to include mechanical manufacturing, including production of aids for manufacturing.
- 1980
Start of PCB assembly, initially manual THT assembly.
- 1992
Relocation to newly built manufacturing facilities in Blankenfelde-Mahlow; formation of EFB GmbH & Co. KG under Günter Erhardt; introduction of SMD assembly.
- 2004
Frank Göhrs takes over the management of EFB GmbH.
- 2009
Start of modernization of SMD assembly with investments in new machines.
- 2013
First certification by GUTcert according to ISO 9001, ISO 14001 and OHSAS 18001 (from March 2013).
- 2017
Gradual conversion and optimization of the material warehouse.
- 2018
Marcel Reichelt becomes an additional managing director; succession regulated, company remains family-owned.
- 2019
Recertification and transition from OHSAS 18001 to ISO 45001.
- 2022
Sina Reichelt is appointed authorized officer (Prokuristin).
- 2023
Modernization of the SMD area; new Essemtec pick-and-place machine for components from 01005 with Jetter module for rework.
- 2024
Expansion of the management system to include information security according to ISO/IEC 27001:2022; successful surveillance audit by GUTcert.
- 2025
Transition to 100% green electricity; partnership with ClimatePartner; recertification until 20.03.2028; CO₂ reduction to 3,964 kg (previous year 33,124 kg).
- 2026
Further compensation of 25,000 kg CO₂ via a ClimatePartner combination project; goal of climate-neutral production from 2026; transition of environmental management to ISO 14001:2026.