Development and manufacturing of industrial and power electronics, DC/DC converters and EMS assemblies in Passau.
Elec-Con Technology GmbH
Passau · HutthurmNew on Amplifa
About Elec-Con Technology
Elec-Con Technology GmbH is a family-owned development and manufacturing company for industrial and power electronics based in Passau. The company develops custom embedded hardware, firmware and power electronics up to 1 kVA and manufactures prototypes, pre-series and small series in lot sizes of 1 to 500 in its own electronics manufacturing (EMS). The manufacturing covers the entire process chain: solder paste printing via stencil (EKRA) or stencil-free via the high-speed jetter MY500, SMD placement from package size 0201 including BGA, QFP, CSP and LGA, THT, THR and mixed-technology placement on FR4, rigid-flex and ceramic substrates, vapor phase soldering in inert atmosphere, wave, selective and hand soldering as well as cleaning according to IPC standard. Testing is performed by AOI, first-article inspection, EOL functional test, flying probe and high-voltage testing. Own products are analog and digitally controlled, passively cooled DC/DC converters including the digitally configurable diPSU® series, DIN-rail devices and common-mode filters. Customers come from industrial and power electronics, automation technology, control cabinet construction, medical technology, LED technology and IoT.
- Site
- Passau
- Processes
- SMD placement (from 0201, BGA, QFP, CSP, LGA), THT, THR and mixed-technology placement, Stencil printing (solder paste printing), Stencil-free jetting (pad-individual), Vapor phase soldering in inert atmosphere, Dip soldering, Wave soldering, Selective soldering
- Materials
- FR4, Rigid-flex, Ceramic
- Certificates
- Processes based on ISO 9001-2015 / IATF 16949 (no own, Processes based on ISO 9001-2015, Processes based on IATF 16949, AOI inspection, EOL functional test
- Founded
- 2005
- Industries
- Industrial and power electronics, Industrial PCs and automation technology, Control cabinet construction, Medical technology (MRI, X-ray imaging applications, panel/box PCs), LED technology, IoT / remote machine monitoring
- 01
Electronics development (hardware, firmware, layout)
- 02
Materialization and component preparation
- 03
Solder paste printing (stencil printing/jetting)
- 04
SMD, THT and mixed-technology placement
- 05
Vapor phase, wave, selective and hand soldering
- 06
Cleaning according to IPC standard
- 07
AOI, first-article inspection, EOL functional test
- 08
Assembly, device construction and firmware upload
- 09
Logistics and repair
Substrates & Processes
FR4
Standard PCB substrate for SMD, THT and mixed-technology assemblies, single- and double-sided.
Rigid-flex
Substrate combination for assemblies with flexible PCB sections.
Ceramic
Substrate for thermally and electrically highly stressed applications, especially in power electronics.
Locations
Passau
DEDevelopment, manufacturing, visitor address (Alte Str. 68)
- Lot size
- Lot size 1–500
- Materials
- FR4, rigid-flex, ceramic
- EKRA stencil printer
- High-speed solder paste jetter MY500
- Placement machines
- Vapor phase soldering system
- Wave soldering system
- Selective soldering system (from 2026)
- MIELE IR6002 cleaning system
- ERSA HR200 BGA rework station
- Micro-Placer
- AOI
- Flying probe test system
Hutthurm
DECompany headquarters (Mühlweg 5)
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD placement (from 0201, BGA, QFP, CSP, LGA)Assembly | – | – | Lot size 1 to 500 | 1 piece – 500 | FR4, Rigid-flex, Ceramic |
| THT, THR and mixed-technology placementAssembly | – | – | – | 1 piece – 500 | FR4, Rigid-flex, Ceramic |
| Stencil printing (solder paste printing)Assembly | – | – | – | – | SolderPaste |
| Stencil-free jetting (pad-individual)Assembly | – | – | – | 1 piece | SolderPaste |
| Vapor phase soldering in inert atmosphereJoining | – | – | – | – | FR4, Rigid-flex, Ceramic |
| Dip solderingJoining | – | – | – | – | – |
| Wave solderingJoining | – | – | – | – | – |
| Selective solderingJoining | – | – | – | – | – |
| Hand solderingJoining | – | – | – | – | – |
| Press-fit technologyJoining | – | – | – | – | – |
| BGA rework & component re-placementAssembly | – | – | – | – | – |
| PCB cleaning according to IPC standard (including manual cleaning)Surface | – | – | – | – | – |
| AOI (automated optical inspection) and first-article inspection via semi-automaticTesting | – | – | – | – | – |
| EOL functional test and electrical final testing (flying probe / high-voltage testing on request)Testing | – | – | – | – | – |
| Firmware upload and programming in productionAssembly | – | – | – | – | – |
| Assembly and device constructionAssembly | – | – | – | – | – |
| Materialization and component preparationAssembly | – | – | – | 1 piece – 500 | – |
| Custom electronics development (embedded hardware, power electronics up to 1 kVA,Engineering | – | – | – | 1 | – |
| EMC pre-compliance measurements in own EMC laboratoryTesting | – | – | – | – | – |
| Repair and obsolescence managementEngineering | – | – | – | – | – |
10 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Stencil printer | EKRA | – | – | – | Passau |
| High-speed solder paste jetter | MY500 | – | – | – | Passau |
| Placement machine | – | – | – | – | Passau |
| Vapor phase soldering system | – | – | – | – | Passau |
| Selective soldering system | – | – | – | 2026 | Passau |
| Cleaning system | MIELE IR6002 | – | – | – | Passau |
| BGA rework station | ERSA HR200 | – | – | – | Passau |
| Micro-Placer with camera support (re-placement of smallest SMD components) | – | – | – | – | Passau |
| AOI (automated optical inspection) | – | – | – | – | Passau |
| Flying probe test system | – | – | – | – | Passau |
Additional services
Quality & Processes
The processes are oriented toward IPC as well as the requirements of ISO 9001-2015 and IATF 16949; quality assurance is carried out via fully automated AOI, first-article inspection using the alternating-image method, EOL functional testing as well as, on request, flying probe and high-voltage testing. An in-house EMC laboratory enables pre-compliance measurements.
| Evidence | Passau |
|---|---|
| Processes based on ISO 9001-2015 | |
| Processes based on IATF 16949 | |
| AOI inspection | |
| EOL functional test |
History
- 2005
Founding of Elec-Con.
- 2008
Appointed a certified partner in the 'LED light for you' network by Osram Opto Semiconductors.
- 2019
Certified 'Design Services Partner' of Digi-Key.
- 2021
Since 1.1.2021 co-operator of the hardware-related digitalization laboratory at TH Deggendorf (Faculty of EMT).
- 2024
New website; investment in the high-speed jetter MY500.
- 2025
Elec-Con turns 20; development and manufacturing in-house at the Passau site.
- 2026
Exhibiting at Embedded World 2026 (Hall 3A) and Power of Electronics 2026 in Würzburg; investment in a new selective soldering system; market launch of the digitally configurable DC/DC converters diPSU®.