Manufacturer of the MIRA Large-Chamber Scanning Electron Microscope for non-destructive testing of large components

ELLCIE Industries GmbH

Grevesmühlen · GermanyNew on Amplifa

Martin KleinFounded by

HRB 9889, Amtsgericht SchwerinRegister court

up to 1500 mm / 300 kgMax. sample size/mass (MIRA)

<10 nmResolution

3 / 9 / 12 m³Chamber volume options

About ELLCIE Industries

ELLCIE Industries GmbH, headquartered in Grevesmühlen, develops and manufactures the Large Chamber Scanning Electron Microscope (LC-SEM) MIRA, a scanning electron microscope with a bell-type chamber for non-destructive testing (NDT) and material analysis of very large samples. The system enables direct examination of intact components up to 1500 mm in diameter and 300 kg in mass without destructive sampling or disassembly. Core features include a patented 5+1-axis positioning system, a resolution below 10 nm, integrated EDS and EBSD analytics, as well as optional FIB, FT-IR and camera systems. A special feature is the ability to perform fatigue testing in-situ inside the vacuum chamber. In addition to its microscopy division, ELLCIE develops with Conterbase mobile infrastructure for disaster relief, providing power, satellite communication, digital signage, lighting and charging infrastructure. Customer industries include aerospace, defense, automotive, materials science, electronics, medical technology, forensics, cultural heritage conservation as well as authorities and relief organizations.

Site: Grevesmühlen
Processes: Scanning electron microscopy (LC-SEM) / material analysis incl. EDS, EBSD, optional FIB, FT-IR,, Non-destructive testing (NDT), In-situ analysis including fatigue tests in the SEM, EDS and EBSD analytics, Optional FIB, FT-IR and camera systems, Large-component inspection up to 1500 mm diameter / 300 kg, Failure analysis, 3D print model (STL) of the MIRA system
Materials: Large Chamber Scanning Electron Microscopy, Energy Dispersive X-Ray Spectroscopy, Electron Backscatter Diffraction, In-situ fatigue testing, Focused Ion Beam (optional), Fourier-Transform Infrared Spectroscopy (optional)
Certificates: Resolution <10 nm at 300,000x magnification, Positioning repeatability ±50 µm, Active vibration damping system
Industries: Aerospace, Defense technology, Automotive, Materials science and research, Electronics/semiconductors, Medical technology

01
Engineering and design of the LC-SEM
02
Manufacturing and system integration of the vacuum chamber
03
Installation and commissioning at the customer's site
04
Analytical services (EDS, EBSD, in-situ tests)
05
Service and expansion through optional modules

Processes and Analytics

LC-SEM

Large Chamber Scanning Electron Microscopy

Non-destructive imaging and analysis of large components up to 1500 mm and 300 kg with resolution below 10 nm.

EDS

Energy Dispersive X-Ray Spectroscopy

Elemental analysis for material identification directly at the sample position.

EBSD

Electron Backscatter Diffraction

Analysis of crystal orientations and microstructures, phase transformations and microstructure.

In-situ

In-situ fatigue testing

Fatigue and deformation tests inside the vacuum chamber to observe crack initiation and propagation.

FIB

Focused Ion Beam (optional)

Optional module for local material removal and cross-section analysis.

FT-IR

Fourier-Transform Infrared Spectroscopy (optional)

Optional IR analysis for chemical characterization of sensitive materials.

Locations

Grevesmühlen

Production site / Company headquarters

Part weight / size: Samples up to 1500 mm diameter, 1500 mm height, 300 kg
Materials: Metals, composites, electronics, biomaterials, artifacts

MIRA LC-SEM (chamber 3/9/12 m³)
5+1-axis positioning system
EDS/EBSD detectors
Turbomolecular pump 2400 l/s
Rotary vane / rotary piston pump

Components and Systems

**MIRA LC-SEM chamber with sample stage**Large Chamber SEM · Testing facility

**Electron beam column (Electron Gun Assembly)**Precision mechanics · MIRA core component

**MIRA control console**Control system · Windows-based

**Conterbase Module C2**Mobile infrastructure · Disaster relief

**Loading of large components**Handling · NDT

Inside the production

Interior view of the MIRA chamber with sample stage

Industries

AerospaceDefense technologyAutomotiveMaterials science and researchElectronics/semiconductorsMedical technologyForensicsCultural heritage/archaeologyDisaster relief/public sectorAerospaceAerospace (Aerospace)Disaster relief / public sector

Processes & technical limits

Processes	Tolerance	Max. part	Weight	Lot size	Materials
Scanning electron microscopy (LC-SEM) / material analysis incl. EDS, EBSD, optional FIB, FT-IR,Testing	±50 µm (positioning repeatability)	1500 mm × 1500 mm diameter × 1500 mm	300 kg	–	–

1 Anlagen & Maschinen

Machine	Manufacturer / model	Quantity	Working area	Year built	Site
Large Chamber Scanning Electron Microscope (LC-SEM)	ELLCIE Industries MIRA	–	Samples up to 1500 mm diameter, 1500 mm height; chamber 3/9/12 m³; 5+1 axes (X 600/1000/1500 mm, Z	–	Grevesmühlen, Germany

Additional services

Non-destructive testing (NDT)In-situ analysis including fatigue tests in the SEMEDS and EBSD analyticsOptional FIB, FT-IR and camera systemsLarge-component inspection up to 1500 mm diameter / 300 kgFailure analysis3D print model (STL) of the MIRA systemMobile infrastructure for disaster relief (Conterbase: power, satellite communication, digital

Quality and Precision

The MIRA system achieves a positioning repeatability of ±50 µm and a resolution below 10 nm over an acceleration voltage range of 0.2–30 keV; an active vibration damping system ensures stable imaging conditions.

Evidence	Grevesmühlen
Resolution <10 nm at 300,000x magnification
Positioning repeatability ±50 µm
Active vibration damping system

History

Founded by Dipl.-Ing. Martin Klein; specialization in large-chamber scanning electron microscopy for space and defense applications.