Semiconductor manufacturing of LED chips, photodiodes and optoelectronic assemblies in the wavelength range from 225 nm to 2300 nm.

EPIGAP OSA Photonics GmbH

Berlin KöpenickNew on Amplifa

Mid-1990sDevelopment of LED and photodiode chips

About EPIGAP OSA Photonics

EPIGAP OSA Photonics GmbH has been developing LED chips and photodiode chips for niche markets in a wide variety of industrial sectors since the mid-1990s. At its production site in Berlin Köpenick, the company manufactures LED chips, monolithic displays, SMD and THT LEDs as well as photodiodes, point sources and VCSELs covering the entire wavelength range between 225 nm (UV-C) and 2300 nm (SWIR). Its services include chip fabrication (lithography, metallization, etching, dicing, mapping, binning), photonic assembly with pick and place, wire bonding, encapsulation as well as SMD and TO packaging, plus test and qualification services such as burn-in, reliability and environmental testing. In addition, EPIGAP OSA offers R&D services, including optical, mechanical and electrical design, prototyping and product development for custom LEDs and optoelectronic assemblies. Customer industries include medical technology and biophotonics, industrial sensing with special lighting, safety engineering, hyperspectral imaging and automation. On request, the team also produces small and medium volumes.

Site: Berlin
Processes: Chip Fabrication (Lithography, Metallization, Etching, Dicing, Mapping, Binning), Photonic Assembly (Pick and Place, Wire Bonding, Encapsulation, Chip on Board, SMD and TO Packaging), Test & Qualification (Burn-in, Reliability, Environmental Tests), R&D: optical, mechanical and electrical design, prototyping, product development, Chip fabrication (lithography, metallization, etching, dicing, mapping, binning), Photonic assembly (pick and place, wire bonding, encapsulation, chip on board, SMD and, Test & qualification (burn-in, reliability, environmental tests, supply chain management), R&D (optical, mechanical and electrical design, prototyping, product development)
Materials: LED chips (UV, Visible, Infrared, 225 nm–2300 nm), Photodiode chips, VCSELs, VCSELs and point sources, Multi-chip and chip-on-board assemblies, Monolithic displays and reticles
Certificates: Burn-in, Reliability tests, Environmental tests
Industries: Medical Technology, Biophotonics, Industrial Sensing, Safety Engineering, Automation, Hyperspectral Imaging

01
R&D: optical, mechanical and electrical design, prototyping
02
Chip fabrication (lithography, metallization, etching, dicing, mapping, binning)
03
Photonic assembly (pick and place, wire bonding, encapsulation, chip on board,
04
Test & qualification (burn-in, reliability, environmental tests, supply chain

Materials and Processes

LED

LED chips (UV, Visible, Infrared, 225 nm–2300 nm)

Semiconductor chips for special lighting, sensors, metrology and displays in medical technology, sensing and safety engineering.

Photodiode chips

Detectors as chips, SMDs and THTs for sensor applications from UV to SWIR.

VCSEL

VCSELs and point sources

Red and infrared VCSELs for signal and sensing applications, currently in joint development with TU Berlin.

CoB

Multi-chip and chip-on-board assemblies

Custom assemblies made from LEDs, photodiodes and further components for UV to SWIR.

MONO

Monolithic displays and reticles

Single-digit and multi-digit displays, numbers, letters and reticles as monolithic structures.

Sites

Berlin Köpenick

Production and development

Lot size: Small and medium volumes
Materials: LED chips, photodiodes, VCSELs

Lithography
Metallization
Etching
Dicing
Mapping/Binning
Pick and Place
Wire Bonding
Encapsulation
SMD and TO packaging
Burn-in and reliability testing

Products and Components

**Wire-bonded chips**Photonic Assembly · Optoelectronics

**FEM simulation**R&D · Product Development

Inside the production

Trade fair presence Photonics West 2026, San Francisco

Launch of the joint VCSEL chip development project VAST with TU Berlin

Trade fair presence VISION 2026, Stuttgart

Industries

Medical TechnologyBiophotonicsIndustrial SensingSafety EngineeringAutomationHyperspectral Imaging

Processes & technical limits

Processes	Tolerance	Max. part	Weight	Lot size	Materials
Chip Fabrication (Lithography, Metallization, Etching, Dicing, Mapping, Binning)Semiconductor manufacturing	–	–	–	–	Semiconductors (LED and photodiode chips, 225 nm–2300 nm)
Photonic Assembly (Pick and Place, Wire Bonding, Encapsulation, Chip on Board, SMD and TO Packaging)Assembly	–	–	–	–	LED chips, Photodiodes
Test & Qualification (Burn-in, Reliability, Environmental Tests)Testing	–	–	–	–	LEDs, Photodiodes
R&D: optical, mechanical and electrical design, prototyping, product developmentEngineering	–	–	–	–	–

Additional services

Chip fabrication (lithography, metallization, etching, dicing, mapping, binning)Photonic assembly (pick and place, wire bonding, encapsulation, chip on board, SMD andTest & qualification (burn-in, reliability, environmental tests, supply chain management)R&D (optical, mechanical and electrical design, prototyping, product development)Development of custom LEDs and optoelectronic assembliesManufacturing of small and medium volumes

Reference customers

Technical University of Berlin (project partner VCSEL chip development “VAST”)

Quality

Test and qualification services include burn-in, reliability and environmental testing as well as supply chain management for LEDs and photodiodes.

Evidence	Berlin Köpenick
Burn-in
Reliability tests
Environmental tests

History

Mitte der
Start of development of LED chips and photodiode chips for niche markets
2026
Trade fair presence at Photonics West in San Francisco (Booth #4205-39)
2026
Launch of the joint VCSEL chip development project “VAST” with the Technical University of Berlin
2026
Trade fair presence at VISION 2026 in Stuttgart (Hall 10, Booth 10C16, German joint booth / SpectroNet)