EU consortium for IC prototyping via MPW runs, design tools, Smart System Integration and training for academia and SMEs
EUROPRACTICE
Leuven (BE) · Didcot (UK) · Erlangen (DE) · Grenoble (FR) · Cork (IE)New on Amplifa
About EUROPRACTICE
EUROPRACTICE is a consortium of five European research organisations that has supported academic institutions, spin-outs and SMEs in the design and manufacture of electronic circuits and Smart Systems since 1989. The service portfolio includes cost-effective IC prototyping via Multi-Project-Wafer runs (MPW) for ASIC, Photonics, MEMS and microfluidics, Smart System Integration including packaging, as well as Small Volume Production. In addition, EUROPRACTICE provides universities and research institutes with industry-standard CAD design tools for teaching and non-commercial research, and conducts technical trainings and webinars on modern design flows. The MPW service is operated by imec (Leuven), Fraunhofer IIS (Erlangen) and CIME-P (Grenoble); STFC (Didcot) is responsible for design tools and training, and the Tyndall National Institute (Cork) for system integration. Since 2024/25, the EUROPRACTICE 2.0 project has been funded by the EU Chips Joint Undertaking (Grant no. 101252350). More than 600 academic institutions in 43 countries of the European region use the services.
- Site
- Leuven
- Processes
- IC manufacturing (MPW prototyping / multichip wafer), ASIC prototyping manufacturing, Photonics chip manufacturing, MEMS manufacturing, Microfluidics technologies, Smart System Integration (combining different technologies on one platform/in the same, Packaging and application prototyping (system integration), Small volume production
- Materials
- Silicon (IC/CMOS/MEMS technologies), Multi-Project-Wafer (MPW), CMOS technologies, MEMS technologies, Photonics and microfluidics, III-V semiconductors, Design tools (ECAD/CAD)
- Certificates
- Certificates (as per sources)
- Founded
- 1989
- Industries
- Microelectronics/semiconductors, Universities and research institutes, SMEs and start-ups, Smart Systems/ASICs
- 01
Chip and system design with design tools (ECAD/CAD)
- 02
Training on design flows and technologies
- 03
IC prototyping via MPW runs (ASIC, Photonics, MEMS, microfluidics)
- 04
Smart System Integration and packaging
- 05
Application prototyping
- 06
Small Volume Production
- 07
Support for SMEs in commercialisation and volume production
Technologies and Services
Multi-Project-Wafer (MPW)
Cost-efficient, shared prototyping of advanced IC technologies from multiple participants on a single wafer.
CMOS technologies
Advanced IC technologies from foundries such as X-FAB, TSMC, ams, GLOBALFOUNDRIES, IHP, STMicroelectronics and EM Microelectronic.
MEMS technologies
More-than-Moore technologies with a focus on microsystems engineering, offered via imec and CIME-P.
Photonics and microfluidics
Specialised More-than-Moore technologies for photonic chips and microfluidics.
III-V semiconductors
Fabrication facilities for compound semiconductors at the Tyndall National Institute.
Design tools (ECAD/CAD)
Industry-standard design tools for teaching and non-commercial research at universities and institutes.
Partner Sites
Leuven
BEMPW service and communications (imec)
- Materials
- ASIC (X-FAB to TSMC), MEMS, Photonics, microfluidics
- MPW organisation of advanced IC technologies
Didcot
UKDesign tools and training courses (STFC, Rutherford Appleton Laboratory)
- ECAD/CAD design tool service
- Trainings and webinars
Erlangen
DEMPW service (Fraunhofer IIS)
- Materials
- ASIC technologies from ams, GLOBALFOUNDRIES and IHP
- Access to and support for Application-Specific Components
Grenoble
FRMPW service and business development (CIME-P)
- Lot size
- Prototypes as well as low volume production
- Materials
- ICs, Photonic & Smart Power ICs, MEMS (among others STMicroelectronics, ams, EM Microelectronic, CEA-Leti)
- MPW services on industrial processes
Cork
IESystem integration (Tyndall National Institute)
- Materials
- CMOS, MEMS, III-V
- CMOS fabrication facilities
- MEMS fabrication facilities
- III-V fabrication facilities
- Advanced Integration and Packaging Facilities
Manufacturing and Integration Services
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| IC manufacturing (MPW prototyping / multichip wafer)Casting | – | – | – | – | Silicon |
| ASIC prototyping manufacturingCasting | – | – | – | – | – |
| Photonics chip manufacturingCasting | – | – | – | – | – |
| MEMS manufacturingCasting | – | – | – | – | – |
| Microfluidics technologiesCasting | – | – | – | – | – |
| Smart System Integration (combining different technologies on one platform/in the sameAssembly | – | – | – | – | – |
| Packaging and application prototyping (system integration)Assembly | – | – | – | – | – |
| Small volume productionCasting | – | – | – | – | – |
| Provision of design tools (ECAD/CAD)Engineering | – | – | – | – | – |
| Technical trainings and webinars on design flowsEngineering | – | – | – | – | – |
4 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| CMOS fabrication facilities | Tyndall National Institute | – | – | – | Cork, Ireland |
| MEMS fabrication facilities | Tyndall National Institute | – | – | – | Cork, Ireland |
| III-V fabrication facilities | Tyndall National Institute | – | – | – | Cork, Ireland |
| Advanced Integration and Packaging Facilities | Tyndall National Institute | – | – | – | Cork, Ireland |
Additional services
Quality and Partner Expertise
Quality is based on the established research and manufacturing infrastructures of the five partner organisations, including full CMOS, MEMS and III-V fabrication facilities as well as advanced integration and packaging facilities at the Tyndall National Institute. Certifications of the partners are not stated in the sources.
| Evidence | Leuven | Didcot | Erlangen | Grenoble | Cork |
|---|---|---|---|---|---|
| Certificates (as per sources) |
History
- 1989
Since 1989, EUROPRACTICE has been supporting European academia and SMEs in adopting the latest technologies and design methods
- 1995
imec takes over the ASIC part of the EUROPRACTICE IC service; STFC operates and manages the EUROPRACTICE Design Tool Service
- 2024
Funding by the EU Chips Joint Undertaking under Grant No. 101252350 (EUROPRACTICE 2.0)