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Exatron – Fertigung

Development, manufacturing and assembly of electronic assemblies – from concept to tested circuit board.

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EXATRON Elektronik GmbH

BönningstedtNew on Amplifa

1980Founded (originated from the Lindmaier development office)
GmbHLegal form, HRB 2409, District Court of Pinneberg
Single-layer to 32-layer multilayerCircuit board manufacturing range
>50Distributors and manufacturers for material procurement

About Exatron Elektronik

EXATRON Elektronik GmbH is a company that emerged in 1980 from the Lindmaier development office, headquartered in Bönningstedt (Schleswig-Holstein), and is now run by the second generation. Exatron offers electronics services from a single source: concept and schematic development, PCB layout, circuit board manufacturing, material procurement, assembly of electronic modules, as well as a test field and Direct Prototyping. In circuit board manufacturing, versions from single-layer to 32-layer multilayer are realized, including rigid-flex and flex circuits, thick-copper circuit boards, Thermal Clad IMS® metal-core circuit boards, printed resistors and all common surface finishes; an expedited service is available for time-critical projects. Component procurement is handled through a network of more than fifty distributors and manufacturers across Europe, supplemented by an in-house warehouse. Customers come from industrial electronics, control technology, sensor technology/metrology, medical technology and aerospace – from PLC controls and data acquisition to controls for ventilators and control units in aviation.

Site
Bönningstedt
Processes
Concept / electronics development (schematics), PCB layout (PCB design), Circuit board manufacturing (PCB, single-layer to 32-layer multilayer), Assembly of electronic modules (SMD/THT), Procurement of electronic components (via 50+ distributors/manufacturers), Test field / testing of electronic assemblies (Direct Prototyping), Concept and schematic development, Electronics development
Materials
Circuit board material (various materials), Thermal Clad IMS® (metal-core circuit board), Thick copper, Circuit board material FR4, Flex and rigid-flex materials
Certificates
ISO 9001:2015, ISO 9001
Founded
1980
Industries
Industrial electronics, Control technology, Sensor technology/metrology, Medical technology, Aerospace engineering
  1. 01

    Concept and schematic development

  2. 02

    PCB layout

  3. 03

    Circuit board manufacturing

  4. 04

    Material and component procurement

  5. 05

    Assembly of electronic modules

  6. 06

    Test field / Direct Prototyping

Circuit Board Materials and Processes

FR4

Circuit board material FR4

Standard material for simple circuit boards through to complex multilayer versions.

IMS

Thermal Clad IMS® (metal-core circuit board)

Metal-core circuit boards for applications with high thermal loads.

Cu dick

Thick copper

Thick-copper circuit boards for high currents and stresses.

Flex

Flex and rigid-flex materials

Flexible and rigid-flex circuits for space-critical designs.

Locations

Standort Bönningstedt

Bönningstedt

DE

Headquarters, development and manufacturing

Lot size
Single pieces to project-specific solutions
Materials
Circuit board materials, Thermal Clad IMS®, thick copper
  • Test field
  • Direct Prototyping

Components and Assemblies

Electronic assembly
Electronic assemblyAssembly · Industrial electronics
Tested circuit board
Tested circuit boardTest field · Sensor technology/metrology

Inside the production

Electronics development and manufacturing
Electronics development and manufacturing
Testing of electronic assemblies
Testing of electronic assemblies

Industries

Industrial electronicsControl technologySensor technology/metrologyMedical technologyAerospace engineering

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Concept / electronics development (schematics)Engineering–––––
PCB layout (PCB design)Engineering–––––
Circuit board manufacturing (PCB, single-layer to 32-layer multilayer)Surface––––FR4 (general circuit board material), Thick copper, Metal core (IMS® Thermal Clad), Flex and rigid-flex materials
Assembly of electronic modules (SMD/THT)Assembly–––Single pieces–
Procurement of electronic components (via 50+ distributors/manufacturers)Engineering–––––
Test field / testing of electronic assemblies (Direct Prototyping)Testing–––––

Additional services

Concept and schematic developmentElectronics developmentPCB layoutCircuit board manufacturingMaterial procurement/component procurementAssembly of electronic modulesDirect PrototypingTest field / testing of electronic assemblies

Quality and Certification

Electronic assemblies are carefully tested for function and quality in the company's own test field; the services are certified to ISO 9001:2015 (certificate no. GM1889, QAS International GmbH).

EvidenceBönningstedt
ISO 9001

Company History

  1. 1980

    Founded from the Lindmaier development office; the company is now run by the second generation.

  2. 2010

    First certification to ISO 9001 (March 16, 2010).

  3. 2024

    Renewal of the ISO 9001 certificate (March 16, 2024), valid until 2027.

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