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F/A Fehleranalyse – Fertigung

Independent analysis laboratory for failure analysis of electronic components and printed circuit boards.

F/A Fehleranalyse Logo

F/A Fehleranalyse Elektronik GmbH

New on Amplifa

more than 25 yearsExperience in failure analysis

About us

F/A Fehleranalyse Elektronik GmbH is an independent, well-networked analysis laboratory for industrial analytics in the fields of electronics and electrical engineering. The focus of its activities is the physical/chemical analysis of defective components (active and passive) as well as of printed circuit boards to ensure quality and reliability in the application. A wide range of analysis methods from both non-destructive and destructive analytics are employed. The company has more than 25 years of experience and supports its customers from the prototype stage through development to field failure analysis. Customers come, among others, from the automotive, electrical engineering, aerospace, defense and medical technology industries.

Processes
Physical/chemical analysis of defective components (active and passive), Analysis of defective printed circuit boards, Non-destructive analytics, Destructive analytics, physical/chemical analysis of defective components (active and passive), analysis of printed circuit boards, non-destructive analytics, destructive analytics
Materials
Physical/chemical analysis of defective components, Analysis of printed circuit boards, Non-destructive analytics, Destructive analytics
Industries
Automotive, Electrical engineering, Aerospace, Defense, Medical technology
  1. 01

    Clarification of enquiries

  2. 02

    Non-destructive analytics

  3. 03

    Destructive analytics

  4. 04

    Physical/chemical analysis

  5. 05

    Evaluation and report preparation

Analysis methods

PA

Physical/chemical analysis of defective components

Analysis of active and passive components to ensure quality and reliability.

LP

Analysis of printed circuit boards

Failure analysis of printed circuit boards in electronics manufacturing.

ZFA

Non-destructive analytics

Analysis methods without intervention in the test sample.

ZA

Destructive analytics

Analysis methods with intervention in the test sample, e.g. for internal structural examination.

Analysed objects

X-ray analysis of pin solder joints and via contacts
X-ray analysis of pin solder joints and via contactsNon-destructive analytics · Electronics

Industries

AutomotiveElectrical engineeringAerospaceDefenseMedical technology

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Physical/chemical analysis of defective components (active and passive)Testing–––––
Analysis of defective printed circuit boardsTesting–––––
Non-destructive analyticsTesting–––––
Destructive analyticsTesting–––––

Additional services

physical/chemical analysis of defective components (active and passive)analysis of printed circuit boardsnon-destructive analyticsdestructive analyticsindustrial analytics in electronics and electrical engineering

History

  1. More than 25 years of experience in failure analysis of electronic components

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