Development, production, sales and service of ultrasonic wire bonders and laser bonders for electronics and battery technology
F & K DELVOTEC Bondtechnik GmbH
Ottobrunn, DE · Foothill Ranch, CA, US · Singapore, SG · Taicang, Jiangsu, CNNew on Amplifa
About F & K DELVOTEC
F & K DELVOTEC Bondtechnik GmbH has been active in the field of ultrasonic bonding technology since 1978 and develops and manufactures wire bonders and laser bonders for making electrical contacts on electronic components. The product portfolio includes the M17 series of fully automatic ultrasonic wire bonders for fine wire and heavy wire applications with a working area of up to 1,130 x 700 mm, and since 2014 laser bonding technology for welding thick aluminium, copper and nickel ribbons, developed in part with the Fraunhofer Institute for Laser Technology. The LAZ series (DelvoLAZ, MegaLAZ, GigaLAZ) with IR fiber lasers from 500 W to 1.5 kW targets applications in power electronics and battery assembly such as Cell-to-Module, Cell-to-Pack and Cell-to-Chassis. Customer industries include the semiconductor industry, sensors/MEMS, opto/RF-HF, power electronics, battery technology, automotive and e-mobility. In addition to the machines, the company offers automation solutions from manual small-series production to mass production, the Bond Academy, training and service. F & K DELVOTEC Bondtechnik GmbH, headquartered in Ottobrunn, has been part of the Strama Group since 2017.
- Site
- Ottobrunn
- Processes
- Ultrasonic wire bonding (fine wire), Ultrasonic wire bonding (heavy wire), Laser bonding (laser micro-welding of bond wire/ribbon), Laser TAB bonding (direct welding of components), Tab welding / laser welding for battery packs (Cell-to-Module, Cell-to-Pack, Cell-to-Chassis), Automation / integration of bonders into complete production lines, Bond Academy: consulting, services and analysis for bonding processes, Training on wire bonding and machine operation
- Materials
- Aluminium (bond wire/ribbon), Copper (bond wire/ribbon/terminals), Nickel (ribbon), Gold (bond wire), Ultrasonic wire bonding, Laser bonding / laser micro-welding
- Certificates
- ISO 9001:2015, ISO 14001:2015, ISO 45001:2018
- Founded
- 1978
- Industries
- Semiconductor industry, Sensors/MEMS, Opto/RF-HF, COB/hybrid, Power electronics, Battery technology (BMS, cells, Cell-to-Module/Pack/Chassis)
- 01
Development and engineering (R&D, joint research projects)
- 02
Application consulting and sample bonding/prototype production
- 03
Manufacturing and assembly of the bonders
- 04
Testing and quality assurance (Bond Process Control, Laser Welding Monitor)
- 05
Sales and service (installation, training, after sales)
- 06
Automation/integration into complete production lines
Materials & Processes
Aluminium (bond wire/ribbon)
Processed as wire and ribbon in ultrasonic and laser bonding for power electronics and battery technology.
Copper (bond wire/ribbon/terminals)
For wire, ribbon and tab bond connections on DCB substrates and copper terminals with high current-carrying capacity.
Nickel (ribbon)
Nickel ribbons are welded using laser energy at low bond force.
Gold (bond wire)
Gold wire is used in fine wire bonding for semiconductor and sensor applications.
Ultrasonic wire bonding
Fine wire and heavy wire bonding processes on the M17 platform with wire diameters from 17 to 600 µm and ribbon cross-sections up to 2,000 × 300 µm.
Laser bonding / laser micro-welding
Joining of thick Al, Cu and Ni ribbons and direct welding of components (TAB bonding) with repeatability of under ±10 µm.
Locations
Ottobrunn
DEHeadquarters: development, production, sales and service of wire and laser bonders
- Materials
- Aluminium, copper, nickel, gold
- M17S wire bonder
- M17D wire bonder with two bond heads
- M17L wire bonder (635 × 350 × 100 mm)
- M17XL wire bonder (1,130 × 700 mm)
- M17LSB L laser bonder
- M17LSB XL laser bonder
- DelvoLAZ (IR fiber laser 500 W – 1.5 kW)
- MegaLAZ (working area 2400 × 1500 × 400 mm)
- GigaLAZ (working area 2400 × 1600 × 400 mm)
Foothill Ranch, CA
USBranch office F & K DELVOTEC Inc. (sales and service USA)
Singapore
SGBranch office F & K DELVOTEC Bondtechnik Singapore Pte. Ltd. (sales and service Asia)
Taicang, Jiangsu
CNBranch office F & K DELVOTEC (TAICANG) CO., LTD (China location since 2025)
Components & Applications
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Ultrasonic wire bonding (fine wire)Joining | – | – | – | Small series – Mass production | Gold wire, Aluminium wire, Copper wire, coated wires, ribbons (aluminium, copper, nickel) |
| Ultrasonic wire bonding (heavy wire)Joining | – | – | – | Small series – Mass production | Aluminium, Copper, Aluminium ribbon, Copper ribbon |
| Laser bonding (laser micro-welding of bond wire/ribbon)Joining | – | – | – | – | Aluminium, Copper, Nickel ribbon |
| Laser TAB bonding (direct welding of components)Joining | – | – | – | – | Aluminium, Copper, Nickel |
| Tab welding / laser welding for battery packs (Cell-to-Module, Cell-to-Pack, Cell-to-Chassis)Joining | Repeatability < ±10 µm | 2400 mm × 400 mm | – | – | Aluminium ribbons, Copper ribbons, Nickel ribbons |
| Automation / integration of bonders into complete production linesAssembly | – | – | – | manual small-series production – Mass production | – |
| Bond Academy: consulting, services and analysis for bonding processesEngineering | – | – | – | – | – |
| Training on wire bonding and machine operationEngineering | – | – | – | – | – |
| Service (before, during and after the investment decision)Engineering | – | – | – | – | – |
9 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Fully automatic ultrasonic wire bonder (M17S, the smallest) | F & K DELVOTEC M17 S | – | X = 254 mm (10"), Y = 152 mm (6"), Z = 40 mm | – | Ottobrunn |
| Fully automatic ultrasonic wire bonder with two bond heads (M17D, the most flexible) | F & K DELVOTEC M17 D | – | X = 254 mm, Y = 153 mm (optional 204 mm), Z = 40 mm (optional 60 mm) | – | Ottobrunn |
| Fully automatic ultrasonic wire bonder (M17L, the square one) | F & K DELVOTEC M17 L | – | 635 mm (X) x 350 mm (Y), 100 mm (Z); variants up to 500 mm pass-through height | – | Ottobrunn |
| Fully automatic XL wire bonder (M17XL, the largest) | F & K DELVOTEC M17 XL | – | 1,130 mm (X) x 700 mm (Y); 44" x 27" | – | Ottobrunn |
| Laser bonder (M17LSB L, the first of its kind) | F & K DELVOTEC M17LSB L | – | – | – | Ottobrunn |
| Laser bonder in XL format (M17LSB XL) | F & K DELVOTEC M17LSB XL | – | – | – | Ottobrunn |
| Laser bonder LAZ series (DelvoLAZ) | F & K DELVOTEC DelvoLAZ | – | 1250 mm x 500 mm x 100 mm; machine 1300x2500x2400 mm (WHD); IR fiber laser 500 W – 1.5 kW | – | Ottobrunn |
| Laser bonder LAZ series (MegaLAZ) | F & K DELVOTEC MegaLAZ | – | 2400x1500x400 mm; IR fiber laser 500 W – 1.5 kW; spot diameter 35 – 40 µm | – | Ottobrunn |
| Laser bonder LAZ series (GigaLAZ) | F & K DELVOTEC GigaLAZ | – | 2400x1600x400 mm; IR fiber laser 500 W – 1.5 kW; spot diameter 35 – 40 µm | – | Ottobrunn |
Additional services
Quality & Certificates
The machines monitor and control the bonding process in real time using patented Bond Process Control and camera-based quality tools; the LAZ series features automatic laser power measurement, laser caustic measurement, Laser Welding Monitor (LWM) and visual tool inspection. The quality management system is certified to DIN EN ISO 9001:2015 (TÜV SÜD).
| Evidence | Ottobrunn |
|---|---|
| ISO 9001:2015 | |
| ISO 14001:2015 | |
| ISO 45001:2018 |
History
- 1978
Start of company operations in the field of ultrasonic bonders
- 1989
Establishment of a subsidiary in Singapore
- 1993
Founding of F & K DELVOTEC Bondtechnik GmbH following a management buy-out by Dr. Farassat and S. Kazemi
- 1994
Founding of the US subsidiary F & K DELVOTEC Inc. in Foothill Ranch (CA)
- 2014
Introduction of laser bonding technology for thick Al/Cu ribbons
- 2015
World premiere of the laser bonder (M17LSB)
- 2017
Joined the Strama Group
- 2025
New location in China (Taicang); presence at automatica 2025 and BatteryShow 2025