F&S BONDTEC manufactures wire bonders, bond testers and ultrasonic generators for microelectronics, power electronics and battery manufacturing.
F&S Bondtec Semiconductor GmbH
Braunau am Inn (AT) · Industriezeile 49a, 5280 Braunau am InnNew on Amplifa
About F&S BONDTEC
F&S Bondtec Semiconductor GmbH develops and manufactures wire bonders, bond testers, digital ultrasonic generators and custom special machines for assembly and interconnection technology in Braunau am Inn (Upper Austria). The portfolio includes the manual tabletop bonders of the SERIES 53, the flexible desktop factory systems SERIES 56i and 58, the universal manufacturing unit SERIES 86 for battery modules, and the 7-in-1 system SERIES 90 for thin and heavy wire bonding and bond testing (pull and shear tests, BAMFIT). The machines work with gold wires from 12 to 50 µm, aluminium and copper wires up to 500 µm, and ribbons up to 2 mm in width, and achieve positional accuracies of ±5 µm at 3σ. A changeable-head concept allows changeover times of under 2 minutes and the combination of all bonding and testing methods on one machine platform. Services include feasibility studies, bonding process support, software development (Bondstar), training at the company's own training center, as well as international service and support. Customers include the semiconductor and microelectronics industries, power electronics, battery and e-mobility manufacturing including re-manufacturing, and mechanical engineering.
- Site
- Braunau am Inn, Austria
- Processes
- Wire bonding (gold ball / ball-wedge), Fine wire wedge-wedge bonding, Fine wire deep-access wedge-wedge bonding, Heavy wire bonding, Heavy ribbon bonding (ribbons up to 2 mm width), Bumping / safety bump / stitch-on-ball, Pull test (bond testing), Shear test (bond testing)
- Materials
- Gold, Aluminium, Copper, Gold wire, Aluminium wire, Copper wire, Aluminium ribbon, Digital ultrasonic generator
- Certificates
- ISO 9001
- Founded
- ca. 1994
- Industries
- Semiconductor/microelectronics, Power electronics, Battery/e-mobility manufacturing, Mechanical engineering, Remanufacturing
- 01
Feasibility study
- 02
Engineering & design
- 03
Manufacture of bonding/test heads and machine components
- 04
Assembly of wire bonders, bond testers and ultrasonic generators
- 05
Software (Bondstar, CSR) & programming
- 06
Quality testing (pull/shear test, BAMFIT, DLC)
- 07
Training, service & support worldwide
Materials & Processes
Gold wire
For gold ball and wedge-wedge bonding with wires from 12 to 50 µm as well as bumping/safety bump.
Aluminium wire
Fine wire 12–75 µm for wedge-wedge and deep-access bonding, heavy wire 100–500 µm for power electronics and battery modules.
Copper wire
Heavy wire 100–300 µm for heavy wire bonding in power electronics.
Aluminium ribbon
Heavy ribbon bonding with ribbons up to 2 mm in width and bond forces up to 6,000 cN.
Digital ultrasonic generator
D-USG X/XL (50–200 W, 20–200 kHz) for all wire bonding processes with digital DSP control and transducer diagnostics.
Wire bonding
Gold ball, wedge-wedge, deep access, heavy wire and heavy ribbon with programmable loop shapes.
Bond testing
Pull test, shear test and the BAMFIT reliability method for evaluating heavy wire interconnects.
Die bonding
Die bond head 5380 for the Series 53.
CO2 cleaning
Optional cleaning of bonding surfaces, among other things in the re-manufacturing of battery modules.
Location
Braunau am Inn
ATHeadquarters with manufacturing, training center and service
- Materials
- Gold, aluminium, copper
- SERIES 53 (manual tabletop bonder, 18×18 mm)
- SERIES 56i (6-in-1, 100×100 mm, ±5 µm)
- SERIES 58 (4-in-1, 200×150 mm, >1 wire/s)
- SERIES 86 (4-in-1, up to 700×480 mm, battery modules)
- SERIES 90 (7-in-1, 700×480 mm, pull/shear)
- BAMFIT 5600 (X/Y 100×100 mm, <2 µm repeatability)
- D-USG X/XL, USG-16 ultrasonic generators
Products & Systems
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| Wire bonding (gold ball / ball-wedge)Joining | ± 5 μm @ 3σ (positional accuracy, Series 56i/86/90) | – | – | – | Gold wires 12-50 µm |
| Fine wire wedge-wedge bondingJoining | ± 5 μm @ 3σ | – | – | – | Aluminium wires 12-75 µm, Gold wires 12-75 µm, Aluminium and gold ribbons |
| Fine wire deep-access wedge-wedge bondingJoining | – | – | – | – | Aluminium wires 12-75 µm, Gold wires 12-75 µm, Aluminium and gold ribbons |
| Heavy wire bondingJoining | – | – | – | – | Aluminium heavy wire 100-500 µm, Copper heavy wire 100-300 µm |
| Heavy ribbon bonding (ribbons up to 2 mm width)Joining | – | – | – | – | Aluminium ribbons up to 2 mm width (Series 58 as well |
| Bumping / safety bump / stitch-on-ballJoining | – | – | – | – | Gold |
| Pull test (bond testing)Testing | – | – | – | – | – |
| Shear test (bond testing)Testing | – | – | – | – | – |
| BAMFIT test method (Bond Accelerated Mechanical Fatigue Interconnection Test)Testing | Repeatability <2 μm; step resolution 0.25 μm | Working range X/Y 100x100 mm × Z-axis 60 mm | – | – | Al heavy wires 125-400 μm |
| Wire bonding for battery modules / re-manufacturing of battery modules (removal of old bonds,Joining | – | – | – | – | Aluminium heavy wire |
| CO2 cleaning of bonding surfaces (optional)Surface | – | – | – | – | – |
| Custom special machines (from feasibility study to production)Engineering | – | – | – | – | – |
| Die bonding (bond head 5380, Series 53)Assembly | – | – | – | – | – |
9 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Wire bonder / desktop factory (semi-automatic/fully automatic) | F&S BONDTEC SERIES 56i (6-in-1) | – | Manipulator 100 x 100 mm, Z-axis 60 mm | – | Braunau am Inn |
| Wire bonder (tabletop bonder, high-productivity, >1 wire/second) | F&S BONDTEC SERIES 58 (4-in-1) | – | 200 x 150 mm | – | Braunau am Inn |
| Manual tabletop bonder | F&S BONDTEC SERIES 53 | – | Max. bonding area 18 x 18 mm | – | Braunau am Inn |
| Universal manufacturing unit for battery modules (4-in-1, bonding/cleaning/testing/P-S/BAMFIT) | F&S BONDTEC SERIES 86 | – | up to 480 x 700 mm | – | Braunau am Inn |
| Wire bonder / bond tester (7-in-1, thin & heavy wire, pull & shear testing) | F&S BONDTEC SERIES 90 | – | 700 x 480 mm, Z-axis 100 mm | – | Braunau am Inn |
| BAMFIT bonder/tester (test head on Series 56XX) | F&S BONDTEC BAMFIT 5600 | – | X/Y 100x100 mm, Z-axis 60 mm; dimensions 70x65x70 cm, approx. 80 kg | – | Braunau am Inn |
| Digital ultrasonic generator | F&S BONDTEC D-USG X (50 W, 20-200 kHz) | – | – | – | Braunau am Inn |
| Digital ultrasonic generator | F&S BONDTEC D-USG XL (200 W, 20-200 kHz) | – | – | – | Braunau am Inn |
| Digital ultrasonic generator (standard) | F&S BONDTEC USG-16 (50 W, 20-200 kHz) | – | – | – | Braunau am Inn |
Additional services
Quality
F&S BONDTEC is ISO 9001 certified as a seal for integrated quality monitoring. The machines operate with deformation control (DLC) for real-time quality monitoring, automatic image recognition and positional accuracies of up to ±5 µm at 3σ.
| Evidence | Braunau am Inn |
|---|---|
| ISO 9001 |
History
- ca. 1994
F&S BONDTEC founded in Braunau am Inn; 30 years in Braunau were celebrated in 2024.
- 2017
56XX Desktop Factory introduced: flexible production with changeable-head concept and changeover times under 2 minutes.
- 2021
Universal manufacturing unit SERIES 86 for manufacturing and re-manufacturing of battery modules introduced.
- 2024
30 years of F&S BONDTEC in Braunau celebrated.
- 2025
SERIES 90 and D-USG X introduced; BAMFIT as a remanufacturing platform for heavy wire in power electronics.