EMS provider for development, assembly, testing and final assembly of electronic assemblies for industry and medical technology.
Finke Elektronik GmbH
Waldkirch (St.-Margarethen-Straße 31), GermanyNew on Amplifa
About Finke Elektronik
Finke Elektronik GmbH, based in Waldkirch in the Breisgau region, is an EMS provider (Electronic Manufacturing Services) for the development and production of demanding electronics solutions. The range of services includes hardware and software development, PCB layout, SMD and THT assembly, wave and selective soldering, conformal coating and potting, board and device assembly, as well as logistics and after-sales services. The production facility is equipped with fully automatic placement lines from Mycronic (including My100DX, My40 Pro), JetPrinter MY600, stencil printers from EKRA, 8-zone reflow ovens from Seho and SMT, as well as wave and selective soldering systems from ERSA and EBSO. Component sizes down to 01005 and BGA468 (0,4 Pitch) are processed; lot sizes range from 0-series and very small series to large-scale series. For quality assurance, 3D AOI systems from Pemtron, ICT and functional tests with in-house test adapter construction, safety tests as well as non-destructive 2D/3D X-ray analysis are available. Production follows the IPC-A-610 standard. Customers come from industrial and medical electronics, e.g. control and regulation devices, measurement and safety systems. Express service for prototypes (24-hour, 3-day and 7-day service) rounds out the offering.
- Site
- Waldkirch
- Processes
- SMD assembly (PCB assembly), THT assembly, Lead-free wave soldering under inert gas, Selective soldering (with special masks), Press-fitting of connectors (up to 40 kN), Conformal coating, Potting, Board washing (cleaning of printed circuit boards)
- Materials
- SMD Assembly, THT Assembly, Reflow Soldering, Prototype Express Service, Production Standard IPC-A-610
- Certificates
- DIN EN ISO 9001, DIN EN ISO 13485, DIN EN ISO 14001, IPC-A-610 (production standard)
- Industries
- Industrial electronics, Medical technology/medical electronics
- 01
Hardware and software development
- 02
PCB layout
- 03
Component evaluation and procurement
- 04
Stencil printing / jet printing
- 05
SMD assembly
- 06
Reflow soldering
- 07
THT assembly (wave/selective soldering)
- 08
Board washing, conformal coating, potting
- 09
AOI, X-ray, ICT, functional test
- 10
Device assembly
- 11
Logistics and shipping
- 12
After-sales / repair service
Processes and Manufacturing Technology
SMD Assembly
Fully automatic placement of printed circuit boards with component sizes down to 01005 and BGA468 (0,4 Pitch) as well as special package types such as flip-chip.
THT Assembly
Through-hole assembly including lead-free wave soldering under inert gas and selective soldering with special masks.
Reflow Soldering
8-zone reflow ovens from Seho and SMT for precise soldering processes in prototype and series production.
Prototype Express Service
Assembly of prototypes within a few working days via a dedicated prototype line (24-hour, 3-day and 7-day service).
Production Standard IPC-A-610
Production according to the international standard for electronic assemblies.
Locations
Waldkirch
DEDevelopment, production, administration
- Lot size
- 0-series to large series
- Materials
- SMD, THT
- Mycronic My100DX placement line
- Mycronic My40 Pro
- Mycronic MY600 JetPrinter
- EKRA stencil printers
- 8-zone reflow ovens (Seho, SMT)
- ERSA wave soldering system (lead-free, inert gas)
- EBSO selective soldering system
- Pemtron Color 3D AOI
- Board washing system
- 2D/3D X-ray system
- Scienscope AXC-800 III component counter
Manufactured Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD assembly (PCB assembly)Assembly | – | – | – | 0-series/very small series – Large series | Electronic components (SMD) |
| THT assemblyAssembly | – | – | – | – | Electronic components (THT) |
| Lead-free wave soldering under inert gasJoining | – | – | – | – | Printed circuit boards |
| Selective soldering (with special masks)Joining | – | – | – | – | Printed circuit boards |
| Press-fitting of connectors (up to 40 kN)Assembly | – | – | – | – | Connectors |
| Conformal coatingSurface | – | – | – | – | Printed circuit boards/assemblies |
| PottingSurface | – | – | – | – | Assemblies |
| Board washing (cleaning of printed circuit boards)Surface | – | – | – | – | Printed circuit boards |
| Device assembly / board assemblyAssembly | – | – | – | 0-series, very small series – Large series | – |
| AOI inspection (3D, Color)Testing | – | – | – | – | – |
| ICT (In-Circuit Test)Testing | – | – | – | – | – |
| Functional testTesting | – | – | – | – | – |
| X-ray inspection 2D/3D (non-destructive)Testing | – | – | – | – | Assemblies |
| Safety tests (insulation test, earth bonding test)Testing | – | – | – | – | – |
| Express service for prototypes (assembly within a few working days, 3-/7-day service)Assembly | – | – | – | – | Printed circuit boards |
| Electronics development (hardware and software)Engineering | – | – | – | – | – |
| PCB layoutEngineering | – | – | – | – | – |
| Component evaluation and procurement (purchasing)Engineering | – | – | – | – | – |
| Redesign / product optimization (product lifecycle management)Engineering | – | – | – | – | – |
| Logistics and shipping (consignment warehouse, goods identification)Assembly | – | – | – | – | – |
| Repair serviceAssembly | – | – | – | – | – |
| Test adapter constructionTesting | – | – | – | – | – |
12 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMD placement line / placement machine | MYCRONIC My100DX | – | Component sizes down to 01005 and BGA468 0,4 Pitch | – | Waldkirch |
| SMD placement machine | Mycronic My40 Pro | – | – | – | Waldkirch |
| Reflow oven (8 zones) | Seho | – | – | – | Waldkirch |
| Reflow oven (8 zones) | SMT | – | – | – | Waldkirch |
| Stencil printer | EKRA | – | – | – | Waldkirch |
| JetPrinter (dispensing printer) | MYCRONIC MY600 | – | – | – | Waldkirch |
| Wave soldering system (lead-free under inert gas) | ERSA | – | – | – | Waldkirch |
| Selective soldering system | EBSO | – | – | – | Waldkirch |
| AOI system (Color 3D) | Pemtron | – | – | – | Waldkirch |
| Board washing system | – | – | – | – | Waldkirch |
| Component counter | Scienscope AXC-800 III | – | up to 4 reels simultaneously, 15 s counting time per cycle | – | Waldkirch |
| X-ray system (2D/3D inspection) | – | – | – | – | Waldkirch |
Additional services
Quality and Certification
Production is carried out according to IPC-A-610; every production step is inspected, documented and archived. Test equipment includes 3D AOI (Pemtron), ICT and functional tests with in-house test adapter construction, safety tests (insulation/earth bonding test) as well as 2D/3D X-ray analysis; test results are evaluated, archived and managed.
| Evidence | Waldkirch |
|---|---|
| DIN EN ISO 9001 | |
| DIN EN ISO 13485 | |
| DIN EN ISO 14001 | |
| IPC-A-610 (production standard) |
History
- 2000
First certified to DIN EN ISO 9001.
- 2009
Certified environmental management system to DIN EN ISO 14001.