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Fujimi – Fertigung

Japanese manufacturer of synthetic precision abrasives, CMP slurries and thermal spray powders.

Fujimi Logo

FUJIMI INCORPORATED

Kiyosu, Aichi (Japan) · Inazawa, Aichi (Japan) · Kakamigahara, Gifu (Japan) · Tualatin, Oregon (USA) · Kulim, Kedah (Malaysia) · Ingelfingen (Germany)New on Amplifa

1950Founded (predecessor Fujimi Abrasives)
1305Employees (group)
12+Locations in Japan, USA, Malaysia, Europe and Asia
5384Securities identification code (Tokyo Stock Exchange)
1953Formal establishment of Fujimi Abrasives Manufacturing Co.

About Fujimi

FUJIMI INCORPORATED was founded in 1950 and is a Japanese manufacturer of synthetic precision abrasives headquartered in Kiyosu, Aichi Prefecture. The company produces lapping and polishing materials, CMP slurries for semiconductor manufacturing, polishing agents for hard disks and optical lenses, as well as cermets and oxide ceramic powders for thermal spraying. The processes are based on three core competencies: filtration/classification/purification, powder technology and chemical technology. Materials processed include aluminum oxides, silicon carbide, tungsten carbide cermets, cerium oxide and colloidal silica for substrates made of silicon, sapphire, GaAs, GaN, SiC, LiNbO3 and LiTaO3. Customers are found in the semiconductor industry, hard disk drives, LED/lighting, optics, automotive and aerospace industries as well as in the steel and energy sectors. With production plants in Japan, the USA and Malaysia and sales companies in Europe, China, Korea and Taiwan, Fujimi supplies customers worldwide, including Intel, AMD and TSMC.

Site
452-8502 Kiyosu, Aichi
Processes
Lapping (abrasive products FO, A, WA, PWA, GC, C), Polishing (COMPOL, POLIPLA, FM, FAL, FZ, INSEC, GLANZOX, MIRAFLEX), CMP (Chemical Mechanical Planarization, PLANERLITE slurries), Slicing/Cutting (GC abrasives for wire saws), Grinding (diamond products FDP, FDW, FDC, DIATEC), Blasting (A, WA, GC), Thermal spraying (thermal spray with cermet and ceramic powders), HVOF thermal spray system (ultrafine grain, world first 2002)
Materials
Silicon (single-crystal ingot, wafer), Silicon carbide (α-type, green), Aluminum oxide (white fused alumina), Calcined platelet aluminum oxide, Cubic aluminum oxide, Titanium phosphate, Zinc oxide (rod-shaped, Al-doped electrically conductive), Tungsten carbide cemented carbide powder
Certificates
ISO 9002, ISO 9001, ISO 14001, JIS Q 9100, JIS Q 9100 (aerospace)
Founded
1950
Employees
1305
  1. 01

    Raw powder synthesis and powder design

  2. 02

    Filtration, classification, purification

  3. 03

    Chemical formulation (slurries, polishing compositions)

  4. 04

    Quality control and particle characterization

  5. 05

    Technical development from prototype stage together with customers

  6. 06

    Sales via a global network

Materials & Processes

WA

White Fused Alumina (>96,0 % Al2O3)

Corundum abrasive grain for lapping, polishing, blasting and grinding wheels.

PWA

Platelet Calcined Alumina (>99,0 % Al2O3)

Platelet-shaped polishing agent in a broad particle size distribution from 3.1 to 35 µm.

GC

Green Silicon Carbide (α-type)

Very hard, chemically stable abrasive grain for slicing, lapping and as a sintering raw material.

CeO2

Cerium Oxide (FR Series)

Polishing agent for optical glass and flat glass since 1960.

SURPREX WC17

WC/17 % Co (AMS7881A)

Cemented carbide spray powder with high toughness and wear resistance, among other uses in aerospace.

SURPREX W1004

WC/10 % Co/4 % Cr (AMS7882A)

Spray powder with high hardness as well as corrosion and cavitation erosion resistance.

SURPREX W2007

WC/20 % CrC/7 % Ni

Cermet spray powder for wear, corrosion and oxidation protection.

Al2O3-TiO2

Aluminum Oxide-Titanium Oxide

Oxide ceramic spray powder used, among other things, for electrostatic chucks and chamber walls.

MoB

Molybdenum Boride

Boride cermet spray powder for rolls in steel transport.

Si

Colloidal Silica / Silicon Polishing Chemistry

Basis of the GLANZOX and CMP slurry products for silicon wafers.

ZnO

Rod-Shaped Zinc Oxide

Thermally conductive filler for thermal interface materials, also Al-doped electrically conductive.

FDP/FDC/DIATEC

Diamond Abrasive Products

For stable, precise grinding of optics, cemented carbide, ferrite and barium titanate.

Products & Applications

PLANERLITE CMP slurry for semiconductor chips
PLANERLITE CMP slurry for semiconductor chipsCMP · Semiconductor
GLANZOX polishing agent for silicon wafers
GLANZOX polishing agent for silicon wafersLapping/Polishing · Semiconductor
Precision polishing agent for hard disks
Precision polishing agent for hard disksPolishing · Hard disk industry

Inside the production

FUJIMI product portfolio
FUJIMI product portfolio
Development of next-generation products
Development of next-generation products

Processes & technical limits

ProcessesToleranceMax. partWeightLot sizeMaterials
Lapping (abrasive products FO, A, WA, PWA, GC, C)Surface––––Silicon wafers, Glass, Sapphire, GaN, GaAs, GaP, InP, SiC, LiNbO3, LiTaO3, Ferrite, Barium titanate, Alumina, PZT, Metals, Plastics
Polishing (COMPOL, POLIPLA, FM, FAL, FZ, INSEC, GLANZOX, MIRAFLEX)SurfaceMirror finish–––Silicon wafers, Glass, Sapphire, GaN, SiC, GaAs, GaP, InP, LiNbO3, LiTaO3, Ferrite, Barium titanate, Alumina, PZT, Metals, Plastic lenses, Automotive clear coat
CMP (Chemical Mechanical Planarization, PLANERLITE slurries)Surface––––Silicon, Cu (copper CMP), Semiconductor substrates
Slicing/Cutting (GC abrasives for wire saws)Machining––––Single-crystal silicon ingot
Grinding (diamond products FDP, FDW, FDC, DIATEC)Machining––––Optical lenses, Metals, Cemented carbide, Glass, Ferrite, Barium titanate, Alumina
Blasting (A, WA, GC)Surface–––––
Thermal spraying (thermal spray with cermet and ceramic powders)SurfaceLow surface roughness (WC/Fe)––Small quantities for prototypesWC/Co, WC/Co/Cr, WC/NiCr, WC/Hastelloy, WC/Fe, CrC/NiCr, Boride cermet (MoB), Al2O3, Al2O3-TiO2, Oxide ceramics
HVOF thermal spray system (ultrafine grain, world first 2002)Surface––––WC cermet
Low temperature spray process (500 °C, WC powder)Surface––––Tungsten carbide powder, WC/Fe

2 Anlagen & Maschinen

MachineManufacturer / modelQuantityWorking areaYear builtSite
Thermal spray system (HVOF, ultrafine-grain)–––2002Kakamihigashimachi / Thermal Spray Materials Dept., Kakamigahara, Gifu
CMP polishing and measurement equipment (identical to customer equipment)––––Development centers Japan, USA, Taiwan

Additional services

Polishing solutions (lapping, polishing compounds, CMP slurries)Thermal spray powders (cermet, ceramics)Specialty materials/powdersGrinding wheel and coated abrasive materialsBlast materialsFiller materialsTechnical support from development stageCustomized product development

Reference customers

IntelAMDTSMCTokyo Tsushin Kogyo (Sony predecessor, historical)

Quality & Certifications

All Japanese production plants are certified to ISO 9001 and ISO 14001; thermal spray materials are certified to JIS Q 9100 (aerospace). Customers such as Intel, AMD and TSMC have repeatedly awarded Fujimi supplier quality accolades.

EvidenceKiyosu (Biwajima Plant)Inazawa PlantKakamigahara PlantKakamihigashimachi PlantTualatin (USA)Kulim (Malaysia)
ISO 9001
ISO 14001
JIS Q 9100 (aerospace)
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