EMS provider for SMD and THT assembly, testing, supply chain and box build of electronic assemblies from prototype to series production.
Global Components AG
OberhachingNew on Amplifa
About Global Components
Global Components AG is a privately owned EMS company headquartered in Oberhaching near Munich that has been manufacturing electronic assemblies since 2000. The company, with around 50 employees and annual revenue of approximately €12 million, is set up for small and medium series with annual volumes of 100 to 10,000 units and high variant diversity; over 200,000 assemblies are populated each year. The process chain covers SMD and THT assembly (reflow, reflow under nitrogen, vapor phase, selective and wave soldering), assembly cleaning, conformal coating on a dedicated coating line, as well as box build and mechanical integration. Tests such as SPI, 2D/3D AOI, ICT, flying probe, functional testing and in-house X-ray inspection are integral parts of manufacturing; on project request, production and acceptance to IPC-A-610 Class 3 is performed. Focus industries are medical technology, rail technology, optoelectronics, defense, renewable energy and industrial electronics. In July 2025, a second SMT line with reflow oven and SPI technology was commissioned and the production and warehouse space was expanded by around 30%.
- Site
- Oberhaching
- Processes
- SMD assembly, THT assembly, Conventional reflow soldering, Reflow under nitrogen, Vapor phase soldering, Selective soldering, Wave soldering, Hand soldering for special or critical components
- Materials
- SMD assembly, THT assembly, Conformal Coating, Box Build & Integration
- Certificates
- ISO 9001:2015 (DIN EN ISO 9001:2015), ISO 9001, IPC-A-610 Class 3
- Founded
- 2000
- Employees
- ca. 50
- Industries
- Medical technology, Rail technology, Optoelectronics, Defense, Renewable energy, Industrial electronics
- 01
DFM review & BOM check
- 02
Material & supply chain management
- 03
SMD assembly (SPI, reflow/vapor phase soldering)
- 04
THT assembly (selective, wave, hand soldering)
- 05
Assembly cleaning
- 06
Conformal coating
- 07
Box build & integration
- 08
Testing (AOI, ICT, flying probe, functional test, X-ray)
- 09
Logistics & after-sales
Processes & Manufacturing Technologies
SMD assembly
Population of PCBs with package sizes from 01005, with SPI in-line and reflow, reflow under nitrogen or vapor phase soldering.
THT assembly
Through-hole technology with selective, wave and hand soldering for special or critical components.
Conformal Coating
Selective or full-surface protective coating on a dedicated coating line for humid or demanding environments.
Box Build & Integration
Mechanical integration, cable and connector assembly including testing after integration.
Site
Oberhaching
DEProduction and administrative site (production, warehouse, testing, logistics)
- Lot size
- 100–2,500 units
- Materials
- SMD/THT, conformal coating, box build
- 2 SMT production lines with reflow oven
- SPI system
- Pick-and-place with camera recognition (package sizes from 01005)
- 3D AOI
- X-ray inspection system
- Selective and wave soldering systems
- Dedicated coating line (conformal coating)
- Flying probe and ICT test systems
- Rework station
- Photovoltaic system with heat recovery
Typical Assemblies
Inside the production
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMD assemblyAssembly | – | – | – | 100 – 2,500 | – |
| THT assemblyAssembly | – | – | – | 100 – 2,500 | – |
| Conventional reflow solderingJoining | – | – | – | – | – |
| Reflow under nitrogenJoining | – | – | – | – | – |
| Vapor phase solderingJoining | – | – | – | – | – |
| Selective solderingJoining | – | – | – | – | – |
| Wave solderingJoining | – | – | – | – | – |
| Hand soldering for special or critical componentsJoining | – | – | – | – | – |
| Conformal coating (selective or full-surface, dedicated coating line)Surface | – | – | – | – | – |
| Assembly cleaningSurface | – | – | – | – | – |
| Box build & integration (mechanical integration, cable and connector assembly, testing afterAssembly | – | – | – | – | – |
| Solder paste inspection (SPI)Testing | – | – | – | – | – |
| AOI (automated optical inspection, 2D/3D, evaluation to IPC-A-610)Testing | – | – | – | – | – |
| X-ray inspection (in-house, also for hidden solder joints such as BGA/QFN)Testing | – | – | – | – | – |
| ICT (in-circuit test)Testing | – | – | – | – | – |
| Flying probeTesting | – | – | – | – | – |
| Functional test (project-specific test adapters and test concepts)Testing | – | – | – | – | – |
| DFM review / DFM check (layout and assembly review before production start)Engineering | – | – | – | – | – |
| BOM check (availability, lifecycle and EOL risks)Engineering | – | – | – | – | – |
| Material & supply chain management (procurement, obsolescence monitoring, last-time-buy)Engineering | – | – | – | – | – |
| Manufacturing and acceptance to IPC-A-610 Class 3 (on project request)Testing | – | – | – | – | – |
| First article inspection (first sample approval before series start)Testing | – | – | – | – | – |
12 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| SMT production line (assembly line with SPI, reflow oven) | – | 2 | – | – | Oberhaching |
| Reflow oven | – | – | – | – | Oberhaching |
| SPI system (solder paste inspection) | – | – | – | – | Oberhaching |
| Pick-and-place system with camera recognition (package sizes from 01005) | – | – | – | – | Oberhaching |
| 3D AOI | – | – | – | – | Oberhaching |
| X-ray inspection system (X-ray) | – | – | – | – | Oberhaching |
| Selective soldering system | – | – | – | – | Oberhaching |
| Wave soldering system | – | – | – | – | Oberhaching |
| Dedicated coating line (conformal coating) | – | – | – | – | Oberhaching |
| Flying probe test system | – | – | – | – | Oberhaching |
| ICT test system | – | – | – | – | Oberhaching |
| Rework station | – | – | – | – | Oberhaching |
Additional services
Quality & Certifications
Quality management is certified to ISO 9001:2015 (TÜV SÜD). Tests with SPI, 2D/3D AOI, ICT, flying probe, functional testing and in-house X-ray inspection are defined project-specifically on a risk-oriented basis; evaluation to IPC-A-610 Class 3 on project request; test and process data are retained for at least 5 years.
| Evidence | Oberhaching |
|---|---|
| ISO 9001 | |
| IPC-A-610 Class 3 |
History
- 2000
Founded; manufacturing of electronic assemblies in Oberhaching near Munich ever since
- 2025
Commissioning of a second SMT production line including reflow oven, introduction of SPI technology and approximately 30% more production and warehouse space