SMT assembly, THT soldering, final assembly and PCB manufacturing for small and medium series with high reliability.
杭州迅得电子有限公司 (Hangzhou Xunde Electronics Co., Ltd.)
杭州 (Hangzhou)New on Amplifa
About us
Hangzhou Xunde Electronics is an electronics manufacturing services (EMS) provider headquartered in Hangzhou, China. The company offers one-stop services: prototype assembly, SMT assembly, DIP/THT soldering, final assembly of finished products, component sourcing as well as PCB manufacturing including rapid prototyping and board copying. The assembly technology covers fine components such as 01005 and 0201, BGA and CSP as well as high-density HDI assemblies with 0.4 mm pitch and underfill. The process chain extends from screen printing and solder paste printing through placement, reflow and wave soldering to X-ray, AOI and 3D SPI inspection as well as flying probe/ICT testing; a free DFM review is part of the offering. Rapid manufacturing from 5 hours is offered via an online quotation system. The products and services are used in medical technology, automotive, aerospace, telecommunications, industrial automation, consumer electronics, IoT and music electronics. The company website cites 14 years of experience in domestic and international electronics contract manufacturing.
- Site
- 杭州 (Hangzhou), China
- Processes
- SMT placement assembly (01005, 0201, BGA, CSP placement), Reflow soldering, Wave soldering, DIP soldering / post-insertion soldering (THT soldering), Manual soldering, Solder paste printing (screen printing/dispensing), HDI high-density assembly (0.4mm pitch BGA, underfill), Finished product assembly (PCBA final assembly)
- Materials
- PCB (printed circuit board), PCB finish ENIG (electroless nickel/gold), PCB finish Immersion Tin, PCB finish Immersion Silver, PCB finish OSP, HDI-PCB, SMT assembly, DIP/THT soldering
- Certificates
- ISO 9001, IATF 16949, IPC TM-650 (test standard application), UL, RoHS, IPC TM-650
- Industries
- Medical technology, Automotive, Aerospace, Telecommunications, Industrial control technology, Consumer electronics
- 01
Online quotation and file upload
- 02
DFM review / file check
- 03
Component sourcing
- 04
PCB manufacturing / provision
- 05
Solder paste printing (screen printing/dispensing)
- 06
SMT assembly
- 07
Reflow/wave/THT soldering
- 08
AOI, 3D SPI and X-ray inspection
- 09
Flying probe/ICT testing
- 10
Final assembly (PCBA)
- 11
Testing and delivery
Materials & Processes
SMT assembly
Automated placement of the finest components (01005, 0201, BGA, CSP) for small and medium series.
DIP/THT soldering
Wave soldering, rework and manual soldering for through-hole components.
HDI assembly
High-density assembly of HDI boards including 0.4 mm pitch BGA and underfill.
PCB finish ENIG
Electroless nickel/gold as a surface-protected, solderable PCB finish.
Immersion Tin
Tin final finish for solderable PCBs.
Immersion Silver
Silver final finish for solderable PCBs.
OSP
Organic protective coating as a lead-free finish for PCBs.
PCB manufacturing
PCB prototypes, board copying (抄板) and series production.
Locations
Hangzhou
CNSMT and electronics manufacturing (headquarters)
- Lot size
- Prototype to medium series
- Materials
- PCB, SMD/THT components
- Printing machine (solder paste printing)
- SMT placement machines
- Reflow ovens
- Wave soldering system
- X-ray inspection system
- AOI system
- 3D SPI system
Components
Industries
Processes & technical limits
| Processes | Tolerance | Max. part | Weight | Lot size | Materials |
|---|---|---|---|---|---|
| SMT placement assembly (01005, 0201, BGA, CSP placement)Assembly | – | – | – | Small batches/samples – Small to medium batches | PCB, Electronic components |
| Reflow solderingJoining | – | – | – | – | PCB, SMD components, Solder Paste |
| Wave solderingJoining | – | – | – | – | PCB, THT components |
| DIP soldering / post-insertion soldering (THT soldering)Joining | – | – | – | – | PCB, THT components |
| Manual solderingJoining | – | – | – | – | PCB |
| Solder paste printing (screen printing/dispensing)Assembly | – | – | – | – | Solder Paste, PCB |
| HDI high-density assembly (0.4mm pitch BGA, underfill)Assembly | 0.4mm Pitch | – | – | – | HDI-PCB, BGA |
| Finished product assembly (PCBA final assembly)Assembly | – | – | – | – | PCBA |
| Custom PCB manufacturing (rapid prototyping, series production, board copying)Engineering | – | – | – | Samples – Series production | PCB (ENIG, immersion tin, immersion silver, OSP finishes) |
| Component sourcing (procurement)Engineering | – | – | – | – | – |
| AOI optical inspectionTesting | – | – | – | – | – |
| X-ray inspectionTesting | – | – | – | – | – |
| 3D solder paste inspection (SPI)Testing | – | – | – | – | – |
| Flying probe testing / ICT bed-of-nails testingTesting | – | – | – | – | – |
| DFM review (design for manufacturability review)Engineering | – | – | – | – | – |
| Electronic design (design services)Engineering | – | – | – | – | – |
7 Anlagen & Maschinen
| Machine | Manufacturer / model | Quantity | Working area | Year built | Site |
|---|---|---|---|---|---|
| Printing machine (screen printing/solder paste printer) | – | – | – | – | 杭州 |
| Placement machine (SMT pick & place) | – | – | – | – | 杭州 |
| Reflow ovens | – | – | – | – | 杭州 |
| Wave soldering system | – | – | – | – | 杭州 |
| X-ray inspection system | – | – | – | – | 杭州 |
| AOI system (automated optical inspection) | – | – | – | – | 杭州 |
| 3D SPI system (3D solder paste inspection) | – | – | – | – | 杭州 |
Additional services
Reference customers
Quality
Quality assurance includes 3D SPI, AOI and X-ray inspection as well as flying probe and ICT testing; according to the customer (Squarp Instruments), every PCB is tested before delivery. In addition, the company offers a free DFM review.
| Evidence | Hangzhou |
|---|---|
| ISO 9001 | |
| IATF 16949 | |
| IPC TM-650 | |
| UL | |
| RoHS |
History
- ca. 2006
The website cites '14 years of experience in domestic and international electronics contract manufacturing' as well as 'focus on electronics manufacturing for over 10 years' (as of approx. 2020).